There is provided a temperature sensor element including a pair of electrodes and a temperature-sensitive film disposed in contact with the pair of electrodes, in which the temperature-sensitive film includes a fluorine atom and the temperature-sensitive film includes a matrix resin and a plurality of conductive domains contained in the matrix resin, and the conductive domains includes a conductive polymer.

There is provided a temperature sensor element including a pair of electrodes and a temperature-sensitive film disposed in contact with the pair of electrodes, in which the temperature-sensitive film includes a matrix resin and a plurality of conductive domains contained in the matrix resin, and the matrix resin constituting the temperature-sensitive film has a degree of molecular packing of 40% or more, as determined based on measurement by an X-ray diffraction method, according to expression (i): Degree of molecular packing (%)=100×(Area of peak derived from ordered structure)/(Total area of all peaks).

A ceramic multi-layer component and a method for producing a ceramic multi-layer component are disclosed. In an embodiment a ceramic multi-layer component includes a stack with ceramic layers and electrode layers arranged between them, wherein the ceramic layers and the electrode layers are arranged above one another along a stacking direction, wherein at least one first electrode layer extends along a first main extension direction from a first end region to a second end region of the first electrode layer, and wherein the at least one first electrode layer has a current-carrying capacity that decreases along the first main extension direction.

Disclosed is a circuit protection device including a case, a negative temperature coefficient thermistor which is accommodated in the case and includes a resistant heating element, a pair of electrodes installed on both sides of the resistant heating element, and a first lead wire and a second lead wire withdrawn from the pair of electrodes, respectively, and a thermal fuse which is accommodated in the case and includes a thermal fuse body and a third lead wire and a fourth lead wire connected to both ends of the thermal fuse body, respectively. Here, the second lead wire and the third lead wire are connected to each other in the case.

The present invention enables the achievement of: high density mounting by means of an electronic component for welding; and improvement of thermal responsivity and tensile strength at high temperatures by means of reduction in size and thickness of a temperature sensor. An electronic component for welding, which has a function of a resistor, a capacitor, an inductor or the like, comprises: an insulating substrate; a function part and a bonding electrode part, which are provided on the insulating substrate; and a lead which is electrically connected to the bonding electrode part. The bonding electrode part is configured of: an adhesive active metal layer which is formed from a high-melting-point metal on the insulating substrate; a barrier layer which is formed from a high-melting-point metal on the active metal layer; and a bonding metal layer which is mainly composed of a low-melting-point metal and is formed on the barrier layer.

In a method for fastening a contact element (5, 6) in an electrical component (1), a contact element (5, 6) is arranged on a contact surface (3, 4) of a base body (2) of the component (1) and a laser beam (18) is directed onto a region (16, 17) of the contact element (5, 6) in such a way that the base body (2) is not located in the beam direction (24) of the laser beam (18). The contact element (5, 6) is partially melted by the laser beam (18), so that the molten material (7, 8) wets the contact surface (3, 4) and produces fastening of the contact element (5, 6) on the contact surface (3, 4).

Provided is a thermistor which has a smaller change in resistance value between before and after a heat resistance test and from which a high B constant is obtained, a method for manufacturing the same, and a thermistor sensor. The thermistor is a thermistor formed on a substrate and includes: an intermediate stacked portion formed on the substrate; and a main metal nitride film layer formed of a thermistor material of a metal nitride on the intermediate stacked portion, wherein the intermediate stacked portion includes a base thermistor layer formed of a thermistor material of a metal nitride and an intermediate oxynitride layer formed on the base thermistor layer, the main metal nitride film layer is formed on the intermediate oxynitride layer, and the intermediate oxynitride layer is a metal oxynitride layer formed through oxidation of the thermistor material of the base thermistor layer immediately below the intermediate oxynitride layer.

A ceramic member includes a matrix phase of a perovskite compound including La, Ca, and Mn, and a heterophase including Mn and O as main components, wherein crystal grains of the perovskite compound have an average grain size of about 2.5 m or more and about 6.4 m or less.

Disclosed is a circuit protection device including a case, a negative temperature coefficient thermistor which is accommodated in the case and includes a resistant heating element, a pair of electrodes installed on both sides of the resistant heating element, and a first lead wire and a second lead wire withdrawn from the pair of electrodes, respectively, and a thermal fuse which is accommodated in the case and includes a thermal fuse body and a third lead wire and a fourth lead wire connected to both ends of the thermal fuse body, respectively. Here, the second lead wire and the third lead wire are connected to each other in the case.

A negative-temperature-coefficient thermistor component includes a core. Surfaces of the core are partially covered with a first insulating layer. Surfaces of the core are partially covered with a second insulating layer. The first insulating layer and the second insulating layer overlap each other on a first side surface and a second side surface, each of which is one of the surfaces of the core.