Provided is a chip resistor including: a rectangular parallelepiped insulating substrate 1 which is made of ceramics; a pair of front electrodes 2 which are provided on lengthwise opposite end portions in a front surface of the insulating substrate 1; a resistive element 3 which is provided between and connected to the two front electrodes 2; an insulating protective layer 4 which covers the whole of the front surface of the insulating substrate 1 including the resistive element 3 and the two front electrodes 2; and a pair of cap-shaped end-surface electrodes 5 which are provided on the lengthwise opposite end portions of the insulating substrate 1 to be connected to the front electrodes 2; wherein: the protective layer 4 is formed out of a semi-transparent resin material which is similar in color to the insulating substrate 1.

Provided is a chip resistor including: a rectangular parallelepiped insulating substrate 1 which is made of ceramics; a pair of front electrodes 2 which are provided on lengthwise opposite end portions in a front surface of the insulating substrate 1; a resistive element 3 which is provided between and connected to the two front electrodes 2; an insulating protective layer 4 which covers the whole of the front surface of the insulating substrate 1 including the resistive element 3 and the two front electrodes 2; and a pair of cap-shaped end-surface electrodes 5 which are provided on the lengthwise opposite end portions of the insulating substrate 1 to be connected to the front electrodes 2; wherein: the protective layer 4 is formed out of a semi-transparent resin material which is similar in color to the insulating substrate 1.

Provided is a surface-mountable thin film resistor network, which includes a chip, on which a thin film resistor network integrated array is formed, and a molded resin package, which encapsulate the chip. The surface-mountable thin film resistor network is provided with a chip (13) on which a thin film resistor integrated array has been formed; an island (12) on which the chip is fixed; a plurality of lead terminals (14) extending outward around periphery of the island; wires (15) connecting electrodes of resistors mounted on the chip to the lead terminals; and a molded resin package (20) that encapsulate a portion, which includes the wires; wherein a hanging lead (18) extending from the island is cut at an end surface of the molded resin package, and an electrical insulation (21) is applied to the cut section of the hanging lead.

Provided is a surface-mountable thin film resistor network, which includes a chip, on which a thin film resistor network integrated array is formed, and a molded resin package, which encapsulate the chip. The surface-mountable thin film resistor network is provided with a chip (13) on which a thin film resistor integrated array has been formed; an island (12) on which the chip is fixed; a plurality of lead terminals (14) extending outward around periphery of the island; wires (15) connecting electrodes of resistors mounted on the chip to the lead terminals; and a molded resin package (20) that encapsulate a portion, which includes the wires; wherein a hanging lead (18) extending from the island is cut at an end surface of the molded resin package, and an electrical insulation (21) is applied to the cut section of the hanging lead.

A paste for forming a resist layer of a resistor includes: a copper-based alloy powder; and nickel (Ni) powder in an amount greater than 0 wt % of the copper-based alloy powder and less than or equal to 10 wt % of the copper-based alloy powder, wherein the paste is glass-free.

A paste for forming a resist layer of a resistor includes: a copper-based alloy powder; and nickel (Ni) powder in an amount greater than 0 wt % of the copper-based alloy powder and less than or equal to 10 wt % of the copper-based alloy powder, wherein the paste is glass-free.

An electronic component that includes: a base body having an outer surface, and the outer surface having a recess that is a site recessed with respect to a periphery of the outer surface; and a glass film that covers at least a portion of the outer surface of the base body having the recess, wherein a part of the glass film that covers the recess is recessed with respect to the periphery of the outer surface of the glass film, and a ratio of a minimum value of a thickness of the glass film covering the recess to a maximum value of the thickness is 0.05 to 0.8.

An electronic component that includes: a base body having an outer surface, and the outer surface having a recess that is a site recessed with respect to a periphery of the outer surface; and a glass film that covers at least a portion of the outer surface of the base body having the recess, wherein a part of the glass film that covers the recess is recessed with respect to the periphery of the outer surface of the glass film, and a ratio of a minimum value of a thickness of the glass film covering the recess to a maximum value of the thickness is 0.05 to 0.8.

Resistors and a method of manufacturing resistors are described herein. A resistor includes a resistive element and a plurality of upper heat dissipation elements. The plurality of heat dissipation elements are electrically insulated from one another via a dielectric material and thermally coupled to the resistive element via an adhesive material disposed between each of the plurality of heat dissipation elements and a surface of the resistive element. Electrode layers are provided on a bottom surface of the resistive element. Solderable layers form side surfaces of the resistor and assist in thermally coupling the heat dissipation elements, the resistor and the electrode layers.

Resistors and a method of manufacturing resistors are described herein. A resistor includes a resistive element and a plurality of upper heat dissipation elements. The plurality of heat dissipation elements are electrically insulated from one another via a dielectric material and thermally coupled to the resistive element via an adhesive material disposed between each of the plurality of heat dissipation elements and a surface of the resistive element. Electrode layers are provided on a bottom surface of the resistive element. Solderable layers form side surfaces of the resistor and assist in thermally coupling the heat dissipation elements, the resistor and the electrode layers.