A method of fabricating an integrated circuit (IC) includes providing a substrate having a semiconductor surface layer comprising an unpatterned resistive layer. Measurements are obtained of a characteristic of the unpatterned resistive layer at each of a plurality of locations over the substrate. The unpatterned resistive layer is modified, such as by targeted removal of layer material, in response to the measurements such that the measured characteristic is more uniform across the substrate. A resistor on the IC is defined from the unpatterned resistive layer after the modifying.

In a method of manufacturing a cartridge of an electronic vaping device, wherein the cartridge includes a pre-vapor formulation storage element, an electrical resistor is physically manipulated to change a resistance of the electrical resistor from a first resistance value to a second resistance value, the second resistance value indicative of a pre-vapor formulation substrate contained in the pre-vapor formulation storage element. The electrical resistor is then mounted to a portion of the cartridge.

In a method of manufacturing a cartridge of an electronic vaping device, wherein the cartridge includes a pre-vapor formulation storage element, an electrical resistor is physically manipulated to change a resistance of the electrical resistor from a first resistance value to a second resistance value, the second resistance value indicative of a pre-vapor formulation substrate contained in the pre-vapor formulation storage element. The electrical resistor is then mounted to a portion of the cartridge.

A circuit and method provide improved trimming of a DCR sensing circuit where a sensing element is sensitive to self-heating or having a large tolerance. The circuit includes a resistive divider circuit coupled to a sensing element. The resistive divider circuit includes a trim resistor and two test points. Prior to trimming the trim resistor, an actual resistance of the sensing element is determined. A target voltage across the trim resistor to be trimmed is calculated according to the determined sensing element resistance and a known small trim current that is to be injected into the circuit during the trimming process. This injected trim current has a low current value so there is no self-heating of the sensing element. Then, the trim resistor is trimmed while injecting this small trim current into the resistive divider circuit and the voltage across the trim resistor is monitored.

A circuit and method provide improved trimming of a DCR sensing circuit where a sensing element is sensitive to self-heating or having a large tolerance. The circuit includes a resistive divider circuit coupled to a sensing element. The resistive divider circuit includes a trim resistor and two test points. Prior to trimming the trim resistor, an actual resistance of the sensing element is determined. A target voltage across the trim resistor to be trimmed is calculated according to the determined sensing element resistance and a known small trim current that is to be injected into the circuit during the trimming process. This injected trim current has a low current value so there is no self-heating of the sensing element. Then, the trim resistor is trimmed while injecting this small trim current into the resistive divider circuit and the voltage across the trim resistor is monitored.

A resistor element includes a base substrate having first and second surfaces opposing each other and first and second end surfaces opposing each other and connecting the first and second surfaces. A first resistor layer is on the first surface of the base substrate. First and second terminals are respectively on the first and second end surfaces. A second resistor layer is on the first resistor layer, is connected to the first and second terminals, and includes a copper-manganese-tin (CuMnSn)-based composition.

A resistor element includes a base substrate having first and second surfaces opposing each other and first and second end surfaces opposing each other and connecting the first and second surfaces. A first resistor layer is on the first surface of the base substrate. First and second terminals are respectively on the first and second end surfaces. A second resistor layer is on the first resistor layer, is connected to the first and second terminals, and includes a copper-manganese-tin (CuMnSn)-based composition.

A sensor device is disclosed comprising at least one deformable substrate, at least one transducer element formed in or on a surface area of a first side of the deformable substrate, at least one other transducer element formed in or on a surface area of a second side of the deformable substrate, and electrical conductors formed on and/or in the substrate for electrically connecting between and to the transducer elements.

A sensor device is disclosed comprising at least one deformable substrate, at least one transducer element formed in or on a surface area of a first side of the deformable substrate, at least one other transducer element formed in or on a surface area of a second side of the deformable substrate, and electrical conductors formed on and/or in the substrate for electrically connecting between and to the transducer elements.

A strain gauge includes a substrate having a surface, a resistor pattern provided on the surface of the substrate, and an adjusting part. The resistor pattern has a pair of terminals, and grid lines coupled to each other in series and forming a zigzag pattern coupled between the pair of terminals. The adjusting part is provided on the zigzag pattern, and includes trim resistors coupled in parallel to one of the grid lines. The trim resistors are arranged at intervals along a direction in which the one of the grid lines of the zigzag pattern extends, and have mutually different lengths along the one of the grid lines of the zigzag pattern.