A ceramic multi-layer component and a method for producing a ceramic multi-layer component are disclosed. In an embodiment a ceramic multi-layer component includes a stack with ceramic layers and electrode layers arranged between them, wherein the ceramic layers and the electrode layers are arranged above one another along a stacking direction, wherein at least one first electrode layer extends along a first main extension direction from a first end region to a second end region of the first electrode layer, and wherein the at least one first electrode layer has a current-carrying capacity that decreases along the first main extension direction.

An over-current protection device comprises first and second electrode layers and a PTC material layer laminated therebetween. The PTC material layer comprises a polymer, an electrically conductive filler and a metal compound filler. The PTC material layer comprises the polymer of 50-70% by volume, and the electrically conductive filler and the metal compound filler are distributed in the polymer. The metal compound filler has a particle size D50 of 2-15 m and 5-20% by volume and is selected from the group consisting of aluminum nitride, aluminum hydroxide, aluminum oxide, titanium oxide and zirconium oxide. The over-current protection device has a resistivity of 0.7-1.2 .Math.cm.

A over-current protection device includes a positive temperature coefficient (PTC) polymeric element having two opposite surfaces, two electrodes respectively connected to the surfaces of the PTC polymeric element, and a power-free trip indicator disposed on at least one of the electrodes for sensing temperature of the over-current protection device.

A PTC device comprises a laminated substrate, a first PTC material layer, a second PTC material layer, a first metal layer and a second metal layer. The laminated substrate comprises a first conductive layer, a second conductive layer and an insulating layer laminated between the first and second conductive layers. The first PTC material layer is disposed on the first conductive layer, and the second PTC material layer is disposed on the second conductive layer. The first metal layer is disposed on the first PTC material layer, and the second metal layer is disposed on the second PTC material layer. The insulating layer has a through hole filled with PTC material to form a PTC connecting member of which one end connects to the first PTC material layer and another end connects to the second PTC material layer.

A PPTC assembly may include a PPTC component, having a trip temperature, and further comprising a first temperature coefficient of resistance, in a low temperature range below the trip temperature. The PPTC assembly may include a resistive component, disposed in electrical contact with the PPTC component on a first side of the PPTC component, the resistive component comprising an electrical conductor, and having a second temperature coefficient of resistance in the low temperature range, less than the first temperature coefficient of resistance. The PPTC component may include a first electrode, electrically coupled to the first side of the PPTC component, and a second electrode, electrically coupled to the second side of the PPTC component, where the PPTC component and the resistive component are arranged in electrical series between the first electrode and the second electrode.

A thermistor element includes an element body made of ceramic and including first and second end surfaces opposite to each other and a peripheral surface located between the first end surface and the second end surface, first and second external electrodes respectively covering the first and second end surfaces and portion of the peripheral surface adjacent to the respective first and second end surfaces. The first and second external electrodes include electrode layers including an underlayer and a metal plating layer, the underlayer of the first external electrode includes, adjacent to or in a vicinity of the second external electrode, two second external electrode side corner portions that are thin and adjacent to each other, and the underlayer of the second external electrode includes, adjacent to or in a vicinity of the first external electrode, two first external electrode side corner portions that are thin and adjacent to each other.

A PTC thermistor element for a tempering device may include a main body, which may have a positive temperature coefficient. The main body may have PTC thermistor components, a core, and ceramics components at least in the core. The PTC thermistor components may have a positive temperature coefficient, and the ceramics components may have a thermal conductivity of at least 2.5 W/mK. The ceramics components may be disposed in a distributed manner.

A PPTC device including a PPTC body, a first electrode, disposed on a first side of the fuse component, a second electrode, disposed on a second side of the PPTC body, wherein the PPTC body comprises a polymer matrix and a conductive filler.

A composite circuit protection device includes a positive temperature coefficient (PTC) component, a voltage-dependent resistor, a first conductive lead and a second conductive lead. The PTC component includes a PTC polymeric layer, and first and second electrode layers respectively disposed on two opposite surfaces of the PTC polymeric layer. The voltage-dependent resistor is connected to the second electrode layer of the PTC component. The first and second conductive leads are respectively bonded to the first electrode layer of the PTC component and the voltage-dependent resistor. The PTC component has a rated voltage ranging between 40% and 200% of a varistor voltage of the voltage-dependent resistor.

A PTC heating element and an electric heating device containing such a PTC heating element are disclosed. The PTC heating element comprises two insulating layers with a metallic coating provided on one side and a PTC element arranged therebetween which is provided on oppositely disposed main side surfaces with a respective metallization which is electrically conductively connected to the coating of one of the insulating layers. The metallization provided on one of the main side surfaces is assigned only to one potential for energizing the PTC element. The metallization provided on the other main side surface is assigned to only the other potential for energizing the PTC element. The metallization of the one main side surface of the PTC element and the metallization of the other main side surface of the PTC element are formed in such a way that the current path (P) through the PTC element is extended relative to the thickness (D) of the PTC element.