A resistor includes a resistive element, a first resin substrate on an upper surface of the resistive element and having a high thermal conductivity, a first heat radiator plate made of metal provided on an upper surface of the first resin substrate, a second heat radiator plate made of metal provided on the upper surface of the first resin substrate, a first edge-surface electrode provided on the first edge surface of the resistive element and connected to the first heat radiator plate, and a second edge-surface electrode provided on the second edge surface of the resistive element and connected to the second heat radiator plate.

A chip resistor includes an insulating substrate, a resistive element provided on an upper surface of the insulating substrate, a pair of upper-surface electrodes provided on respective ones of both end portions of an upper surface of the resistive element so as to expose a part of the upper surface of the resistive element from the upper-surface electrodes, and a protective layer that covers the part of the resistive element and that does not cover the pair of upper-surface electrodes. The pair of upper-surface electrodes have exposed upper surfaces and exposed edge surfaces, respectively. Each of the edge surfaces of the pair of upper-surface electrodes does not project outward from respective one of the edge surfaces of the insulating substrate. The chip resistor can reduce a temperature coefficient of resistance to improve the temperature coefficient of resistance.

A chip resistor includes an insulating substrate, a resistive element provided on an upper surface of the insulating substrate, a pair of upper-surface electrodes provided on respective ones of both end portions of an upper surface of the resistive element so as to expose a part of the upper surface of the resistive element from the upper-surface electrodes, and a protective layer that covers the part of the resistive element and that does not cover the pair of upper-surface electrodes. The pair of upper-surface electrodes have exposed upper surfaces and exposed edge surfaces, respectively. Each of the edge surfaces of the pair of upper-surface electrodes does not project outward from respective one of the edge surfaces of the insulating substrate. The chip resistor can reduce a temperature coefficient of resistance to improve the temperature coefficient of resistance.

The invention relates to a method of manufacturing an element sensitive to at least one physical parameter of a flow of fluid, comprising a step consisting in a single cycle of immersing, in molten glass, a core of a preassembled sensitive element, said core comprising at least two longitudinal channels along which there pass longitudinally at least two conducting connecting wires which are connected to an at least two-wire winding, said winding being suited to forming a resistive or inductive circuit for detecting said physical parameter, said immersion allowing the connecting wires to be sealed into the channels, allowing said channels to be filled and allowing the outside of the core to be coated in a single immersion, the core, at the end of said single immersion cycle, being sealed and coated in such a way as to obtain an assembled sensitive element. Advantageously, the winding may be corkscrew wound inside the longitudinal channels, immersion allowing the connecting wires to be held on the winding and controlling the space between the turns of the winding.

The invention relates to a method of manufacturing an element sensitive to at least one physical parameter of a flow of fluid, comprising a step consisting in a single cycle of immersing, in molten glass, a core of a preassembled sensitive element, said core comprising at least two longitudinal channels along which there pass longitudinally at least two conducting connecting wires which are connected to an at least two-wire winding, said winding being suited to forming a resistive or inductive circuit for detecting said physical parameter, said immersion allowing the connecting wires to be sealed into the channels, allowing said channels to be filled and allowing the outside of the core to be coated in a single immersion, the core, at the end of said single immersion cycle, being sealed and coated in such a way as to obtain an assembled sensitive element. Advantageously, the winding may be corkscrew wound inside the longitudinal channels, immersion allowing the connecting wires to be held on the winding and controlling the space between the turns of the winding.

The resistor includes a chip resistive element which includes a resistive element and metal electrodes and which is formed on first surface of a ceramic substrate, metal terminals electrically joined to the metal electrodes, and an Al member formed on the second surface side of the ceramic substrate, wherein the ceramic substrate and the Al member are joined using an AlSi-based brazing filler metal, the metal electrodes and the metal terminals are joined to each other using a solder, and a degree of bending of an opposite surface of the Al member opposite to a surface on the ceramic substrate side is in a range of 30 m/50 mm to 700 m/50 mm.

A chip resistance element includes a base substrate having a first surface and a second surface opposing each other, two sides connecting the first surface and the second surface to each other, and two end surfaces connecting the first surface and the second surface to each other; a resistive layer disposed on the second surface; and a first terminal, a second terminal, and a third terminal disposed to be respectively connected to the resistive layer and to be separated from each other on the second surface. The third terminal having a second surface portion disposed between the first terminal and the second terminal on the second surface and a side portion connected to and disposed on one of the two sides of the base substrate.

The present disclosure provides embodiments of power distribution system components, such as arresters, isolators, bushings, and fuses that include one or more end caps that have predefined heat resistant characteristics that can withstand high temperatures without melting, flowing or generating sparks when subject to such high temperatures.

An object is to provide a chip resistor capable of coping with high power. A chip resistor of the present disclosure includes insulating substrate, a pair of electrodes, and resistance member. A pair of electrodes are provided at both ends of the upper face of insulating substrate. Resistance member is provided on insulating substrate and connected to the pair of electrodes. Insulating substrate has first region in the center thereof and second regions at both ends of first region. Recess is provided in first region of insulating substrate. Resistance member formed in first region has a meandering shape in a top view. At least a part of resistance member is embedded in recess. Trimming groove is provided in resistance member formed in second region.

Provided is a surface mount resistor that can be stably mounted without the need for lead wires to be to flattened. The surface mount resistor includes a first resistive element and a second resistive element arranged in parallel, the first resistive element having first lead wires at opposite ends thereof, and the second resistive element having second lead wires at opposite ends thereof. The first resistive element and the second resistive element are integrated by being covered with a sheath. The first lead wires and the second lead wires are arranged such that they protrude outward in a direction of an axis beyond the sheath. The first lead wires and the second lead wires are bent alongside surfaces and a bottom surface of the sheath.