Resistors and a method of manufacturing resistors are described herein. A resistor includes a resistive element and a plurality of upper heat dissipation elements. The plurality of heat dissipation elements are electrically insulated from one another via a dielectric material and thermally coupled to the resistive element via an adhesive material disposed between each of the plurality of heat dissipation elements and a surface of the resistive element. Electrode layers are provided on a bottom surface of the resistive element. Solderable layers form side surfaces of the resistor and assist in thermally coupling the heat dissipation elements, the resistor and the electrode layers.

A PTC circuit protection device adapted to be mounted on a substrate, includes: a PPTC component; a first electrically conductive unit including a first electrically conductive member and a first conductive pin member that has a first distal end to be in contact with the substrate, a first stand-off height from the first electrically conductive member to the first distal end being not less than 0.1 mm; and a second electrically conductive unit including a second electrically conductive member and a second conductive pin member that has a second distal end to be in contact with the substrate, a second stand-off height from the first electrically conductive member to the second distal end being not less than 0.1 mm.

A PTC circuit protection device adapted to be mounted on a substrate, includes: a PPTC component; a first electrically conductive unit including a first electrically conductive member and a first conductive pin member that has a first distal end to be in contact with the substrate, a first stand-off height from the first electrically conductive member to the first distal end being not less than 0.1 mm; and a second electrically conductive unit including a second electrically conductive member and a second conductive pin member that has a second distal end to be in contact with the substrate, a second stand-off height from the first electrically conductive member to the second distal end being not less than 0.1 mm.

A component assembly is disclosed. In an embodiment the assembly includes a carrier, a metallic structure arranged on the carrier, wherein the metallic structure comprises at least one cavity and an electrical component arranged at least in part in the cavity, wherein the metallic structure comprises at least two part regions which are not connected to each other by any further part of the metallic structure, and wherein the cavity is located between the two part regions. The assembly further includes two contact areas located on the carrier, wherein the component is located on the two contact areas such that each part region of the two part regions is located on one of the two contact areas.

A component assembly is disclosed. In an embodiment the assembly includes a carrier, a metallic structure arranged on the carrier, wherein the metallic structure comprises at least one cavity and an electrical component arranged at least in part in the cavity, wherein the metallic structure comprises at least two part regions which are not connected to each other by any further part of the metallic structure, and wherein the cavity is located between the two part regions. The assembly further includes two contact areas located on the carrier, wherein the component is located on the two contact areas such that each part region of the two part regions is located on one of the two contact areas.

The invention relates to a separating device for an overvoltage protection element, wherein the separating device is to be arranged between the overvoltage protection element and a thermal disconnector, wherein the separating device has a first insulating layer and a second insulating layer, wherein a conductive layer is arranged between the first insulating layer and the second insulating layer, wherein the first insulating layer has a first cutout for a contact with the disconnector, and wherein the second insulating layer has a second cutout for a contact with the overvoltage protection element, wherein the cutouts provide a possibility for contacting the conductive layer and the conductive layer provides a thermal bridge between the overvoltage protection element and the thermal disconnector, with the insulating layers making both a thermal and an electrical insulation available, so that heat of the overvoltage protection element can be conducted in a focused manner to the thermal disconnector.

A surface mount component is disclosed including an electrically insulating beam that is thermally conductive. The electrically insulating beam has a first end and a second end that is opposite the first end. The surface mount component includes a thin-film component formed on the electrically insulating beam adjacent the first end of the electrically insulating beam. A heat sink terminal is formed on the electrically insulating beam adjacent a second end of the electrically insulating beam. In some embodiments, the thin-film component has an area power capacity of greater than about 0.17 W/mm.sup.2 at about 28 GHz.

The invention relates to an overvoltage protection device with varistors, wherein a first varistor and a second varistor are connected in series, wherein the first varistor has a thermal disconnector, wherein the first varistor has a lower operating voltage than the second varistor, and wherein the first varistor has a lower energy absorption capacity than the second varistor, with the first varistor heating up more in the event of an overload and thereby causing the thermal disconnector to disconnect.

The invention relates to an overvoltage protection device with varistors, wherein a first varistor and a second varistor are connected in series, wherein the first varistor has a thermal disconnector, wherein the first varistor has a lower operating voltage than the second varistor, and wherein the first varistor has a lower energy absorption capacity than the second varistor, with the first varistor heating up more in the event of an overload and thereby causing the thermal disconnector to disconnect.

Resistors and a method of manufacturing resistors are described herein. A resistor includes a resistive element and a plurality of conductive elements. The plurality of conductive elements are electrically insulated from one another via a dielectric material and thermally coupled to the resistive element via an adhesive material disposed between each of the plurality of conductive elements and a surface of the resistive element. The plurality of conductive elements is coupled to the resistive element.