Patent classifications
H01C17/065
Ceramic member and electronic device
A ceramic member includes a perovskite compound including La, Ca, Mn, and Ti as main components, wherein the amount of Ti is about 5 parts by mole or more and about 20 parts by mole or less, the amount of Ca is about 10 parts by mole or more and about 27 parts by mole or less, and the total amount of La and Ca is about 85 parts by mole or more and about 97 parts by mole or less based on the total amount of Mn and Ti of 100 parts by mole.
Highly sensitive reduced graphene oxide-nickel composite based cryogenic temperature sensor
The present disclosure generally relates to the field of resistive sensing. In particular, the present disclosure relates to a highly sensitive reduced graphene oxide-nickel (RGO—Ni) composite based fast response temperature sensor. Aspects of the present disclosure provide a method for fabrication of a highly sensitive reduced graphene oxide-nickel (RGO—Ni) composite-based temperature sensor. An aspect of the present disclosure provides a temperature sensor comprising: a substrate; and a composite film deposited onto said substrate, wherein the composite film comprises a reduced graphene oxide-nickel composite film. In an embodiment, the temperature sensor is cryo-compatible.
METHOD FOR MANUFACTURING RESISTOR
A method for manufacturing a resistor is described. First and second division lines are formed in a first surface of a substrate to define device areas. First and second electrodes are formed on the first surface and respectively on the device areas. Third electrodes, fourth electrodes, and resistive layers are formed on a second surface of the substrate and respectively on the device areas. The substrate is diced from the second surface by a cutting tool to form bar structures to expose opposite first and second side surfaces of the device areas. First and second terminal electrodes are formed to respectively cover the first and second side surfaces. The bar structures are diced from the second surface by the cutting tool to separate the device areas. The cutting tool is aligned with the first and second division lines respectively while dicing the substrate and the bar structures.
METHOD FOR MANUFACTURING RESISTOR
A method for manufacturing a resistor is described. First and second division lines are formed in a first surface of a substrate to define device areas. First and second electrodes are formed on the first surface and respectively on the device areas. Third electrodes, fourth electrodes, and resistive layers are formed on a second surface of the substrate and respectively on the device areas. The substrate is diced from the second surface by a cutting tool to form bar structures to expose opposite first and second side surfaces of the device areas. First and second terminal electrodes are formed to respectively cover the first and second side surfaces. The bar structures are diced from the second surface by the cutting tool to separate the device areas. The cutting tool is aligned with the first and second division lines respectively while dicing the substrate and the bar structures.
PPTC ACTUATOR HEATER
A novel heater is disclosed for a temperature sensitive actuator. The heater is a polymeric positive temperature coefficient (PPTC) device consisting of conductive filler and semi-crystalline polymer. The PPTC heater is strategically designed to have a predetermined self-regulation temperature suited to whatever application utilizes the heater. Physical characteristics of the PPTC heater, such as gap width and thickness, enable the current flow through the heater to be strategically controlled.
SYSTEMS AND METHODS OF ADDITIVE PRINTING OF FUNCTIONAL ELECTRONIC CIRCUITS
A composition, method, and system for directly printing and creating complete functional 3D electronic circuits and devices without any thermal or laser post-processing treatment, by using at least Triphenylamine (TPA) as a powder binding agent. The composition can have mechanical characteristics that allow it to be melted and extruded on a structure, and electrical properties that allow it to function as at least one of a conductor, insulator, resistor, p-type semiconductor, n-type semiconductor, or capacitor.
THERMISTOR AND METHOD FOR PRODUCING SAID THERMISTOR
A thermistor having a ceramic main body, which contains a ceramic material as the main constituent. The ceramic main body has at least one electrically insulating layer. The electrically insulating layer is arranged within the ceramic main body and contains a main component which has a composition different from the ceramic material.
THERMISTOR AND METHOD FOR PRODUCING SAID THERMISTOR
A thermistor having a ceramic main body, which contains a ceramic material as the main constituent. The ceramic main body has at least one electrically insulating layer. The electrically insulating layer is arranged within the ceramic main body and contains a main component which has a composition different from the ceramic material.
Systems and methods of additive printing of functional electronic circuits
A composition, method, and system for directly printing and creating complete functional 3D electronic circuits and devices without any thermal or laser post-processing treatment, by using at least Triphenylamine (TPA) as a powder binding agent. The composition can have mechanical characteristics that allow it to be melted and extruded on a structure, and electrical properties that allow it to function as at least one of a conductor, insulator, resistor, p-type semiconductor, n-type semiconductor, or capacitor.
Resistor and circuit substrate
A resistor according to the present disclosure includes an insulated substrate, a resistive layer formed of a resistance body material and a bonding layer for bonding the insulated substrate and the resistive layer, wherein the resistor is configured so that a ratio of a sheet resistance of the bonding layer to a sheet resistance of the resistive layer is 100 or more.