H01C3/12

POWER DIFFUSING ASSEMBLY FOR A FLUID AND METHOD FOR MANUFACTURING THE POWER DIFFUSING ASSEMBLY

A power diffusing assembly includes a power diffusing body disposed along a flow path of a compressible fluid. The power diffusing body includes passages extending through the power diffusing body and through which at least part of the fluid flows through the power diffusing body. The power diffusing body receives an incoming flow profile of the fluid on an inlet side of the power diffusing body, directs the fluid through the passages in the power diffusing body, and outputs an outgoing flow profile of the fluid out of an outlet side of the power diffusing body. Arrangements of the passages in the power diffusing body are based on the incoming flow profile of the fluid that are received by the power diffusing body and are based on a desired profile of the outgoing flow profile of the fluid exiting out of the power diffusing body.

Flexible conductive element and shaping method thereof

A method to plastically deform a flexible conductive element (1) wherein is provided a device (11) configured to expand the volume thereof, wherein the method comprises the steps of arranging the flexible conductive element (1) at least partially around said device (11); expanding the volume of the device (11) up to a predetermined value, whereby at least one portion (8) of the flexible conductive element (1) which is in contact with the device (11) during the expansion of the device (11) is plastically deformed.

ADDITIVE MANUFACTURED RESISTANCE TEMPERATURE DETECTOR
20200103288 · 2020-04-02 ·

A method of making a resistance temperature detector includes additively manufacturing a conductive ink on a flexible substrate and applying the resistance temperature detector to a geometrically complex surface of a component requiring heating, or directly additive manufacturing the resistance temperature detector onto that surface.

ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREOF

An electronic component and a manufacturing method thereof are disclosed. An electronic component includes a substrate, a conductor pattern portion disposed on the substrate, a first electrode pattern and a second electrode pattern disposed on the conductor pattern portion, and at least one dummy electrode pattern disposed to be spaced apart from the first electrode pattern and the second electrode pattern and disposed on the substrate. A width of the first electrode pattern is substantially the same as a width of a portion of the conductor pattern portion in contact with the first electrode pattern, and a width of the second electrode pattern is substantially the same as a width of a portion of the conductor pattern portion in contact with the second electrode pattern.

ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREOF

An electronic component and a manufacturing method thereof are disclosed. The electronic component includes a substrate, a conductor pattern portion disposed on the substrate, a first electrode pattern and a second electrode pattern disposed on the conductor pattern portion, at least one dummy conductor pattern disposed to be spaced apart from the conductor pattern portion and disposed on the substrate, and at least one dummy electrode pattern disposed on the at least one dummy conductor pattern. A width of the first electrode pattern is substantially the same as a width of a portion of the conductor pattern portion in contact with the first electrode pattern, and a width of the second electrode pattern is substantially the same as a width of a portion of the conductor pattern portion in contact with the second electrode pattern.

Apparatus and methods for launching guided waves via plural waveguide systems

Aspects of the subject disclosure may include, for example, a system having a first plurality of transmitters for launching according to a signal, first electromagnetic waves, and a second plurality of transmitters for launching, according to the signal, second electromagnetic waves. The first electromagnetic waves and the second electromagnetic waves combine at an interface of a transmission medium to induce a propagation of a third electromagnetic wave, the third electromagnetic wave having a non-fundamental wave mode and a non-optical operating frequency, and wherein the second plurality of transmitters are spaced apart from the first plurality of transmitters in a direction of propagation of the third electromagnetic wave. Other embodiments are disclosed.

Apparatus and methods for launching guided waves via plural waveguide systems

Aspects of the subject disclosure may include, for example, a system having a first plurality of transmitters for launching according to a signal, first electromagnetic waves, and a second plurality of transmitters for launching, according to the signal, second electromagnetic waves. The first electromagnetic waves and the second electromagnetic waves combine at an interface of a transmission medium to induce a propagation of a third electromagnetic wave, the third electromagnetic wave having a non-fundamental wave mode and a non-optical operating frequency, and wherein the second plurality of transmitters are spaced apart from the first plurality of transmitters in a direction of propagation of the third electromagnetic wave. Other embodiments are disclosed.

Chip resistor and mounting structure thereof
10586635 · 2020-03-10 · ·

A chip resistor with a reduced thickness is provided. The chip resistor includes an insulating substrate, a resistor embedded in the substrate, a first electrode electrically connected to the resistor, and a second electrode electrically connected to the resistor. The first electrode and the second electrode are spaced apart from each other in a lateral direction that is perpendicular to the thickness direction of the substrate.

Chip resistor and mounting structure thereof
10586635 · 2020-03-10 · ·

A chip resistor with a reduced thickness is provided. The chip resistor includes an insulating substrate, a resistor embedded in the substrate, a first electrode electrically connected to the resistor, and a second electrode electrically connected to the resistor. The first electrode and the second electrode are spaced apart from each other in a lateral direction that is perpendicular to the thickness direction of the substrate.

HEATER UNIT

A heather unit including a small diameter sheath heater with improved reliability is provided. The heater unit includes a first substrate having a first joint surface and a second substrate having a second joint surface being joined together, a groove arranged on at least one of the first joint surface or the second joint surface, and a sheath heater arranged inside the groove. The sheath heater includes a metal sheath, a heating wire having a band shape, the heating wire arranged with a space within the metal sheath so as to rotate with respect to an axis direction of the metal sheath, an insulating material arranged in the space, and connection terminals arranged at one end of the metal sheath, the connection terminals electrically connected with both ends of the heating wire respectively.