Apparatus having means for cooling a current limiting thermistor which includes an elongated power cord first and second power conductors connected to respective male and female connectors at the axial extremities thereof and a thermistor disposed in series with at least one of the first and second power conductors, potting compound surrounding an axial part of said first and second power conductors as well as the thermistor. The apparatus further includes an elongated sleeve shaped heat exchanger dimensioned and configured with a central bore for thermal contact with the exterior of the potting compound. The heat exchanger has a plurality of fins disposed substantially in mutually parallel relationship as well as in substantially parallel relationship to an axial part of the first and second power conductors.

Apparatus having means for cooling a current limiting thermistor which includes an elongated power cord first and second power conductors connected to respective male and female connectors at the axial extremities thereof and a thermistor disposed in series with at least one of the first and second power conductors, potting compound surrounding an axial part of said first and second power conductors as well as the thermistor. The apparatus further includes an elongated sleeve shaped heat exchanger dimensioned and configured with a central bore for thermal contact with the exterior of the potting compound. The heat exchanger has a plurality of fins disposed substantially in mutually parallel relationship as well as in substantially parallel relationship to an axial part of the first and second power conductors.

A method of making an electronic device may include forming at least one circuit layer that includes solder pads on a substrate and forming at least one liquid crystal polymer (LCP) solder mask having mask openings therein. The method may also include forming at least one thin film resistor on the LCP solder mask and coupling the at least one LCP solder mask to the substrate so that the at least one thin film resistor is coupled to the at least one circuit layer and so that the solder pads are aligned with the mask openings.

A ceramic electronic component includes an electronic component body and portions of first and second metal terminals defined by lead wires covered with an outer resin material. The first metal terminal includes, connected in order, a first terminal joint portion, a first extension portion extending in a direction toward a mounting surface, and a first mount portion extending toward a side opposite to the electronic component body. The second metal terminal includes, connected in order, a second terminal joint portion, a second extension portion extending in the direction toward the mounting surface, and a second mount portion extending toward a side opposite to the electronic component body. The first and second mount portions respectively include first and second protruding bending portions protruding toward the mounting surface. The outer resin material includes a protruding portion protruding toward the mounting surface.

A ceramic electronic component includes an electronic component body and portions of first and second metal terminals defined by lead wires covered with an outer resin material. The first metal terminal includes, connected in order, a first terminal joint portion, a first extension portion extending in a direction toward a mounting surface, and a first mount portion extending toward a side opposite to the electronic component body. The second metal terminal includes, connected in order, a second terminal joint portion, a second extension portion extending in the direction toward the mounting surface, and a second mount portion extending toward a side opposite to the electronic component body. The first and second mount portions respectively include first and second protruding bending portions protruding toward the mounting surface. The outer resin material includes a protruding portion protruding toward the mounting surface.

A heating and/or cooling device for a solid or for a fluid stream includes a carrier part formed of plastic, in which an electrical heating and/or cooling element is embedded and held. A metallic distributor element is in contact with the heating and/or cooling element. At least one terminal contact and an electrical strip conductor, which connects the terminal contact to the heating and/or cooling element, are provided. The heating and/or cooling element are prefabricated and are connected to the carrier part formed of plastic by an injection molding process. Electrical strip conductors are prepared for connecting the heating and cooling element by a metal injection molding process or metal casting process.

A heating and/or cooling device for a solid or for a fluid stream includes a carrier part formed of plastic, in which an electrical heating and/or cooling element is embedded and held. A metallic distributor element is in contact with the heating and/or cooling element. At least one terminal contact and an electrical strip conductor, which connects the terminal contact to the heating and/or cooling element, are provided. The heating and/or cooling element are prefabricated and are connected to the carrier part formed of plastic by an injection molding process. Electrical strip conductors are prepared for connecting the heating and cooling element by a metal injection molding process or metal casting process.

A force sensitive resistor includes first and second electrical contacts, and a layer of deformable material impregnated with carbon nanotubes. The layer of deformable material is arranged between the first and second electrical contacts. A difference in the conductivity of the impregnated material caused by deformation of the material is detectable across the contacts. A method of manufacturing a force sensitive resistor includes the steps of providing first and second electrical contacts, and arranging a deformable material impregnated with carbon nanotubes between the first and second electrical contacts. Again, a difference in the conductivity of the impregnated material caused by deformation of the material is detectable across the contacts

An overvoltage protection device module includes an electrically conductive first electrode, an electrically conductive housing electrode, and a varistor member formed of a varistor material and electrically connected between the first electrode and the housing electrode. The housing electrode includes a housing end wall and a housing side wall collectively defining a housing cavity, and first and second housing members joined together at a joint. The first housing member forms a first portion of the housing side wall and the second housing member forms a second portion of the housing side wall. The varistor member is disposed in the housing cavity.

A chip resistor includes: an insulating substrate; a pair of front electrodes; a resistor connecting between both the front electrodes; an undercoat layer provided on the resistor; an overcoat layer provided on the undercoat layer, an auxiliary film provided so as to be over a connecting portion between the front electrode and the resistor at a position away from an end face of the insulating substrate; a pair of end face electrodes; and a pair of external plating layers covering the end face electrodes, the front electrodes, and the auxiliary film, wherein the auxiliary film is formed of a resin material containing metal particles, and a portion of the auxiliary film is sandwiched between the undercoat layer and the overcoat layer.