H01C1/1406

PTC DEVICE WITH INTEGRATED FUSES FOR HIGH CURRENT OPERATION
20220293384 · 2022-09-15 · ·

A circuit protection device including a PTC device having a PTC element, first and second electrodes disposed on opposing first and second surfaces of the PTC element, respectively, first and second chip fuses disposed on the first and second electrodes, respectively, the second chip fuse electrically connected in series with the PTC device, and the first chip fuse electrically in connected parallel with the PTC device and the second chip fuse, the first chip fuse having a lower electrical resistance than the PTC element when the PTC element is in a non-tripped state, wherein a fusible element of the first chip fuse has a first melting temperature and is configured to carry a current higher than the PTC element can carry without tripping, and wherein a fusible element of the second chip fuse has a second melting temperature that is greater than the first melting temperature.

PTC thermistor module for a temperature control device

A PTC thermistor module for a temperature control device may include at least one PTC thermistor element, two electrically insulating insulator plates, and a plurality of electrical conductors. The PTC thermistor element may have a flat element cross section, two opposing large outer surfaces, and two opposing small outer surfaces connecting the two large outer surfaces. The two insulator plates may be respectively connected to one of the two large outer surfaces. The plurality of electrical conductors may be configured as a plurality of electrically conductive conductor coatings, which may each be disposed on an associated insulator plate of the two insulator plates. At least one first conductor coating may be electrically connected to a first large outer surface of the two large outer surfaces. At least two second conductor coatings may be electrically connected to a second large outer surface of the two large outer surfaces.

Composite circuit protection device

A composite circuit protection device includes first and second positive temperature coefficient (PTC) components, a voltage-dependent resistor, and first, second and third conductive leads. The first PTC component includes a first PTC layer, and first and second electrode layers respectively disposed on two opposite surfaces of the first PTC layer. The second PTC component includes a second PTC layer, and third and fourth electrode layers respectively disposed on the two opposite surfaces of the second PTC layer. The voltage-dependent resistor is connected to the second and third electrode layers. The first, second and third conductive leads are bonded to the first electrode layer, the voltage-dependent resistor, and the fourth electrode layer, respectively.

OVER-CURRENT PROTECTION DEVICE

An over-current protection device includes first and second electrode layers and a PTC material layer laminated therebetween. The PTC material layer includes a polymer matrix, a conductive filler, and a titanium-containing dielectric filler. The polymer matrix has a fluoropolymer. The titanium-containing dielectric filler has a compound represented by a general formula of MTiO.sub.3, wherein the M represents transition metal or alkaline earth metal. The total volume of the PTC material layer is calculated as 100%, and the titanium-containing dielectric filler accounts to for 5-15% by volume of the PTC material layer.

OVER-CURRENT PROTECTION DEVICE

An over-current protection device comprises first and second electrode layers and a PTC material layer laminated therebetween. The PTC material layer includes a polymer matrix, a conductive filler and a titanium-containing inner filler. The polymer matrix has a fluorine-free polyolefin-based polymer. The titanium-containing inner filler has a compound represented by a general formula of MTiO.sub.3, wherein the M represents transition metal or alkaline earth metal. The total volume of the PTC material layer is calculated as 100%, and the titanium-containing inner filler accounts for 1-9% by volume of the PTC material layer.

AN ELECTRICALLY POWERED HEATER UNIT

An electrically powered heater unit includes a positive temperature coefficient disc heater element sandwiched between an electrically conductive contact element and an electrically and heat conductive heat transfer element. A housing defining a hollow interior region is located on a plate member, and a communicating opening formed in the plate member communicates with the hollow interior region. The heat transfer element is secured to the plate member by retaining member extending from the heat transfer element engaging a rim of the communicating opening, with the heating element and the contact element located within the hollow interior region of the housing. A first and second connecting elements extend from the contact element and heat transfer element, respectively, then through the housing for connecting to first and second wires of an electrical power supply for providing electrical power supply to first and second abutment surfaces of the heater element.

Ceramic multi-layer component and method for producing a ceramic multi-layer component

A ceramic multi-layer component and a method for producing a ceramic multi-layer component are disclosed. In an embodiment a ceramic multi-layer component includes a stack with ceramic layers and electrode layers arranged between them, wherein the ceramic layers and the electrode layers are arranged above one another along a stacking direction, wherein at least one first electrode layer extends along a first main extension direction from a first end region to a second end region of the first electrode layer, and wherein the at least one first electrode layer has a current-carrying capacity that decreases along the first main extension direction.

Method of forming a fuse device
11127554 · 2021-09-21 · ·

A fuse device including a fuse component, a first electrode, disposed on a first side of the fuse component, a second electrode, disposed on a second side of the fuse component, and a phase change component, disposed in thermal contact with the fuse component. The fuse component may comprise a fuse temperature, wherein the phase change component exhibits a phase change temperature, the phase change temperature marking a phase transition of the phase change component, and wherein the phase change temperature is less than the fuse temperature.

PTC THERMISTOR MODULE FOR A TEMPERATURE CONTROL DEVICE

A PTC thermistor module for a temperature control device may include at least one PTC thermistor element, two electrically insulating insulator plates, and a plurality of electrical conductors. The PTC thermistor element may have a flat element cross section, two opposing large outer surfaces, and two opposing small outer surfaces connecting the two large outer surfaces. The two insulator plates may be respectively connected to one of the two large outer surfaces. The plurality of electrical conductors may be configured as a plurality of electrically conductive conductor coatings, which may each be disposed on an associated insulator plate of the two insulator plates. At least one first conductor coating may be electrically connected to a first large outer surface of the two large outer surfaces. At least two second conductor coatings may be electrically connected to a second large outer surface of the two large outer surfaces.

COMPOSITE CIRCUIT PROTECTION DEVICE
20210305807 · 2021-09-30 ·

A composite circuit protection device includes first and second positive temperature coefficient (PTC) components, a voltage-dependent resistor, and first, second and third conductive leads. The first PTC component includes a first PTC layer, and first and second electrode layers respectively disposed on two opposite surfaces of the first PTC layer. The second PTC component includes a second PTC layer, and third and fourth electrode layers respectively disposed on the two opposite surfaces of the second PTC layer. The voltage-dependent resistor is connected to the second and third electrode layers. The first, second and third conductive leads are bonded to the first electrode layer, the voltage-dependent resistor, and the fourth electrode layer, respectively.