A common mode filter includes a lower cover layer including a first magnetic particle, a filter layer disposed on an upper surface of the lower cover layer, and including a coil portion including a plurality of coils and a coil peripheral portion including a second magnetic particle, and an upper cover layer disposed on an upper surface of the filter layer and including the first magnetic particle.

A semiconductor package includes a VLSI semiconductor die and one or more output circuits connected to supply power to the die mounted to a package substrate. The output circuit(s), which include a transformer and rectification circuitry, provide current multiplication at an essentially fixed conversion ratio, K, in the semiconductor package, receiving AC power at a relatively high voltage and delivering DC power at a relatively low voltage to the die. The output circuits may be connected in series or parallel as needed. A driver circuit may be provided outside the semiconductor package for receiving power from a source and driving the transformer in the output circuit(s), preferably with sinusoidal currents. The driver circuit may drive a plurality of output circuits. The semiconductor package may require far fewer interface connections for supplying power to the die.

An inductor includes a first magnetic core around which a first coil is wound; a second magnetic core disposed to face the first magnetic core and having a second coil wound therearound; and a third magnetic core disposed between the first magnetic core and the second magnetic core, wherein the first magnetic core and the second magnetic core are formed of the same material having a soft magnetic powder, and the third magnetic core is formed of a material having a soft magnetic powder different from the first magnetic core and the second magnetic core.

A coil electronic component includes a body and external terminals. The body includes a winding coil part and a pillar-shaped core part inserted inside of the winding coil part and formed of a magnetic metal. The external terminals are connected to the winding coil part and disposed on an external surface of the body. The body contains the magnetic metal and a resin, and the pillar-shaped core part has magnetic permeability higher than that of a portion of the body disposed outside of the winding coil part.

A reactor 1 according to the present invention includes a coil 2 and a magnetic core 3 where the coil 2 is disposed. In the reactor 1, a core part 4A (4B) including a stacked columnar body having a plurality of core pieces 31m and a plurality of gap members 31g stacked and coating resin 5A (5B) in which a peripheral surface coating portion 51oA (51oB) for coating an outer peripheral surface of the stacked columnar body to integrally hold the core piece 31m and the gap member 31g and an end surface coating portion 51eA for coating one end surface of the stacked columnar body are molded integrally is used for a part of the magnetic core 3, that is, an inner core 31. A manufacturing error of the core piece 31m or the gap member 31g is absorbed by the end surface coating portion 51eA. Consequently, the core part 4A (4B) can be molded with high accuracy and an outer core 32 can be assembled properly. Thus, the reactor 1 has high assembling workability.

Provided is an electromagnetic booster for wireless charging, comprising a magnet part having a magnetic sheet (10) and a coil part (20) disposed on the magnetic sheet, wherein the magnetic sheet is composed of a first magnetic sheet (11) member located at an edge portion and a second magnetic sheet member (12) located in a center portion on the same plane, wherein the first magnetic sheet member and the second magnetic sheet member have different permeability rates from each other.

A magnetic core for an inductive component is produced by thin-film technology, wherein the magnetic core consists of at least two different magnetic materials.

An electrode structure on a circuit board, the electrode structure comprising a metal structure disposed on and electrically connected to the circuit board, wherein the metal structure and a surface of the circuit board forms a space therebetween, wherein at least one first electrical component is disposed in the space and an outer surface of the metal structure forms an electrode for electrically connecting with an external component.

A magnetic circuit component includes a magnetic core and a coil formed by winding a conductor around the magnetic core. The magnetic circuit component includes a magnetic material section that is formed from a soft magnetic material, and that covers a part of a surface of the coil or the entire surface of the coil and is disposed away from the magnetic core.

A magnetic polymer for use in microelectronic fabrication includes a polymer matrix and a plurality of ferromagnetic particles disposed in the polymer matrix. The magnetic polymer can be part of an insulation layer in an inductor formed in one or more backend wiring layers of an integrated device. The magnetic polymer can also be in the form of a magnetic epoxy layer for mounting contacts of the integrated device to a package substrate.