H01C7/049

Dielectric material

Provided are a novel dielectric material and a novel electrostrictive material. The dielectric material or electrostrictive material comprises a charge-separation type non-coulombic ionic solid in which complex cations each composed of a metal element and a ligand are aggregated to form cation clusters, the cation clusters are arranged in a closest packed structure, and anions are aggregated to form anion clusters in interstices of the closest packed structure.

Temperature sensor element

There is provided a temperature sensor element including a pair of electrodes and a temperature-sensitive film disposed in contact with the pair of electrodes, in which the temperature-sensitive film includes a matrix resin and a plurality of conductive domains contained in the matrix resin, the conductive domains include a conjugated polymer and a dopant, and the number of structural units constituting the conjugated polymer is 65 or less.

TEMPERATURE SENSOR

A temperature sensor that includes an organic-inorganic composite negative temperature coefficient thermistor and a transistor. The organic-inorganic composite negative temperature coefficient thermistor includes a thermistor layer which includes spinel-type semiconductor ceramic composition powder containing Mn, Ni and Fe and an organic polymer component, and a pair of electrode layers. The semiconductor ceramic composition powder has a molar ratio of Mn to Ni of 85/15Mn/Ni65/35 and a Fe content of 30 parts by mole or less when a total molar amount of Mn and Ni is regarded as 100 parts by mole, and has a peak with a local maximum value of around 29 to 31 in its X-ray diffraction pattern, a half width of which peak is 0.15 or more. The transistor is electrically connected with either one of the pair of electrode layers.

NOVEL DIELECTRIC MATERIAL

Provided are a novel dielectric material and a novel electrostrictive material. The dielectric material or electrostrictive material comprises a charge-separation type non-coulombic ionic solid in which complex cations each composed of a metal element and a ligand are aggregated to form cation clusters, the cation clusters are arranged in a closest packed structure, and anions are aggregated to form anion clusters in interstices of the closest packed structure.

Polymer-carbon composites for temperature-dependent electrical switching applications

Disclosed here is a method for sensing temperature-dependent electrical switching response, comprising: exposing a polymer-carbon composite to a temperature change, wherein the polymer-carbon composite comprises (a) a semi-conductive or conductive carbon network intercalated with (b) a polymer matrix, wherein the carbon network comprises at least one covalently bonded carbon material, and wherein the polymer matrix comprises at least one polymer having a net electron withdrawing character and adapted to apply a gating effect on the conductive carbon; and detecting a change in electrical conductivity of the polymer-carbon composite of at least three orders of magnitude. Also disclosed is a smart switching device comprising the polymer-carbon composite and a switch triggerable by an increase or decrease in electrical conductivity of the polymer-carbon composite of at least three orders or magnitude.

TEMPERATURE SENSING TAPE

A temperature sensing tape including a flexible, electrically insulating substrate, a plurality of temperature sensing elements disposed on the substrate, each temperature sensing element including a first electrode and a second electrode arranged in a confronting, spaced-apart relationship to define a gap therebetween, and a variable resistance material disposed within the gap and connecting the first electrode to the second electrode, wherein the first electrode of at least one of the temperature sensing elements is connected to the second electrode of an adjacent temperature sensing element by a flexible electrical conductor.

IONICALLY CONDUCTIVE COMPOSITION FOR USE IN A THERMAL SENSOR
20240280416 · 2024-08-22 ·

The present invention relates a thermal sensor comprising an ionically conductive composition and a conductive layer, wherein said ionically conductive composition comprises an ionic liquid and a thermoplastic resin. The thermal sensor according to the present invention can be used for sensing a temperature from skin, a metal surface, and a conductive polymer.

A COMPOSITE THERMISTOR ELEMENT
20240304362 · 2024-09-12 ·

A composite thermistor element is described. The element includes a sensor material that is disposed between a pair of electrodes. The sensor material includes particles in a dielectric matrix. Each of the particles have: a core having a temperature dependent resistance, and a cover layer of an inorganic material. The particles form an electron conducting pathway between the electrodes having a temperature dependent resistance and a base-line resistance. Further aspects relate to a method of manufacturing the thermistor, the coated particles, a composition for use in the manufacturing of composite thermistors that includes the particles, and to a temperature sensor including the thermistor described herein.

TEMPERATURE SENSOR
20180164162 · 2018-06-14 ·

A temperature sensor that includes a first electrode layer, a second electrode layer, and a thermistor layer between the first and second electrode layers. The thermistor layer includes a spinel-type semiconductor ceramic composition powder containing Mn, Ni, and Fe, and an organic polymer component. In the semiconductor ceramic composition powder, the molar ratio of Mn to Ni is 85/15Mn/Ni65/35, and when the total molar quantity of Mn and Ni is 100 parts by mole, the content of Fe is 30 parts by mole or less, and the semiconductor ceramic composition powder is 2 m or less in particle size.

IMPROVED NEGATIVE TEMPERATURE COEFFICIENT THERMISTOR
20240371550 · 2024-11-07 ·

A negative temperature coefficient type thermistor that comprises at least two conductor terminals and a thermistor structure formed of particles of lithium manganese oxide in a spinel structure within a polymer binder. The thermistor is configured to operate in a temperature range below a predefined first temperature and the polymer binder is selected so that its heat distortion temperature is higher than the first temperature. The manufacturing process further includes a stage of calendaring the thermistor structure in a temperature that is higher than the heat distortion temperature of the polymer binder.