A resistor includes a resistive element, a first resin substrate on an upper surface of the resistive element and having a high thermal conductivity, a first heat radiator plate made of metal provided on an upper surface of the first resin substrate, a second heat radiator plate made of metal provided on the upper surface of the first resin substrate, a first edge-surface electrode provided on the first edge surface of the resistive element and connected to the first heat radiator plate, and a second edge-surface electrode provided on the second edge surface of the resistive element and connected to the second heat radiator plate.

A resistor includes a resistive element, a first resin substrate on an upper surface of the resistive element and having a high thermal conductivity, a first heat radiator plate made of metal provided on an upper surface of the first resin substrate, a second heat radiator plate made of metal provided on the upper surface of the first resin substrate, a first edge-surface electrode provided on the first edge surface of the resistive element and connected to the first heat radiator plate, and a second edge-surface electrode provided on the second edge surface of the resistive element and connected to the second heat radiator plate.

A chip resistor with a reduced thickness is provided. The chip resistor includes an insulating substrate, a resistor embedded in the substrate, a first electrode electrically connected to the resistor, and a second electrode electrically connected to the resistor. The first electrode and the second electrode are spaced apart from each other in a lateral direction that is perpendicular to the thickness direction of the substrate.

A chip resistor with a reduced thickness is provided. The chip resistor includes an insulating substrate, a resistor embedded in the substrate, a first electrode electrically connected to the resistor, and a second electrode electrically connected to the resistor. The first electrode and the second electrode are spaced apart from each other in a lateral direction that is perpendicular to the thickness direction of the substrate.

According to some aspects of the present disclosure, a temperature sensor assembly includes a thermistor including a first lead and a second lead, and a nonconductive separator defining at least two channels, with the first lead positioned in a first one of the channels and the second lead positioned in a second one of the channels to electrically isolate the first lead from the second lead. The assembly also includes a cable including a first conductor wire and a second conductor wire, with the first conductor wire coupled to the first lead and the second conductor wire coupled to the second lead, and a tube at least partially enclosing the thermistor, the nonconductive separator, and at least a portion of the cable. Methods for connecting thermistors to cables are also disclosed.

A fluid permeable heater assembly for aerosol-generating systems includes an electrically conductive flat filament arrangement and a first contact point and a second contact point for electrically contacting the flat filament arrangement. A longitudinal axis is defined between the first contact point and the second contact point. A center resistance Rc is the electrical resistance between two points situated on the longitudinal axis. One of the two points is situated at a distance from the first contact point equal to about 40 percent and the other one of the two points being situated at a distance from the first contact point equal to about 60 percent.

A resistor is composed of a resistor body part and a molded resin in which the resistor body part is embedded. The molded resin includes a base resin and a filler that is higher in thermal conductivity than the base resin.

A resistor is composed of a resistor body part and a molded resin in which the resistor body part is embedded. The molded resin includes a base resin and a filler that is higher in thermal conductivity than the base resin.

To provide a wire-wound resistor provided with high reliability and that retains the basic functionality of the wire-wound resistor, and a method for manufacturing the same. A wire-wound resistor in which a resistor wire is wound onto an external periphery of a core (11) obtained by bundling fibrous insulators, and a connection terminal (13) is attached to both ends of the core (11) and connected to the resistor wire (12a), wherein the core (11) is impregnated with a binder in the portion (11a) in the vicinity of the external periphery. The binder (1) is preferably not included in a center portion (11b) of the core (11).

A resistance assembly for a mobile device and a manufacturing method thereof are disclosed. The resistance assembly for a mobile device in accordance with an aspect of the present invention includes: a substrate having a circuit formed thereon; first to fourth pads laminated and separated from one another on the substrate; first to fourth terminals connected to the first to fourth pads, respectively, by being formed in a longitudinal direction along edges of lateral surfaces of a resistance body that are opposite to each other; and first and second resistors formed in between the first to fourth terminals along the opposite lateral and connected in parallel to each other on the resistance body and configured to adjust electric current flowed into the circuit.