A method includes coating at least one conductive element of an electronic device with an electrically non-conductive thixotropic liquid. An electronic device includes a first layer including an upper conductive element, a second layer including a lower conductive element, and a spacer positioned between the layers. The first layer, the second layer, and the spacer define a sensing chamber in which the upper and lower conductive elements move to vary the resistance of the electronic device. A non-conductive thixotropic liquid is present within the sensing chamber. Movement of the layers toward each other displaces the thixotropic liquid from an initial state coating at least one of the conductive elements to permit contact between the conductive elements, and movement of the first layer and the second layer away from each other returns the thixotropic liquid to the initial state.

A chip resistor includes a substrate, two top electrodes, a resistor element, two back electrodes, and two side electrodes. The substrate has a top surface, a back surface and two side surface. The top and back surfaces face away in the thickness direction of the substrate. The side surfaces, spaced apart in a predetermined direction orthogonal to the thickness direction, are connected to the top and back surfaces. The top electrodes, spaced apart in the predetermined direction, are in contact with the top surface. The resistor element, disposed on the top surface, is connected to the top electrodes. The back electrodes, spaced apart in the predetermined direction, are in contact with the back surface. The side electrodes, held in contact with the side surfaces, are connected to the top and back electrodes. Each back electrode has a first and a second layer. The first layer is in contact with the back surface. The second layer, covering a part of the first layer, is made of a material containing metal particles and synthetic resin.

A chip resistor includes a substrate, two top electrodes, a resistor element, two back electrodes, and two side electrodes. The substrate has a top surface, a back surface and two side surface. The top and back surfaces face away in the thickness direction of the substrate. The side surfaces, spaced apart in a predetermined direction orthogonal to the thickness direction, are connected to the top and back surfaces. The top electrodes, spaced apart in the predetermined direction, are in contact with the top surface. The resistor element, disposed on the top surface, is connected to the top electrodes. The back electrodes, spaced apart in the predetermined direction, are in contact with the back surface. The side electrodes, held in contact with the side surfaces, are connected to the top and back electrodes. Each back electrode has a first and a second layer. The first layer is in contact with the back surface. The second layer, covering a part of the first layer, is made of a material containing metal particles and synthetic resin.

A resistor includes a first insulator, a resistive body, a second insulator, a pair of electrodes, and a covering body. The first insulator has a first obverse surface facing in a thickness direction thereof. The resistive body is provided on the first obverse surface. The second insulator covers the resistive body. The pair of electrodes are electrically connected to the resistive body at both sides in a first direction perpendicular to the thickness direction. The covering body is formed on at least one of the first insulator and the second insulator. The covering body has electrical conductivity. The first layer is in contact with at least one of the first insulator and the second insulator.

A resistor includes a resistor main body, and a resin portion covering the resistor main body. The resin portion includes a radiation fin.

A resistor component includes a substrate having a first surface and a second surface, opposing each other; an external electrode disposed outside of the substrate; a resistive layer disposed on the first surface of the substrate, connected to the external electrode, and including an alloy of a first metal and a second metal; and a first protective layer disposed on the resistive layer and including any one of the first and second metals.

The present invention is provided with a base electrode layer forming step of forming a base electrode layer on both surfaces of a thermistor wafer formed of a thermistor material, a chip forming step of obtaining a thermistor chip with a base electrode layer by cutting the thermistor wafer to form chips, a protective film forming step of forming a protective film formed of an oxide on an entire surface of the thermistor chip with a base electrode layer, a cover electrode layer forming step of forming a cover electrode layer by applying and sintering a conductive paste on an end surface of the thermistor chip with a base electrode layer, and a conduction heat treatment step of performing a heat treatment such that the base electrode layer and the cover electrode layer are electrically conductive, in which the electrode portion is formed.

A chip resistor includes a resistor body, a first upper surface electrode, a second upper surface electrode, and an upper surface protection film on an upper surface of a substrate. The upper surface protection film covers the entire surface of the resistor body and the entire surface of the first upper surface electrode and the second upper surface electrode. The upper surface protection film includes a peripheral portion that is entirely in contact with the upper surface of the substrate.

Systems for disconnecting a surge arrester. One embodiment provides a surge arrester comprising a housing, a connecting interface configured to connect to an electrical power grid, and a disconnector device coupled to the connecting interface. A metal oxide varistor stack is coupled to the disconnector device, and a ground side connection is coupled to the metal oxide varistor stack, the ground side connection configured to connect to a system ground. The disconnector device is configured to disconnect the connecting interface from the system ground based on a predetermined disconnection condition.

A chip resistor includes a resistor body, a first upper surface electrode, a second upper surface electrode, and an upper surface protection film on an upper surface of a substrate. The upper surface protection film covers the entire surface of the resistor body and the entire surface of the first upper surface electrode and the second upper surface electrode. The upper surface protection film includes a peripheral portion that is entirely in contact with the upper surface of the substrate.