In some embodiments, a multi-layer electrical device can include multiple electrodes connected to respective terminals, with at least two selected terminals being configured to allow movement relative to each other to accommodate a change in separation distance of the respective electrodes resulting from a change in temperature, and to allow a solder to provide a connection therebetween when the multi-layer electrical device is soldered on a mounting surface. In some embodiments, the multi-layer electrical device can further include a layer having a temperature-dependent electrical property implemented between each neighboring pair of electrodes.

The present invention relates a shunt resistor and a shunt resistance device. The shunt resistor (1) includes an electrode member (10). The electrode member (10) includes a contact portion (10a) contacting a resistance element (5), and a slit (20) formed on the contact portion (10a).

The present invention relates a shunt resistor and a shunt resistance device. The shunt resistor (1) includes an electrode member (10). The electrode member (10) includes a contact portion (10a) contacting a resistance element (5), and a slit (20) formed on the contact portion (10a).

The invention relates to a shunt resistor (2) for detecting the status of an electrical energy storage unit (1), wherein the shunt resistor (2) comprises a first layer (4), a second layer (6) and a third layer (8). According to the invention, the layers (4, 6, 8) are arranged in a layered manner in a stacking direction (V), wherein the second layer (6) is arranged between the first layer (4) and the third layer (8), and wherein the layers (4, 6, 8) are in physical contact with one another at one of the sides having the greatest respective surface area, and wherein the layers (4, 6, 8) are arranged at least partially overlapping.

The invention relates to a shunt resistor (2) for detecting the status of an electrical energy storage unit (1), wherein the shunt resistor (2) comprises a first layer (4), a second layer (6) and a third layer (8). According to the invention, the layers (4, 6, 8) are arranged in a layered manner in a stacking direction (V), wherein the second layer (6) is arranged between the first layer (4) and the third layer (8), and wherein the layers (4, 6, 8) are in physical contact with one another at one of the sides having the greatest respective surface area, and wherein the layers (4, 6, 8) are arranged at least partially overlapping.

In a method for fastening a contact element (5, 6) in an electrical component (1), a contact element (5, 6) is arranged on a contact surface (3, 4) of a base body (2) of the component (1) and a laser beam (18) is directed onto a region (16, 17) of the contact element (5, 6) in such a way that the base body (2) is not located in the beam direction (24) of the laser beam (18). The contact element (5, 6) is partially melted by the laser beam (18), so that the molten material (7, 8) wets the contact surface (3, 4) and produces fastening of the contact element (5, 6) on the contact surface (3, 4).

An SMD-solderable component comprises a resistance element, a first contact element, and a second contact element, wherein the first contact element is connected with a first end section of the resistance element by means of a first soldered connection and the second contact element is connected with a second end section of the resistance element by means of a second soldered connection. At least one of the first soldered connection and the second soldered connection is a lead-free soldered connection that is made with a lead-free solder preform. Further disclosed is a method for producing an SMD-solderable component.

An SMD-solderable component comprises a resistance element, a first contact element, and a second contact element, wherein the first contact element is connected with a first end section of the resistance element by means of a first soldered connection and the second contact element is connected with a second end section of the resistance element by means of a second soldered connection. At least one of the first soldered connection and the second soldered connection is a lead-free soldered connection that is made with a lead-free solder preform. Further disclosed is a method for producing an SMD-solderable component.

A shunt resistor having improved temperature characteristics has a resistive body, a pair of base materials integrally formed on the resistive body across the resistive body, and measurement terminals fixed onto the base materials. The base materials have a plurality of cutout portions along a longitudinal direction of the base materials, wherein the plurality of cutout portions do not communicate with each other and are provided in a stepped manner.

A shunt resistor having improved temperature characteristics has a resistive body, a pair of base materials integrally formed on the resistive body across the resistive body, and measurement terminals fixed onto the base materials. The base materials have a plurality of cutout portions along a longitudinal direction of the base materials, wherein the plurality of cutout portions do not communicate with each other and are provided in a stepped manner.