A green film composed of varistor material is laminated on a ceramic main body (GK), which is provided with metallizations (EP1, AF) on both sides, and is sintered to form a varistor layer (VS). A terminating electrode pair (EP1, EP2) completes the arrangement and allows the varistor layer to be operated as a varistor. The upper second electrode pair (EP2) can serve directly as a terminal contact for mounting an electrical component.

A green film composed of varistor material is laminated on a ceramic main body (GK), which is provided with metallizations (EP1, AF) on both sides, and is sintered to form a varistor layer (VS). A terminating electrode pair (EP1, EP2) completes the arrangement and allows the varistor layer to be operated as a varistor. The upper second electrode pair (EP2) can serve directly as a terminal contact for mounting an electrical component.

A protection device comprises a first planar substrate, a second planar substrate, a heating element, a fusible element and an absorbent element. The first substrate comprises a first surface, and the second substrate comprises a second surface facing the first surface. The heating element is disposed on the first surface, and the fusible element is disposed above the heating element. The absorbent element is disposed on the second surface and above the fusible element. When over-current or over-temperature occurs, the heating element heats up to melt and blow the fusible element and the absorbent element absorbs melted metal of the fusible element.

A protection device comprises a first planar substrate, a second planar substrate, a heating element, a fusible element and an absorbent element. The first substrate comprises a first surface, and the second substrate comprises a second surface facing the first surface. The heating element is disposed on the first surface, and the fusible element is disposed above the heating element. The absorbent element is disposed on the second surface and above the fusible element. When over-current or over-temperature occurs, the heating element heats up to melt and blow the fusible element and the absorbent element absorbs melted metal of the fusible element.

An electronic component module with leads includes an electronic component including terminal electrodes at both ends of the electronic component body, and first and second leads including metal wires covered with insulating members and arranged side-by-side, the first and second leads are electrically connected to the terminal electrodes, wherein exposed metal wire portions where the metal wires are exposed respectively from the first and second leads are provided on joint surfaces of the first and second leads on a same side and used to join to the terminal electrodes, the exposed metal wire portion of the first lead and the exposed metal wire portion of the second lead are spaced apart from each other by a predetermined interval in a lead length direction, the terminal electrodes are electrically connected to the metal wire exposed portions of the first and second leads, respectively, by solder.

An electronic component module with leads includes an electronic component including terminal electrodes at both ends of the electronic component body, and first and second leads including metal wires covered with insulating members and arranged side-by-side, the first and second leads are electrically connected to the terminal electrodes, wherein exposed metal wire portions where the metal wires are exposed respectively from the first and second leads are provided on joint surfaces of the first and second leads on a same side and used to join to the terminal electrodes, the exposed metal wire portion of the first lead and the exposed metal wire portion of the second lead are spaced apart from each other by a predetermined interval in a lead length direction, the terminal electrodes are electrically connected to the metal wire exposed portions of the first and second leads, respectively, by solder.

The present application addresses a method for establishing an electronic connection to an electronic component and a chip assembly. The method comprises the following steps. First, an electronic component having a first welding part is provided. Also a first electrical contact piece is provided. The first welding part and the first electrical contact piece are brought into mechanical contact with each other. Subsequently, while the mechanical contact is maintained, a welding current is applied which is capable of welding the electrical contact piece and the welding part together.

Provided are: a resistor unit; a manufacturing method therefor; and a device provided with a resistor unit. A resistor unit is equipped with a resistor and at least one pair of electrode layers formed on the resistor. In at least one of the electrode layers, a removal part for trimming is formed in a region, from among regions where the electrode layers are formed, that excludes the peripheral edges of such layers. The resistor is a thermosensitive resistor, for example.

Provided are: a resistor unit; a manufacturing method therefor; and a device provided with a resistor unit. A resistor unit is equipped with a resistor and at least one pair of electrode layers formed on the resistor. In at least one of the electrode layers, a removal part for trimming is formed in a region, from among regions where the electrode layers are formed, that excludes the peripheral edges of such layers. The resistor is a thermosensitive resistor, for example.

The invention relates to a measuring resistor (1), in particular a low-resistance current-measuring resistor, comprising two terminal parts (2, 3) that consist of a conductor material for introducing and discharging a current, and a resistor element (4) that consists of a resistor material, wherein the resistor element (4) is arranged between the two terminal parts (2, 3) in the direction of the current and current flows through the resistor element (4). According to one variant of the invention, the measuring resistor (1) has several pairs of voltage-measuring contacts (7) for measuring the voltage falling across the resistor element (4) in order to be able to compensate metrologically for inhomogeneities in the current density. In contrast, according to another variant of the invention, one pair of voltage-measuring contacts (7) is arranged at a location at which the measuring resistor (1) exhibits neither a capacitive behavior nor an inductive behavior, such that the current flowing through the measuring resistor (1) and the voltage across the voltage-measuring contacts (7) are substantially in phase.