Surface-mountable devices include a conductive polymer layer between first and second electrodes, on which are disposed first and second insulation layers, respectively, with first and second planar terminals on the second insulation layer. A first cross-conductor connects the second electrode to the first terminal, and is separated from the first electrode by a portion of the first insulation layer. A second cross-conductor connects the first electrode to the second terminal, and is separated from the second electrode by a portion of the second insulation layer. At least one cross-conductor may include a beveled portion through the first insulation layer. Alternatively, at least one cross-conductor may contact an anchor pad on the first insulation layer, the anchor pad having a small area relative to the areas of the terminals. Enhanced adhesion between the cross-conductor(s) and the first insulation layer is provided, while allowing thermal expansion without excessive stress.

An electronic component includes a base body and an alumina film covering an outer surface of the base body. The alumina film includes a film-shaped part made of alumina and in contact with the outer surface of the base body, and a particle layer located on the outer surface side of the film-shaped part. The particle layer includes a plurality of alumina particles bonded to the outer surface of the film-shaped part. The average value of the thicknesses of the alumina film including the film-shaped part and the particle layer is 0.05 m or more and 2.0 m or less. The interval between the particles is 1.3 m or less.

An electronic component includes a base body, an alumina film, an internal electrode, and an external electrode. A region of the alumina film excluding a range of 10% of a thickness of the alumina film from a boundary surface with the base body toward an outer surface of the alumina film in the alumina film and a range of 10% of the thickness of the alumina film from the outer surface of the alumina film toward the base body in the alumina film is a specific region. Each region obtained by dividing the specific region into 10 equal parts in a thickness direction of the alumina film is a divided region, an atomic percentage of the specific atom in each divided region is 0.5 times or more and 1.5 times or less an atomic percentage of the same specific atom in the entire specific region.

A method of sintering solderable base metals in air atmosphere and manufacturing alloy components to manufacture solderable electrodes by heat treatment instead of electroplating processes. The method involves introducing into an electrode plenty of metallic tin powder directly, then metallic aluminum powder with high-oxidation enthalpy formation to protect tin against oxidation, and other metals, say metallic copper powder, to produce copper-tin alloy to increase the melting point of the electrode. With the method, tin, as a base, directly functions as an electrode, covering the tin electrode with aluminum film to protect the tin electrode against oxidation during heat treatment, introducing appropriate metals, say copper, into the tin film to produce alloy from tin and copper to increase the melting point of the electrode. With electroplating processes replaced by heat treatment, electronic components, i.e., electrodes, are manufactured without any tin electroplating process but exhibit high solderability and excellent functionality.

An electronic component includes a base body and a glass film which covers an outer surface of the base body. The glass film contains one or more elements selected from an alkali metal and an alkaline earth metal as an additive. The glass film has a thickness of 80 nm or more and 5000 nm or less. A ratio of an arithmetic average roughness of an outer surface of the glass film to an arithmetic average roughness of the outer surface of the base body is 0.0002 or more and 0.85 or less.

An electronic component that includes: a base body; wiring inside the base body; a glass film covering an outer surface of the base body; an underlying electrode electrically connected to the wiring and covering a part of the glass film; and a metal layer covering the underlying electrode, wherein the glass film includes an uncovered portion that is not covered with the underlying electrode and separated from an outer edge of the underlying electrode by more than 10 m, and a boundary portion that is not covered with the underlying electrode and not separated from the outer edge of the underlying electrode by more than 10 m, and a thickness of the boundary portion is larger than a thickness of the uncovered portion.

A thermistor that includes: a base layer containing a resin component; a thermistor layer on the base layer, wherein the thermistor layer is a composite which includes a plurality of particles including a metal oxide containing at least one first metal element that is at least one of Mn and Ni, and an amorphous phase between the plurality of particles and which contains the same metal element as the first metal element; two electrodes, wherein the two electrodes include at least one second metal element selected from the group consisting of Cu, Al, Ag, and Ni; and a bonding layer between the two electrodes and the thermistor layer, the bonding layer comprising the composite, the second metal element, and the resin component.

A negative temperature coefficient thermistor that includes: a ceramic base body composed of a ceramic composition containing Mn, Ni, and Fe; and an outer electrode on an end portion of the ceramic base body. The outer electrode includes an underlying layer covering the end portion of the ceramic base body and containing Cu and glass, and a plating layer covering the underlying layer. A Ni content, a Mn content, and a Fe content in the ceramic base body satisfy the following formulae (1) and (2): 26.4 mol %[Ni]29.5 mol % (1), and 1.65[Mn]/[Fe]1.90 (2). In the formulae, [Ni], [Mn], and [Fe] represent the Ni content, the Mn content, and the Fe content (mol %), respectively, when a total content of Mn, Ni, and Fe in the ceramic base body is taken as 100 mol %.

A sensor element for measuring a temperature has a carrier and at least one functional layer which has a material with a temperature-dependent electrical resistance. The functional layer is arranged on the carrier. The sensor element has at least two electrodes with electrode fingers and at least two contact pads for electrically contacting the sensor element. One contact pad is arranged directly on a partial area of one of the electrodes in each case. The sensor element is designed to be integrated into an electronic system as a discrete component. The sensor element has a narrow resistance tolerance. The functional layer and/or at least one of the at least two electrodes are structured to adjust the resistance value.