A method of manufacturing an electronic component includes manufacturing a ceramic element including one pair of end surfaces and four side surfaces, forming external electrodes at both end portions of the ceramic element, measuring an initial characteristic value, determining any side surface to be machined among the four side surfaces and then determining, based on stored data, an amount of machining to be performed on the side surface to be machined, and machining, by the determined machining amount, the side surface of the ceramic element, which is determined to be machined, to be flush or substantially flush with the external electrodes.

The present invention provides a chip resistor and a method of making the same for alleviating stress resulted from thermal expansion difference and thus suppressing cracks. A chip resistor includes: a substrate, having a carrying surface and a mounting surface facing away from each other; a pair of upper electrodes, disposed at two ends of the carrying surface; a resistor, disposed on the carrying surface and between the pair of upper electrodes, and electrically connected to the pair of upper electrodes; a stress relaxation layer having flexibility and formed on the mounting surface of the substrate; a metal thin film layer, formed on a surface of the stress relaxation layer opposite to the substrate; a side electrode for electrically connecting the upper electrodes and the metal thin film layer; and a plating layer covering the side electrode and the metal thin film layer.

In an electronic component, a first outer electrode includes a first conductive layer provided on a first end surface. A second outer electrode includes a second conductive layer provided on a second end surface. A first inner electrode passes through the first conductive layer. A second inner electrode passes through the second conductive layer.

A plurality of resistors are disclosed herein. The resistor may include one or more resistive elements and a plurality of conductive portions. Openings or slots, which can be configured to adjust temperature coefficient or resistance (TCR) values of the resistor, are formed in the resistive elements. The shape, quantity, and orientation of the openings or slots can vary. In one aspect, header assemblies are provided for securing or holding pins relative to the resistors.

A plurality of resistors are disclosed herein. The resistor may include one or more resistive elements and a plurality of conductive portions. Openings or slots, which can be configured to adjust temperature coefficient or resistance (TCR) values of the resistor, are formed in the resistive elements. The shape, quantity, and orientation of the openings or slots can vary. In one aspect, header assemblies are provided for securing or holding pins relative to the resistors.

A noise-preventing resistor has a structure in which a resistance wire is wound around an outer circumferential surface of a core, cap terminals are attached to either end part of the core, and part of an insulative coating (resin coating) covering the resistance wire and part of the resistance wire positioned underneath the insulative coating are cut, forming peeled regions exposing the resistance wire. As a result, conduction between the cap terminals and the resistance wire in the noise-preventing resistor is ensured.

A shunt resistor module which is coupled to a printed circuit board to be used for current measurement, includes: a resistor portion configured to have predetermined resistance; at least two terminal portions configured to extend from opposite ends of the resistor portion; lead pins fixed to first sides of the terminal portions to protrude to be electrically connected to the printed circuit board; and an exterior member formed to at least partially cover first surfaces of the terminal portions and to have pin holes opened to expose the lead pins and screw holes formed to be screwed to the printed circuit board.

A dielectric material includes a main component represented by (Ba.sub.1-xCa.sub.x)(Ti.sub.1-y(Zr, Sn, Hf).sub.y)O.sub.3 (0≤x≤1 and 0≤y≤0.5); a first subcomponent including at least one of elements among Y, Dy, Ho, Er, Gd, Ce, Nd, Nb, Sm, Tb, Eu, Tm, La, Lu, and Yb; a second subcomponent including Si and/or Al; and a third subcomponent including Ba and/or Ca.

A dielectric material includes a main component represented by (Ba.sub.1-xCa.sub.x)(Ti.sub.1-y(Zr, Sn, Hf).sub.y)O.sub.3 (0≤x≤1 and 0≤y≤0.5); a first subcomponent including at least one of elements among Y, Dy, Ho, Er, Gd, Ce, Nd, Nb, Sm, Tb, Eu, Tm, La, Lu, and Yb; a second subcomponent including Si and/or Al; and a third subcomponent including Ba and/or Ca.

A noise-preventing resistor has a structure in which a resistance wire is wound around an outer circumferential surface of a core, cap terminals are attached to either end part of the core, and part of an insulative coating (resin coating) covering the resistance wire and part of the resistance wire positioned underneath the insulative coating are cut, forming peeled regions exposing the resistance wire. As a result, conduction between the cap terminals and the resistance wire in the noise-preventing resistor is ensured.