Patent classifications
H01C7/028
Conductive polymer electronic devices with surface mountable configuration and methods for manufacturing same
Surface-mountable conductive polymer devices include a conductive polymer layer between first and second electrodes, on which are disposed first and second insulation layers, respectively. First and second planar conductive terminals are on the second insulation layer. A first cross-conductor connects the second electrode to the first terminal, and is separated from the first electrode by a portion of the first insulation layer. A second cross-conductor connects the first electrode to the second terminal, and is separated from the second electrode by a portion of the second insulation layer. In some embodiments, at least one cross-conductor includes a beveled portion through the first insulation layer to provide enhanced adhesion between the cross-conductor and the first insulation layer, while allowing greater thermal expansion without undue stress. In other embodiments, these advantages are achieved by having at least one cross-conductor in physical contact with a metallized anchor pad on the first insulation layer.
ELECTRICALLY CONDUCTIVE PTC INK WITH DOUBLE SWITCHING TEMPERATURES AND APPLICATIONS THEREOF IN FLEXIBLE DOUBLE-SWITCHING HEATERS
A double-switching heater includes a double-switching PTC ink deposited on a substrate to form one or more resistors. The double-switching PTC ink has a first resin that provides a first PTC effect at a first temperature range and a second resin that provides a second PTC effect at a second temperature range, where the second temperature range is higher than the first temperature range. The substrate may be a flexible substrate or a rigid substrate, and may bedeformable to generate a three-dimensional structure. The substrate may be: polyester, polyimide, polyamide, polypropylene, thermoplastic polyurethane, fiberglass, cement board, carbon composite materials, polyethylene terephthalate, polyethylene, aluminum, steel, glass composite, molded plastic, high-density polyethylene or styrene ethylene butylene styrene.
PTC composition and over-current protection device containing the same
A PTC composition comprises crystalline polymer and conductive filler. The conductive filler comprises tungsten carbide powder dispersed in the crystalline polymer, and the tungsten carbide powder comprises impurity of less than 7% by weight. The impurity comprises the materials other than tungsten monocarbide.
Electrical device
An electrical device having first and second electrodes and a layer of a conductive composite electrically in contact with the first and second electrodes. The conductive composite is a mixture of a semi-crystalline polymer and a conductive filler, the conductive filler including a plurality of particles containing an inner material including a first metal; and an outer material surrounding the inner material, the outer material including a second metal; and an intermetallic compound formed between the inner material and the outer material. The intermetallic compound has features from the inner material and the outer material. The device can be a circuit protection device. Also provided is a method of making a conductive composite by dry mixing the components.
CONDUCTIVE POLYMER ELECTRONIC DEVICES WITH SURFACE MOUNTABLE CONFIGURATION AND METHODS FOR MANUFACTURING SAME
Surface-mountable conductive polymer devices include a conductive polymer layer between first and second electrodes, on which are disposed first and second insulation layers, respectively. First and second planar conductive terminals are on the second insulation layer. A first cross-conductor connects the second electrode to the first terminal, and is separated from the first electrode by a portion of the first insulation layer. A second cross-conductor connects the first electrode to the second terminal, and is separated from the second electrode by a portion of the second insulation layer. In some embodiments, at least one cross-conductor includes a beveled portion through the first insulation layer to provide enhanced adhesion between the cross-conductor and the first insulation layer, while allowing greater thermal expansion without undue stress. In other embodiments, these advantages are achieved by having at least one cross-conductor in physical contact with a metallized anchor pad on the first insulation layer.
OVER-CURRENT PROTECTION DEVICE
An over-current protection device includes an electrode layer and a heat-sensitive layer. The heat-sensitive layer exhibits a positive temperature coefficient (PTC) characteristic, and is laminated between a top metal layer and a bottom metal layer of the electrode layer. The heat-sensitive layer includes a polymer matrix and a conductive filler. The polymer matrix includes a fluoropolymer. The fluoropolymer has a plurality of spherulites, and the fractal dimension of each spherulite is lower than 12.
Conductive polymer electronic devices with surface mountable configuration and methods for manufacturing same
Surface-mountable devices include a conductive polymer layer between first and second electrodes, on which are disposed first and second insulation layers, respectively, with first and second planar terminals on the second insulation layer. A first cross-conductor connects the second electrode to the first terminal, and is separated from the first electrode by a portion of the first insulation layer. A second cross-conductor connects the first electrode to the second terminal, and is separated from the second electrode by a portion of the second insulation layer. At least one cross-conductor may include a beveled portion through the first insulation layer. Alternatively, at least one cross-conductor may contact an anchor pad on the first insulation layer, the anchor pad having a small area relative to the areas of the terminals. Enhanced adhesion between the cross-conductor(s) and the first insulation layer is provided, while allowing thermal expansion without excessive stress.
Macromolecule-based conductive composite material and PTC element
A macromolecule-based conductive composite material and a PTC element. The macromolecule-based conductive composite material comprises: a macromolecule base material, having a volume fraction of the macromolecule base material of 20%-75%; a conductive filler with a core-shell granule structure and dispersed in the macromolecule base material, having a volume fraction of 25%-80%; and a coupling agent, being a titanate coupling agent and accounting for 0%-5% of the volume of the conductive filler. The PTC element prepared by using the macromolecule-based conductive composite material comprises at least two metal electrode plates (12, 12), a macromolecule-based conductive composite material (11) being closely combined with the metal electrode plates (12, 12). The PTC element prepared from the macromolecule-based conductive composite material has the advantages of low room-temperature resistivity, outstanding weather durability, good voltage resistance and good resistor repeatability.
PPTC DEVICE INCLUDING MULTILAYER ELECTRODES
Approaches provided herein include a protection device assembly including multilayer electrodes. In some embodiments, a protection device assembly may include a protection component, a first electrode layer extending along a first main side of the protection component, and a second electrode layer extending along a second main side of the protection component. The protection device assembly may further include a first substrate layer disposed over at least one of: the first electrode layer, and the second electrode layer, a foil layer disposed over the first substrate layer, wherein the foil layer is partially separated from the first electrode layer by the first substrate layer, and a solder pad extending around an end of the protection component and the first substrate layer, wherein the solder pad is in contact with the foil layer.
RAPID REACTION PTC CIRCUIT PROTECTION DEVICE
A positive temperature coefficient (PTC) circuit protection device including a dielectric substrate layer, first and second high resistance layers disposed on a top surface of the substrate layer in a spaced apart relationship to define a gap therebetween, a PTC layer disposed on the top surface of the substrate layer in the gap and in contact with the first and second high resistance layers, a mask layer covering a top surface of the PTC layer and portions of top surfaces of the first and second high resistance layers, an electrically conductive first terminal covering a first longitudinal end of the substrate layer and an outermost end of the first high resistance layer distal from the PTC layer, and an electrically conductive second terminal covering a second longitudinal end of the substrate layer and an outermost end of the second high resistance layer distal from the PTC layer.