Patent classifications
H01C7/021
PTC THERMISTOR MODULE
A PTC thermistor module for a temperature control device may include at least one PTC thermistor element. The PTC thermistor element may include an upper side and an underside facing away from the upper side. The upper side and on the underside may be respectively applied in a heat-exchanging manner with a heat-conducting plate. An edge side, connecting the upper side and the underside with one another in an edge-side manner, of at least one of the PTC thermistor elements, may be applied to a heat-conducting element, which has a thermal conductivity of at least 5 W/mK. A temperature control device may include at least one such PTC thermistor module.
OVER-CURRENT PROTECTION DEVICE
An over-current protection device includes first and second electrode layers and a PTC material layer laminated therebetween. The PTC material layer includes a polymer matrix, and a conductive filler. The polymer matrix has a fluoropolymer. The total volume of the PTC material layer is calculated as 100%, and the fluoropolymer accounts for 47-62% by volume of the PTC material layer. The fluoropolymer has a melt viscosity higher than 3000 Pa.Math.s.
OVER-CURRENT PROTECTION DEVICE
An over-current protection device includes a first metal layer, a second metal layer and a heat-sensitive layer laminated therebetween. The heat-sensitive layer exhibits a positive temperature coefficient (PTC) characteristic and includes a polymer matrix and a first conductive filler. The polymer matrix includes a polyolefin-based polymer and a fluoropolymer. The fluoropolymer has a melt flow index higher than 1.9 g/10 min, and the polyolefin-based polymer and the fluoropolymer together form an interpenetrating polymer network (IPN). The first conductive filler has a metal-ceramic compound dispersed in the polymer matrix.
Multi-Layered Component and Method for Producing a Multi-Layered Component
A multi-layered component and a method for producing a multi-layered component are disclosed. In an embodiment a multi-layered component includes an inert ceramic substrate and at least one functional ceramic, wherein the functional ceramic is completely enclosed by the ceramic substrate.
HIGH HOLD CURRENT AND HIGH VOLTAGE ENDURANCE PPTC MATERIAL, DEVICE, AND METHOD OF FABRICATION
A polymer positive temperature coefficient (PPTC) material is provided. The PPTC material may include a polymer matrix that defines a PPTC body, and further includes a high temperature polymer. The PPTC material may include a conductive filler component, disposed in the polymer matrix, an arc suppressant, and a high temperature antioxidant, disposed in the polymer matrix.
Over-current protection device
An over-current protection device includes first and second electrode layers and a PTC material layer laminated therebetween. The PTC material layer includes a polymer matrix, a conductive filler, and a titanium-containing dielectric filler. The polymer matrix has a fluoropolymer. The titanium-containing dielectric filler has a compound represented by a general formula of MTiO.sub.3, wherein the M represents transition metal or alkaline earth metal. The total volume of the PTC material layer is calculated as 100%, and the titanium-containing dielectric filler accounts to for 5-15% by volume of the PTC material layer.
SENSOR DEVICE
A sensor device includes a detection resistor having a resistance value changing according to a physical quantity and a reference resistor compared with the detection resistor, the reference resistor is configured by electrically connecting a first resistance circuit and a second resistance circuit. The first resistance circuit includes a first and a second resistive element having positive and negative resistance temperature coefficients, respectively, which are electrically connected. The second resistance circuit includes a third and a fourth resistive elements having a positive and a negative resistance temperature coefficient, respectively, which are electrically connected. The first resistance circuit is configured to generate a first deviation to either the positive or negative side with respect to a temperature change, and the second resistance circuit is configured to generate a second deviation to the side opposite to the positive or negative side where the first deviation is generated.
Over-current protection device
An over-current protection device includes first and second electrodes, and a positive temperature coefficient multilayered structure including first, second, and third polymer layers. The first polymer layer is bonded to the first electrode and includes a polymer matrix made from a polymer composition containing a grafted olefin-based polymer. The second polymer layer has a through hole and includes a polymer matrix made from a polymer composition containing a non-grafted olefin-based polymer and substantially free of a grafted olefin-based polymer. The third polymer layer is bonded to the second electrode and includes a polymer matrix made from a polymer composition containing a grafted olefin-based polymer.
Integrated over-current protection device
An integrated over-current protection device includes a positive temperature coefficient (PTC) component, a first conductive unit, a second conductive unit, a first conductive via, and a second conductive via. The PTC component includes a first PTC body, and has opposing first and second surfaces. The first conductive unit is disposed on the first surface, and includes a first electrode and a first conductive pad electrically insulated from the first electrode. The second conductive unit is disposed on the second surface, and includes a second electrode and a second conductive pad electrically insulated from the second electrode. The first conductive via extends through the first conductive unit and the PTC component to electrically connect the first electrode to the second conductive pad. The second conductive via extends through the second conductive unit and the PTC component to electrically connect the second electrode to the first conductive pad.
Ceramic electronic component and manufacturing method therefor
A ceramic electronic component that includes a ceramic element, and a coating film and external electrodes that are provided on the surface of the ceramic element. The coating film is selectively formed on the surface of the ceramic element by applying, to the ceramic electronic component, a resin-containing solution containing at least one anion of a sulfuric acid, a sulfonic acid, a carboxylic acid, a phosphoric acid, a phosphoric acid, and a hydrofluoric acid.