The invention is to provide a chip resistor suitable for lowering an initial resistance value. A chip resistor 1 according to the present invention is provided with: an insulating substrate 2; a pair of front electrodes 3 which are provided on a front surface of the insulating substrate 2 so as to face each other with a predetermined interval therebetween; a resistive element 4 which is provided so as to bridge the front electrodes 3; a pair of auxiliary electrodes 5 which are provided so as to cover the front electrodes 3 and overlap end portions of the resistive element 4; and the like. The chip resistor 1 is configured such that: the front electrodes 3 are formed of a material which contains 1 to 5 wt % Pd and the balance Ag; and the auxiliary electrodes 5 are formed of a material which contains 15 to 30 wt % Pd and a metal material (e.g. Au) lower in resistivity than Pd and the balance Ag.

There is provided a resistor in which a first resistive part of a resistive element that electrically conducts between a pair of electrodes formed on either end of an insulating substrate has a meandering pattern meandering on the substrate surface and a swelling pattern that has a form in which a part of the meandering pattern swells out from the stroke width of the meandering pattern, a second resistive part that is electrically connected in series to the first resistive part is shorter than the entire length of the first resistive part, and has a wider width than the stroke width of the meandering pattern, and a trimming groove is formed in at least either the swelling pattern or the second resistive part. This can improve resistance accuracy and provide a high voltage resistor with high withstand voltage property.

There is provided a resistor in which a first resistive part of a resistive element that electrically conducts between a pair of electrodes formed on either end of an insulating substrate has a meandering pattern meandering on the substrate surface and a swelling pattern that has a form in which a part of the meandering pattern swells out from the stroke width of the meandering pattern, a second resistive part that is electrically connected in series to the first resistive part is shorter than the entire length of the first resistive part, and has a wider width than the stroke width of the meandering pattern, and a trimming groove is formed in at least either the swelling pattern or the second resistive part. This can improve resistance accuracy and provide a high voltage resistor with high withstand voltage property.

A circuit board structure includes a multi-layer board and a ceramic resistor embedded in the multi-layer board. The ceramic resistor includes a ceramic sheet, a plurality of connecting pads spacedly arranged on the ceramic sheet, and a plurality of resistance layers arranged on the ceramic sheet. At least one of the resistance layers is arranged between and electrically connected to any two of the connecting pads for providing a resistance value. The number of the resistance values provided by the ceramic resistor is more than the number of the resistance layers. The multi-layer board has a plurality of contacts arranged apart from each other, and the contacts are respectively and electrically connected to the connecting pads.

A circuit board structure includes a multi-layer board and a ceramic resistor embedded in the multi-layer board. The ceramic resistor includes a ceramic sheet, a plurality of connecting pads spacedly arranged on the ceramic sheet, and a plurality of resistance layers arranged on the ceramic sheet. At least one of the resistance layers is arranged between and electrically connected to any two of the connecting pads for providing a resistance value. The number of the resistance values provided by the ceramic resistor is more than the number of the resistance layers. The multi-layer board has a plurality of contacts arranged apart from each other, and the contacts are respectively and electrically connected to the connecting pads.

The present invention concerns a layer structure comprising: a substrate having a glass or ceramic surface, a layer A at least partially covering the glass or ceramic surface of the substrate, wherein layer A comprises a glass in which at least two mutually different elements are contained as oxides, and a layer B at least partially covering the layer A. Layer B comprises: a resistance alloy having a temperature coefficient of electrical resistance less than 150 ppm/K, and optionally a glass containing at least two mutually different elements as oxides. Layer B contains not more than 20 weight percent of glass based on the total weight of layer B.

Systems and methods are provided for presenting branding elements with electronic content. In one implementation, a method is provided that includes receiving, from a user device, a request that identifies a segment of electronic content and that contains information specifying a display configuration of the user device. The method further includes selecting first metadata including information defining how at least one branding element is to be presented based on the display configuration of the user device, and selecting second metadata for the requested segment of electronic content, the second metadata including information related to presenting the requested segment of electronic content. Additionally, the method includes instructing the user device to generate a presentation based on the selected first metadata and the selected second metadata, the presentation including the requested segment of electronic content and the at least one branding element.

To provide a zinc oxide-based varistor that exhibits adequate characteristics without using antimony. Disclosed is a sintered body for a varistor, including zinc oxide as a main component; 0.6 to 3.0 mol % of bismuth oxide in terms of bismuth (Bi); 0.2 to 1.4 mol % of cobalt oxide in terms of cobalt (Co); 0.1 to 1.5 mol % of chrome oxide in terms of chrome (Cr); and 0.1 to 1.5 mol % of manganese oxide in terms of manganese (Mn), wherein the contents of antimony (Sb), a rare earth element and tin (Sn) are not more than a level of impurities.

This application relates to a heating unit and a method for manufacturing the same. The heating unit according to an exemplary embodiment of this application includes a substrate, a transmittance adjusting layer which is provided on the substrate and includes one or more selected from a group consisting of Ni, Cr, Mo, Pt, and Ti; and a conductive heating pattern provided on the transmittance adjusting layer.

This application relates to a heating unit and a method for manufacturing the same. The heating unit according to an exemplary embodiment of this application includes a substrate, a transmittance adjusting layer which is provided on the substrate and includes one or more selected from a group consisting of Ni, Cr, Mo, Pt, and Ti; and a conductive heating pattern provided on the transmittance adjusting layer.