A high voltage resistor arrangement has a rod-shaped supporting substrate made of electrically insulating material and a plurality of individual resistors and/or discrete capacitors spaced apart from each other in the longitudinal direction of the supporting substrate, wherein at least one conductive path extending in the longitudinal direction of the supporting substrate is formed on the supporting substrate which is galvanically connected to the individual resistors and/or discrete capacitors, and wherein the individual resistors and/or discrete capacitors are realized as SMD components soldered directly onto the supporting substrate by means of solder pads.

A PTC thermistor switch for electric motors includes an insulating casing and a PTC thermistor housed in a housing seat made in the insulating casing. The PTC thermistor has a first face and a second face opposite the first face. A first electric terminal is housed in the insulating casing and has two protrusions in direct contact with the first face of the PTC thermistor in two opposite contact points with respect to the center of the first face. The switch also includes a second electric terminal housed in the insulating casing and an elastic arm portion in direct contact with the second face of the PTC thermistor in an intermediate contact point between the contact points of the protrusions. The second electric terminal is arranged so that the elastic arm portion presses against the second face of the PTC thermistor.

An electric component with a fail safe element is disclosed. In an embodiment a component includes a functional element and a fail safe element electrically interconnected therewith, wherein the fail safe element is configured to ensure a minimum resistance or a minimum conductivity of the component in the event of a failure of the functional element.

A chip resistor with a reduced thickness is provided. The chip resistor includes an insulating substrate, a resistor embedded in the substrate, a first electrode electrically connected to the resistor, and a second electrode electrically connected to the resistor. The first electrode and the second electrode are spaced apart from each other in a lateral direction that is perpendicular to the thickness direction of the substrate.

A chip resistor with a reduced thickness is provided. The chip resistor includes an insulating substrate, a resistor embedded in the substrate, a first electrode electrically connected to the resistor, and a second electrode electrically connected to the resistor. The first electrode and the second electrode are spaced apart from each other in a lateral direction that is perpendicular to the thickness direction of the substrate.

The heat generating apparatus according to the present invention includes: a positive temperature coefficient thermistor heat generating element including an electrode layer; a first electrode terminal; a second electrode terminal; a holder configured to house the positive temperature coefficient thermistor heating generating element; and a heat conductive sheet, in which the heat conductive sheet includes a graphite particle and a polymer compound, a major axis direction of the graphite particle is substantially orthogonal to the surface of the positive temperature coefficient thermistor heat generating element, and the positive temperature coefficient thermistor heat generating element and the holder are assembled in a state in which they are biased so as to apply pressure to the heat conductive sheet.

The heat generating apparatus according to the present invention includes: a positive temperature coefficient thermistor heat generating element including an electrode layer; a first electrode terminal; a second electrode terminal; a holder configured to house the positive temperature coefficient thermistor heating generating element; and a heat conductive sheet, in which the heat conductive sheet includes a graphite particle and a polymer compound, a major axis direction of the graphite particle is substantially orthogonal to the surface of the positive temperature coefficient thermistor heat generating element, and the positive temperature coefficient thermistor heat generating element and the holder are assembled in a state in which they are biased so as to apply pressure to the heat conductive sheet.

An insulating sheet and a conductive terminal are provided in an electronic component, where at least one of the conductive terminals has a missing part, and where a remaining part positioned on both ends of the missing part is connected through a resistor element affixed to the insulating sheet.

A chip resistor with a reduced thickness is provided. The chip resistor includes an insulating substrate, a resistor embedded in the substrate, a first electrode electrically connected to the resistor, and a second electrode electrically connected to the resistor. The first electrode and the second electrode are spaced apart from each other in a lateral direction that is perpendicular to the thickness direction of the substrate.

A chip resistor with a reduced thickness is provided. The chip resistor includes an insulating substrate, a resistor embedded in the substrate, a first electrode electrically connected to the resistor, and a second electrode electrically connected to the resistor. The first electrode and the second electrode are spaced apart from each other in a lateral direction that is perpendicular to the thickness direction of the substrate.