A resistor is provided with a resistance body and a pair of electrodes connected to the resistance body (a first electrode body, a second electrode body), the resistance body being arranged so as to be at least separated away from a substrate board (a circuit board) when mounted on the substrate board (the circuit board), wherein the resistor has the oxide film on at least one of the resistance body and each of the electrodes (the first electrode body, the second electrode body) at a boundary portion (a bonded portion, a bonded portion) between the resistance body and each of the electrodes (the first electrode body, the second electrode body) on the mounting surface of the resistor.

An electronic component includes a base body including a plurality of voids, a protective material covering a part or a whole of an outer surface of the base body, and an external electrode covering a part of an outer surface of the protective material. The protective material is glass containing a silane compound having a carbon chain with 3 or more carbon atoms. The protective material includes a filling portion occupying at least some of the voids, and a film portion covering the outer surface of the base body.

An electronic component includes a base body including a plurality of voids, a protective material covering a part or a whole of an outer surface of the base body, and an external electrode covering a part of an outer surface of the protective material. The protective material is glass containing a silane compound having a carbon chain with 3 or more carbon atoms. The protective material includes a filling portion occupying at least some of the voids, and a film portion covering the outer surface of the base body.

An electronic component includes a base body and an alumina film covering an outer surface of the base body. The alumina film includes a film-shaped part made of alumina and in contact with the outer surface of the base body, and a particle layer located on the outer surface side of the film-shaped part. The particle layer includes a plurality of alumina particles bonded to the outer surface of the film-shaped part. The average value of the thicknesses of the alumina film including the film-shaped part and the particle layer is 0.05 m or more and 2.0 m or less. The interval between the particles is 1.3 m or less.

An electronic component includes a base body and an alumina film covering an outer surface of the base body. The alumina film includes a film-shaped part made of alumina and in contact with the outer surface of the base body, and a particle layer located on the outer surface side of the film-shaped part. The particle layer includes a plurality of alumina particles bonded to the outer surface of the film-shaped part. The average value of the thicknesses of the alumina film including the film-shaped part and the particle layer is 0.05 m or more and 2.0 m or less. The interval between the particles is 1.3 m or less.

A three-dimensional electrode for a reflowable PTC device is provided. The three-dimensional electrode can include a planar portion for connecting with a PTC material on a top surface thereof or a bottom surface thereof, at least one expander portion electrically and physically connected with and perpendicular with the planar portion, and one or more terminals electrically and physically connected with the at least one expander portion, wherein the at least one expander portion can vertically or horizontally offset the one or more terminals from the planar portion.

A three-dimensional electrode for a reflowable PTC device is provided. The three-dimensional electrode can include a planar portion for connecting with a PTC material on a top surface thereof or a bottom surface thereof, at least one expander portion electrically and physically connected with and perpendicular with the planar portion, and one or more terminals electrically and physically connected with the at least one expander portion, wherein the at least one expander portion can vertically or horizontally offset the one or more terminals from the planar portion.

A resistor includes a resistor main body, and a resin portion covering the resistor main body. The resin portion includes a radiation fin.

A surface-modified glass that includes glass containing at least one multivalent metal ion; and a silicate film on a surface of the glass, the silicate film containing a multivalent metal ion in common with that of the glass.

A method of manufacturing a metal oxide varistor (MOV), the method including placing a quantity of a MOV composition in a pressing die, the MOV composition including metal oxide granules mixed with a polyaniline-polymer, performing a pressing operation including operating the pressing die to compress the MOV composition into a solid MOV chip, and applying first and second electrodes to opposing first and second sides of the MOV chip, wherein the pressing operation is performed at a temperature in a range of 15 degrees Celsius to 200 degrees Celsius.