An object is to provide a resistor manufacturing method and a resistor capable of suppressing variation in the thickness of a thermally conductive layer intervening between a resistive body and electrode plates. The method of manufacturing the resistor according to the present invention includes a step of forming an uncured first thermally conductive layer on a surface of a resistive body, a step of curing the first thermally conductive layer, a step of laminating an uncured second thermally conductive layer on a surface of the first thermally conductive layer, and a step of bending electrode plates respectively disposed at both sides of the resistive body, curing the second thermally conductive layer, and performing adhesion between the resistive body and the electrode plates via the first thermally conductive layer and the second thermally conductive layer.

A temperature sensor element includes: an element main body including a heat sensitive body including a thermistor sintered body of which the electrical characteristics change with temperature, and a pair of lead wires that is connected to the heat sensitive body through electrodes; and a protective layer that protects the heat sensitive body. The protective layer has an inner protective layer covering the heat sensitive body and an outer protective layer covering the outer side of the inner protective layer. The inner protective layer is formed of an aggregate of particles that are chemically stable with respect to the thermistor sintered body and made of non-metal.

A resistor includes a first insulator, a resistive body, a second insulator, a pair of electrodes, and a covering body. The first insulator has a first obverse surface facing in a thickness direction thereof. The resistive body is provided on the first obverse surface. The second insulator covers the resistive body. The pair of electrodes are electrically connected to the resistive body at both sides in a first direction perpendicular to the thickness direction. The covering body is formed on at least one of the first insulator and the second insulator. The covering body has electrical conductivity. The first layer is in contact with at least one of the first insulator and the second insulator.

After a sulfidation detection conductor (2) is formed on a front surface of a large-sized substrate (10A), a pair of first protective films (3) made of an insoluble material is formed, respectively, on predetermined positions of the sulfidation detection conductor (2), and a second protective film (7) made of a soluble material is formed so as to cover the sulfidation detection conductor (2) positioned between the pair of first protective films (3), and thereafter, end face electrodes (5) are formed, respectively, on divided faces of each strip-shaped substrate (10B) obtained by primarily dividing the large-sized substrate (10A). Then, after external electrodes (6) are formed by performing electrolytic plating with respect to each chip substrate (10C) obtained by secondarily dividing each strip-shaped substrate (10B), a sulfidation detection portion (2a) is exposed to the outside by removing the second protective film (7), whereby a sulfidation detection sensor (10) can be obtained.

The present invention is a load resistor that receives power transmitted from an apparatus and performs an energization test on the apparatus. The load resistor is characterized by comprising a rod-shaped resistive base body that is energized with the power and generates heat, a pipe-shaped protective member through which the rod-shaped resistive base body penetrates, and rod-shaped resistors having an insulation member that are packed in between the rod-shaped resistive base body and the protective member, the rod-shaped resistive base body having used therein a stretched nichrome wire that is wound in the shape of a coil.

The present invention is a load resistor that receives power transmitted from an apparatus and performs an energization test on the apparatus. The load resistor is characterized by comprising a rod-shaped resistive base body that is energized with the power and generates heat, a pipe-shaped protective member through which the rod-shaped resistive base body penetrates, and rod-shaped resistors having an insulation member that are packed in between the rod-shaped resistive base body and the protective member, the rod-shaped resistive base body having used therein a stretched nichrome wire that is wound in the shape of a coil.

A chip resistor component, includes: a substrate having one surface, and one side surface and the other side surface facing each other in one direction; an terminal including an internal electrode disposed on the one surface, and an external electrode disposed on the one side surface to be connected to the internal electrode; a resistive layer disposed on the one surface, and including an outermost pattern connected to the internal electrode; and a protective layer disposed on the one surface to cover the resistive layer. The outermost pattern of the resistive layer has a first region in contact with the internal electrode and a second region extending, in the one direction, from the first region towards the other side surface. A ratio of a length of the second region in the one direction to a length of the chip resistor component in the one direction is 0.02 or more.

Systems for disconnecting a surge arrester. One embodiment provides a surge arrester comprising a housing, a connecting interface configured to connect to an electrical power grid, and a disconnector device coupled to the connecting interface. A metal oxide varistor stack is coupled to the disconnector device, and a ground side connection is coupled to the metal oxide varistor stack, the ground side connection configured to connect to a system ground. The disconnector device is configured to disconnect the connecting interface from the system ground based on a predetermined disconnection condition.

The purpose of the present invention is to provide: a temperature sensor able not only to prevent failures where a temperature-sensitive sintered body ends up coming out of a protective case together with a packing resin, but also to curb changes in properties of the temperature-sensitive sintered body and ensure reliability; and a device provided with this temperature sensor. A temperature sensor (1) is provided with: a protective case (2) that has a linear expansion coefficient of 7.5 to 19.5×10.sup.−6/° C.; a temperature-sensitive sintered body (3) that is arranged inside the protective case (2); a lead wire (4) that is connected to the temperature-sensitive sintered body (3) and has a cross-sectional area of 0.097 mm.sup.2 or less; and a packing resin (6) that has a linear expansion coefficient of 7.5 to 19.5×10.sup.−6/° C. and that is packed around the temperature-sensitive sintered body (3) inside the protective case (2).

The purpose of the present invention is to provide: a temperature sensor able not only to prevent failures where a temperature-sensitive sintered body ends up coming out of a protective case together with a packing resin, but also to curb changes in properties of the temperature-sensitive sintered body and ensure reliability; and a device provided with this temperature sensor. A temperature sensor (1) is provided with: a protective case (2) that has a linear expansion coefficient of 7.5 to 19.5×10.sup.−6/° C.; a temperature-sensitive sintered body (3) that is arranged inside the protective case (2); a lead wire (4) that is connected to the temperature-sensitive sintered body (3) and has a cross-sectional area of 0.097 mm.sup.2 or less; and a packing resin (6) that has a linear expansion coefficient of 7.5 to 19.5×10.sup.−6/° C. and that is packed around the temperature-sensitive sintered body (3) inside the protective case (2).