In a manufacturing method for a thermistor element (3) including: a thermistor portion (49) which is a sintered body formed from a thermistor material; and a pair of electrode wires (25) which are embedded in the thermistor portion (49) and at least one end portion of each of the electrode wires projects at an outer side of the thermistor portion (49), the resistance value of the thermistor element (3) is adjusted by performing a removal processing of removing a part of the thermistor portion (49).

Provided is a method for producing a resistor, including a step of forming a through-hole in a sheet-like conductive material; a step of fitting a resistive element piece into the through-hole and thus forming joint portions where end surfaces of the resistive element piece are joined to respective side surfaces of the conductive material exposed by the through-hole; and stamping a region including the joint portions from the conductive material, thereby forming a resistor including a resistive element and a pair of electrodes.

Provided is a method for producing a resistor, including a step of forming a through-hole in a sheet-like conductive material; a step of fitting a resistive element piece into the through-hole and thus forming joint portions where end surfaces of the resistive element piece are joined to respective side surfaces of the conductive material exposed by the through-hole; and stamping a region including the joint portions from the conductive material, thereby forming a resistor including a resistive element and a pair of electrodes.

A chip resistor element includes an insulating substrate, a resistor layer, first and second internal electrodes, a resistor protection layer, first and second electrode protection layers, and first and second external electrodes. The resistor layer is on the insulating substrate, the first and second internal electrodes are on respective sides of the resistor layer, and the resistor protection layer covers the resistor layer and extends onto portions of the internal electrodes. The first electrode protection layers are on the first and second internal electrodes so as to overlap with portions of the resistor protection layer and contain first conductive powder particles and resin, while the second electrode protection layers are disposed on the first electrode protection layers and contain second conductive powder particles and resin. A content of resin in the second electrode protection layer is lower than in the first electrode protection layer.

A resistor includes a resistive element, a protective film, and a pair of electrodes. The resistive element is made of a metal plate. The protective film is formed on the upper surface of the resistive element. The plated layers are formed to cover the electrodes. The electrodes are separated from each other with the protective film therebetween and are formed at both ends of the upper surface of the resistive element. The electrodes are formed by printing metal-containing paste.

A resistor includes a resistive element, a protective film, and a pair of electrodes. The resistive element is made of a metal plate. The protective film is formed on the upper surface of the resistive element. The plated layers are formed to cover the electrodes. The electrodes are separated from each other with the protective film therebetween and are formed at both ends of the upper surface of the resistive element. The electrodes are formed by printing metal-containing paste.

The present invention discloses a temperature sensor including a main body in which a resistance part is provided, a lead wire bonded to the main body, and an accommodation part having a predetermined depth in a bonded area between the main body and the lead wire to accommodate the lead wire so as to come into contact with the lead wire.

The present invention discloses a temperature sensor including a main body in which a resistance part is provided, a lead wire bonded to the main body, and an accommodation part having a predetermined depth in a bonded area between the main body and the lead wire to accommodate the lead wire so as to come into contact with the lead wire.

A resistor manufacturing method includes a first step of applying a solution wherein conductive nanosized particles with a particle diameter of less than 1 m and an insulating material are at least dispersed, or a solution wherein the conductive nanosized particles covered with an insulating material layer are at least dispersed, in a desired form on a substrate surface, thereby forming a film. The resistor manufacturing method also includes a second step of irradiating one portion of the film with light in a predetermined pattern, and sintering the conductive nanosized particles with the light, thereby forming a resistive film that is a conductive particle layer of the predetermined pattern.

A chip resistor includes a board, first and second electrodes disposed on one surface of the board, and a resistor body electrically connecting the first and second electrodes to each other and including a copper-manganese-tin (CuMnSn) alloy. In the CuMnSn alloy, a percentage of Mn ranges from 11% to 20%, a percentage of Sn ranges from 2% to 8%, and a total percentage of Mn and Sn ranges from 13.5% to 22.5%.