Patent classifications
H01C17/23
HEATER MODULE
A heater module includes a heater assembly including a heater and a temperature sensor thermally coupled to the heater, and a trimmable resistor electrically coupled to the temperature sensor or to the heater.
TRIMMABLE RESISTOR CIRCUIT AND METHOD FOR OPERATING THE TRIMMABLE RESISTOR CIRCUIT
A trimmable resistor circuit and a method for operating the trimmable resistor circuit are provided. The trimmable resistor circuit includes first sources/drains and first gate structures alternatively arranged in a first row, second sources/drains and second gate structures alternatively arranged in a second row, third sources/drains and third gate structures alternatively arranged in a third row, first resistors disposed between the first row and the second row, and second resistors disposed between the second row and the third row. In the method for operating the trimmable resistor circuit, the first gate structures in the first row and the third gate structures in the third row are turned on. Then, the second gate structures in the second row are turned on/off according to a predetermined resistance value.
THIN FILM RESISTOR HAVING SURFACE MOUNTED TRIMMING BRIDGES FOR INCREMENTALLY TUNING RESISTANCE
A resistor assembly is disclosed and comprises a first conductive trace, a second conductive trace, and a plurality of trimming bridges that electrically couple the first conductive trace to the second conductive trace. The resistor assembly also comprises a thin film resistor electrically coupled to the first conductive trace. The first conductive trace, the second conductive trace, the plurality of trimming bridges, and the thin film resistor are all part of a surface mounted layer of the resistor assembly. The plurality of trimming bridges are each removable to increase a resistance of the thin film resistor.
METAL PLATE RESISTOR AND MANUFACTURING METHOD THEREOF
In a metal plate resistor according to the present disclosure, each of a pair of electrodes includes a first portion and a second portion. The first portion protrudes from one surface of a resistive element to be in contact with an end of a protection film. The second portion is disposed in a corresponding recess of a pair of recesses. In a direction in which the pair of electrodes is arranged, the second portion has a length longer than a length of the first portion.
Trimmable resistor circuit and method for operating the trimmable resistor circuit
A trimmable resistor circuit and a method for operating the trimmable resistor circuit are provided. The trimmable resistor circuit includes first sources/drains and first gate structures alternatively arranged in a first row, second sources/drains and second gate structures alternatively arranged in a second row, third sources/drains and third gate structures alternatively arranged in a third row, first resistors disposed between the first row and the second row, and second resistors disposed between the second row and the third row. In the method for operating the trimmable resistor circuit, the first gate structures in the first row and the third gate structures in the third row are turned on. Then, the second gate structures in the second row are turned on/off according to a predetermined resistance value.
Method of manufacturing a chip component
A method for manufacturing a chip component includes forming an element, which includes a plurality of element parts, on a substrate. A plurality of fuses are formed, for disconnectably connecting each of the plurality of element parts to an external connection electrode. The external connection electrode, which is arranged to provide external connection for the element, is formed by electroless plating on the substrate.
Method of manufacturing a chip component
A method for manufacturing a chip component includes forming an element, which includes a plurality of element parts, on a substrate. A plurality of fuses are formed, for disconnectably connecting each of the plurality of element parts to an external connection electrode. The external connection electrode, which is arranged to provide external connection for the element, is formed by electroless plating on the substrate.
Metal plate resistor and method for manufacturing same
An object of the present disclosure is to provide a metal plate resistor that is capable of reducing a resistance value and a TCR. A metal plate resistor according to the present disclosure includes: a resistor body that includes a metal plate having an upper surface and a lower surface that are spaced apart from each other in a thickness direction; a pair of electrodes that include a metal having a low electrical resistivity and a high TCR in comparison with this resistor body, the pair of electrodes being formed in both ends of the lower surface of the resistor body; and an internal electrode that is formed on the upper surface of the resistor body. The internal electrode includes a metal having a low electrical resistivity in comparison with the resistor body.
Thin film resistor having surface mounted trimming bridges for incrementally tuning resistance
A resistor assembly is disclosed and comprises a surface mounted layer comprising a first conductive trace, a second conductive trace, and a plurality of trimming bridges that electrically couple the first conductive trace to the second conductive trace. The resistor assembly also comprises a second layer disposed underneath the surface mounted layer. The second layer comprises an embedded thin film resistor electrically coupled to the surface mounted layer. The plurality of trimming bridges are each removable to increase a resistance of the embedded thin film resistor. The resistor assembly also comprises a plurality of vias that electrically couple the first conductive trace of the surface mounted layer to the embedded thin film resistor.
METAL PLATE RESISTOR AND METHOD FOR MANUFACTURING SAME
An object of the present disclosure is to provide a metal plate resistor that is capable of reducing a resistance value and a TCR. A metal plate resistor according to the present disclosure includes: a resistor body that includes a metal plate having an upper surface and a lower surface that are spaced apart from each other in a thickness direction; a pair of electrodes that include a metal having a low electrical resistivity and a high TCR in comparison with this resistor body, the pair of electrodes being formed in both ends of the lower surface of the resistor body; and an internal electrode that is formed on the upper surface of the resistor body. The internal electrode includes a metal having a low electrical resistivity in comparison with the resistor body.