A shunt resistor the resistive value of which can be lowered simply and easily has: a first resistive body, two base materials that sandwich the first resistive body therebetween and are joined by a welding to the first resistive body, and a second resistive body joined by a welding to the two base materials at different positions from the first resistive body. In addition, the second resistive body can come into contact with the first resistive body.

A connector for providing electronic communication with an electronic device is disclosed. The connector can comprise a substrate comprising layers of non-conductive material and conductive material. The connector can include an interface member mounted to the substrate and electrically connected with the conductor. A positive temperature coefficient (PTC) fuse can be embedded in the substrate and electrically connected with the conductor and the interface member. At least a portion of the PTC fuse can be disposed directly below the interface member.

A power resistor is disclosed, having at least one electrical connection, having a carrier substrate, which has at least one resistor element composed of a thick-film material and at least one contact electrode to which the resistor element electrically connects, having at least one electrical conductor, which is soldered to the contact electrode and produces an electrical connection between the contact electrode and the electrical terminal, and having a housing, which is at least partially filled with at least one casting compound and in which the resistor element and contact electrode are encapsulated, with the electrical conductor protruding out through the casting compound. In order to achieve a simply designed and easy-to-use power resistor, it is proposed for a pin, in particular a soldering pin or press-fitting pin, to constitute the electrical conductor, which pin is placed onto the contact electrode and soldered to it and constitutes the electrical terminal of the power resistor.

A power resistor is disclosed, having at least one electrical connection, having a carrier substrate, which has at least one resistor element composed of a thick-film material and at least one contact electrode to which the resistor element electrically connects, having at least one electrical conductor, which is soldered to the contact electrode and produces an electrical connection between the contact electrode and the electrical terminal, and having a housing, which is at least partially filled with at least one casting compound and in which the resistor element and contact electrode are encapsulated, with the electrical conductor protruding out through the casting compound. In order to achieve a simply designed and easy-to-use power resistor, it is proposed for a pin, in particular a soldering pin or press-fitting pin, to constitute the electrical conductor, which pin is placed onto the contact electrode and soldered to it and constitutes the electrical terminal of the power resistor.

A shunt resistor includes a resistive body and a pair of electrodes each bonded to the resistive body. The resistive body has an obverse surface and a reverse surface that face in mutually opposite directions. The two electrodes are separate from each other in a first direction perpendicular to the thickness direction of the resistive body. The resistive body has two ends separate from each other in the first direction. The obverse surface of the resistive body includes a pair of intentionally curved portions that are located at the two ends of the resistive body.

A shunt resistor includes a resistive body and a pair of electrodes each bonded to the resistive body. The resistive body has an obverse surface and a reverse surface that face in mutually opposite directions. The two electrodes are separate from each other in a first direction perpendicular to the thickness direction of the resistive body. The resistive body has two ends separate from each other in the first direction. The obverse surface of the resistive body includes a pair of intentionally curved portions that are located at the two ends of the resistive body.

A varistor device includes a main body, a conductive area, a specific-melting-point metallic pin, and an elastic unit. The main body has a first surface, and the conductive area is located at the first surface. The specific-melting-point metallic pin has a first section and a second section. The first section and the second section are one-piece formed. The first section is fixedly disposed on the conductive area. The second section has a specific melting point such that the second section melts when a current flows between the first surface and the second section so as to expose the second section to a temperature greater than the specific melting point. The elastic unit has an end connected to the second section, and the elastic unit provides an elastic force to the second section to break the second section so as to cut off the current when the second section melts.

A varistor device includes a main body, a conductive area, a specific-melting-point metallic pin, and an elastic unit. The main body has a first surface, and the conductive area is located at the first surface. The specific-melting-point metallic pin has a first section and a second section. The first section and the second section are one-piece formed. The first section is fixedly disposed on the conductive area. The second section has a specific melting point such that the second section melts when a current flows between the first surface and the second section so as to expose the second section to a temperature greater than the specific melting point. The elastic unit has an end connected to the second section, and the elastic unit provides an elastic force to the second section to break the second section so as to cut off the current when the second section melts.

A method for creating a dielectric thin-film coating for devices having a fusible element is disclosed. The method comprises mixing insoluble and soluble polymers in solid form and exposing the mixture to heat to create a melt mixture. The melt mixture is then dissolved in a solvent to create a slurry which can then be deposited on the device as a thin-film coating to create an interior insulation layer or an external surface.

A connector for providing electronic communication with an electronic device is disclosed. The connector can comprise a substrate comprising layers of non-conductive material and conductive material. The connector can include an interface member mounted to the substrate and electrically connected with the conductor. A positive temperature coefficient (PTC) fuse can be embedded in the substrate and electrically connected with the conductor and the interface member. At least a portion of the PTC fuse can be disposed directly below the interface member.