Patent classifications
H01C1/032
ELECTRONIC COMPONENT
An electronic component of the present disclosure includes a first insulating layer that includes impurities, a thin film resistor formed on the first insulating layer, and a barrier layer that is formed in at least one part of a region between the thin film resistor and the first insulating layer and that obstructs transmission of the impurities. The first insulating layer includes a first surface and a concave portion that is hollowed with respect to the first surface, and the barrier layer may include a first part embedded in the concave portion and a second part formed along the first surface of the first insulating layer from an upper area of the first part.
ELECTRONIC COMPONENT
An electronic component of the present disclosure includes a first insulating layer that includes impurities, a thin film resistor formed on the first insulating layer, and a barrier layer that is formed in at least one part of a region between the thin film resistor and the first insulating layer and that obstructs transmission of the impurities. The first insulating layer includes a first surface and a concave portion that is hollowed with respect to the first surface, and the barrier layer may include a first part embedded in the concave portion and a second part formed along the first surface of the first insulating layer from an upper area of the first part.
TEMPERATURE SENSOR ELEMENT AND TEMPERATURE SENSOR
An object is to provide a temperature sensor element that can suppress a reduction reaction of a heat sensitive body, even after a long time usage in a strong reducing atmosphere.
A temperature sensor element 1 includes: a heat sensitive body 11 of which electric resistance changes according to a temperature; a first coating layer 20 that covers a periphery of the heat sensitive body 11; a pair of lead-out wires 15 and 15 that are connected to the heat sensitive body 11, and also are led out in penetration through the first coating layer 20, toward a rear end side; a second coating layer 25 that covers a periphery of the pair of lead-out wires 15 and 15 which are led out in penetration through the first coating layer 20; and a third coating layer 30 that covers peripheries of the first coating layer 20 and the second coating layer 25. The second coating layer 25 is formed of a mixture of glass and at least one of chromium oxide, manganese oxide, ruthenium oxide powder, iridium oxide powder and platinum oxide.
TEMPERATURE SENSOR ELEMENT AND TEMPERATURE SENSOR
An object is to provide a temperature sensor element that can suppress a reduction reaction of a heat sensitive body, even after a long time usage in a strong reducing atmosphere.
A temperature sensor element 1 includes: a heat sensitive body 11 of which electric resistance changes according to a temperature; a first coating layer 20 that covers a periphery of the heat sensitive body 11; a pair of lead-out wires 15 and 15 that are connected to the heat sensitive body 11, and also are led out in penetration through the first coating layer 20, toward a rear end side; a second coating layer 25 that covers a periphery of the pair of lead-out wires 15 and 15 which are led out in penetration through the first coating layer 20; and a third coating layer 30 that covers peripheries of the first coating layer 20 and the second coating layer 25. The second coating layer 25 is formed of a mixture of glass and at least one of chromium oxide, manganese oxide, ruthenium oxide powder, iridium oxide powder and platinum oxide.
CHIP RESISTOR AND METHOD FOR MANUFACTURING SAME
A chip resistor includes an insulating substrate, a resistive element provided on an upper surface of the insulating substrate, a pair of upper-surface electrodes provided on respective ones of both end portions of an upper surface of the resistive element so as to expose a part of the upper surface of the resistive element from the upper-surface electrodes, and a protective layer that covers the part of the resistive element and that does not cover the pair of upper-surface electrodes. The pair of upper-surface electrodes have exposed upper surfaces and exposed edge surfaces, respectively. Each of the edge surfaces of the pair of upper-surface electrodes does not project outward from respective one of the edge surfaces of the insulating substrate. The chip resistor can reduce a temperature coefficient of resistance to improve the temperature coefficient of resistance.
CHIP RESISTOR AND METHOD FOR MANUFACTURING SAME
A chip resistor includes an insulating substrate, a resistive element provided on an upper surface of the insulating substrate, a pair of upper-surface electrodes provided on respective ones of both end portions of an upper surface of the resistive element so as to expose a part of the upper surface of the resistive element from the upper-surface electrodes, and a protective layer that covers the part of the resistive element and that does not cover the pair of upper-surface electrodes. The pair of upper-surface electrodes have exposed upper surfaces and exposed edge surfaces, respectively. Each of the edge surfaces of the pair of upper-surface electrodes does not project outward from respective one of the edge surfaces of the insulating substrate. The chip resistor can reduce a temperature coefficient of resistance to improve the temperature coefficient of resistance.
TEMPERATURE SENSOR ELEMENT AND TEMPERATURE SENSOR
[Solution] A temperature sensor element 1 according to the present invention includes: a heat sensitive body 11 of which electric resistance changes according to a temperature; a first coating layer 20 that covers a periphery of the heat sensitive body 11; a pair of lead-out wires 15 and 15 that are connected to the heat sensitive body 11 and also are led out in penetration through the first coating layer 20, toward a rear end side; a second coating layer 25 that covers a periphery of the pair of lead-out wires 15 and 15 which are led out in penetration through the first coating layer 20; and a third coating layer 30 that covers peripheries of the first coating layer 20 and the second coating layers 25 and 27. In the temperature sensor element 1, the second coating layer 25 is formed from a mixture of an oxygen-supplying oxide and glass.
TEMPERATURE SENSOR ELEMENT AND TEMPERATURE SENSOR
[Solution] A temperature sensor element 1 according to the present invention includes: a heat sensitive body 11 of which electric resistance changes according to a temperature; a first coating layer 20 that covers a periphery of the heat sensitive body 11; a pair of lead-out wires 15 and 15 that are connected to the heat sensitive body 11 and also are led out in penetration through the first coating layer 20, toward a rear end side; a second coating layer 25 that covers a periphery of the pair of lead-out wires 15 and 15 which are led out in penetration through the first coating layer 20; and a third coating layer 30 that covers peripheries of the first coating layer 20 and the second coating layers 25 and 27. In the temperature sensor element 1, the second coating layer 25 is formed from a mixture of an oxygen-supplying oxide and glass.
Temperature sensor element and method for manufacturing temperature sensor element
A temperature sensor element includes: an element main body including a heat sensitive body including a thermistor sintered body of which the electrical characteristics change with temperature, and a pair of lead wires that is connected to the heat sensitive body through electrodes; and a protective layer that protects the heat sensitive body. The protective layer has an inner protective layer covering the heat sensitive body and an outer protective layer covering the outer side of the inner protective layer. The inner protective layer is formed of an aggregate of particles that are chemically stable with respect to the thermistor sintered body and made of non-metal.
Temperature sensor element and method for manufacturing temperature sensor element
A temperature sensor element includes: an element main body including a heat sensitive body including a thermistor sintered body of which the electrical characteristics change with temperature, and a pair of lead wires that is connected to the heat sensitive body through electrodes; and a protective layer that protects the heat sensitive body. The protective layer has an inner protective layer covering the heat sensitive body and an outer protective layer covering the outer side of the inner protective layer. The inner protective layer is formed of an aggregate of particles that are chemically stable with respect to the thermistor sintered body and made of non-metal.