A temperature sensor includes: a thermistor; first and second lead-out wires, each having a front end connected to the thermistor; a glass body for sealing the thermistor and a front end portion of each of the first and second lead-out wires; first and second lead wires having respective front ends connected to rear ends of the first and second lead-out wires, respectively; and a synthetic resin cover layer formed of a laminate of an inner layer and a tubular outer layer. The tubular outer layer covers the glass body such that the glass body is in direct contact with an inner surface of the tubular outer layer. The inner layer covers: (i) the first and second lead-out wires except for the front end portions thereof; and (ii) a front end portion of each of the first and second lead wires.

An electronic component of the present disclosure includes a first insulating layer that includes impurities, a thin film resistor formed on the first insulating layer, and a barrier layer that is formed in at least one part of a region between the thin film resistor and the first insulating layer and that obstructs transmission of the impurities. The first insulating layer includes a first surface and a concave portion that is hollowed with respect to the first surface, and the barrier layer may include a first part embedded in the concave portion and a second part formed along the first surface of the first insulating layer from an upper area of the first part.

An electronic component of the present disclosure includes a first insulating layer that includes impurities, a thin film resistor formed on the first insulating layer, and a barrier layer that is formed in at least one part of a region between the thin film resistor and the first insulating layer and that obstructs transmission of the impurities. The first insulating layer includes a first surface and a concave portion that is hollowed with respect to the first surface, and the barrier layer may include a first part embedded in the concave portion and a second part formed along the first surface of the first insulating layer from an upper area of the first part.

In one embodiment a varistor may include a ceramic body. The varistor may further comprise a multilayer coating disposed around the ceramic body. The multilayer coating may include an outer layer comprising an epoxy material. The multilayer coating may also include an inner layer that is adjacent the ceramic body and is disposed between the outer layer and the ceramic body. The inner layer may comprise a polymeric material that is composed of an acrylic component.

An epoxy-based resin system composition includes a latent functionality for polymer adhesion improvement. The composition may be used to produce an overcoat layer and/or protection layer in an anti-sulfur resistor (ASR). In some embodiments, the composition include epoxy-based resin(s), hardener(s) and, optionally, blowing agent(s) and/or filler(s). An epoxide functionality of one or more of the epoxy-based resin(s) and a reactive functionality of one or more of the hardener(s) react with each other at a first temperature. The latent functionality, which does not react at the first temperature, is contained in at least one of the epoxy-based resin(s), hardener(s) and filler(s) and reacts in response to another stimulus (e.g., UV light/initiator and/or a second temperature greater than the first temperature) to enhance chemical bonding. Optionally, voids created via etching and/or the blowing agent(s) may be used to enhance mechanical bonding, alone, or in combination with filler(s) exposed in the voids.

An epoxy-based resin system composition includes a latent functionality for polymer adhesion improvement. The composition may be used to produce an overcoat layer and/or protection layer in an anti-sulfur resistor (ASR). In some embodiments, the composition include epoxy-based resin(s), hardener(s) and, optionally, blowing agent(s) and/or filler(s). An epoxide functionality of one or more of the epoxy-based resin(s) and a reactive functionality of one or more of the hardener(s) react with each other at a first temperature. The latent functionality, which does not react at the first temperature, is contained in at least one of the epoxy-based resin(s), hardener(s) and filler(s) and reacts in response to another stimulus (e.g., UV light/initiator and/or a second temperature greater than the first temperature) to enhance chemical bonding. Optionally, voids created via etching and/or the blowing agent(s) may be used to enhance mechanical bonding, alone, or in combination with filler(s) exposed in the voids.

Resistors and a method of manufacturing resistors are described herein. A resistor includes a resistive element and a plurality of conductive elements. The plurality of conductive elements are electrically insulated from one another via a dielectric material and thermally coupled to the resistive element via an adhesive material disposed between each of the plurality of conductive elements and a surface of the resistive element. The plurality of conductive elements is coupled to the resistive element via conductive layers and solderable layers.

Resistors and a method of manufacturing resistors are described herein. A resistor includes a resistive element and a plurality of conductive elements. The plurality of conductive elements are electrically insulated from one another via a dielectric material and thermally coupled to the resistive element via an adhesive material disposed between each of the plurality of conductive elements and a surface of the resistive element. The plurality of conductive elements is coupled to the resistive element via conductive layers and solderable layers.

A solid dielectric surge arrester includes a hermetically sealed composite encased module assembly. The module assembly includes at least one metal oxide varistor (MOV) block with an outer circumferential surface, and a material applied to the outer circumferential surface. The material includes multiple layers to allow the module assembly to withstand a bending moment under long term cyclic load and short term rated bending load, the material is configured to improved bending strengths, and provide safe short circuit failure mode venting in a preferential direction or directions.

A solid dielectric surge arrester includes a hermetically sealed composite encased module assembly. The module assembly includes at least one metal oxide varistor (MOV) block with an outer circumferential surface, and a material applied to the outer circumferential surface. The material includes multiple layers to allow the module assembly to withstand a bending moment under long term cyclic load and short term rated bending load, the material is configured to improved bending strengths, and provide safe short circuit failure mode venting in a preferential direction or directions.