One object is to provide an electronic component in which a standoff for filling solder is maintained. An electronic component according to an embodiment of the present invention is configured to be surface-mountable on a circuit board. The electronic component includes: an insulating base member; an internal conductor provided in the base member; a first external electrode provided on the mounting surface of the base member so as to be electrically connected to the internal conductor; and a second external electrode provided on the mounting surface of the base member so as to be electrically connected to the internal conductor. The first external electrode has a first protrusion, and the second external electrode has a second protrusion. The first protrusion and the second protrusion enables a standoff for filling solder to be maintained within a region defined by the mounting surface of the base member and the circuit board.

A substrate includes primary side terminal holes into which the primary side terminals are inserted, secondary side terminal holes into which the secondary side terminals are inserted, and a slit disposed between the primary side terminal holes and the secondary side terminal holes. A transformer is mounted from the side of a mounting surface of the substrate. An insulating member is inserted into the slit from the side of a soldering surface of the substrate. The insulating member includes a protrusion portion that protrudes outside an area defined by virtual lines which are direct extension lines of the width of the slit to the side of the soldering surface. The protrusion portion is formed at a position more distant from the substrate than an end position of the shortest terminal of the primary side terminals and the secondary side terminals from the soldering surface of the substrate.

A magnetic connector assembly has two independent magnetic components sharing a common core structure. The magnetic assembly includes first and second bobbins, and includes a magnetic core. The magnetic core includes first and second core halves, each half including a main core body, a first outer leg, a second outer leg, and a middle leg. The first outer leg fits within a passageway of the first bobbin. The second outer leg fits within a passageway of the second bobbin. The middle leg fits between the two bobbins.

An inductor includes a support member, a plurality of conductor patterns disposed on at least one surface of the support member and supported by the support member, and an insulating structure interposed between conductor patterns adjacent each other among the plurality of conductor patterns, the insulating structure including a first insulating layer and a second insulating layer disposed on the first insulating layer, the second insulating layer covering side and upper surfaces of the conductor patterns, the second insulating layer being continuously formed along the side and upper surfaces of the conductor pattern, depending on external shapes of the side and upper surfaces of the conductor pattern disposed below the second insulating layer.

The present application provides an inductor framework and inductance device. The inductor framework includes a main winding part and an auxiliary winding part that are integrally arranged; the main winding part includes an upper end, a lower end, a main body, and an inserting hole; the main body is located between the upper end and the lower end, the inserting hole successively passes through the upper end, the main body, and the lower end in a direction from the top surface to the bottom surface; the auxiliary winding part extends from the lower end, a side surface of the auxiliary winding part facing away from the upper end is a welding surface; the auxiliary winding part is configured to be wound thereon an auxiliary coil that covers at least a portion of the welding surface, the auxiliary winding part is provided with a position limiting structure.

A coil element includes a core member, a plate portion connected to one end of the columnar portion, a coil conductor wire, and a terminal electrode. The core member has a flat-shaped connection end portion provided in each of both end portions of the coil portion. The plate portion has a principal surface, a first surface connected to the principal surface, and a second surface connected to the principal surface and the first surface. The terminal electrode has an electrode layer and a joint layer. The electrode layer is formed on either the first surface or the second surface of the plate portion. The joint layer includes a cavity portion locally provided between the connection end portion and the electrode layer and joins the connection end portion and the electrode layer to each other.

An electric component assembly includes a housing with which an electric component is fitted together, and the electric component and the housing are fixed to one side of a base body. The electric component includes a connecting terminal configured to be press-fitted in a through-hole of the control board of the housing, and a direction in which the connecting terminal is inserted into the through-hole is same as a fitting direction relative to the housing. There are provided a rib protruding from one of the electric component and the housing, and a groove portion recessed from another one of the electric component and the housing and into which the rib is press-fitted. Movement of the electric component in a direction intersecting the fitting direction and rotation of the electric component around an axis parallel to the fitting direction are restrained by the rib press-fitted into the groove portion.

One object is to provide an electronic component in which a standoff for filling solder is maintained. An electronic component according to an embodiment of the present invention is configured to be surface-mountable on a circuit board. The electronic component includes: an insulating base member; an internal conductor provided in the base member; a first external electrode provided on the mounting surface of the base member so as to be electrically connected to the internal conductor; and a second external electrode provided on the mounting surface of the base member so as to be electrically connected to the internal conductor. The first external electrode has a first protrusion, and the second external electrode has a second protrusion. The first protrusion and the second protrusion enables a standoff for filling solder to be maintained within a region defined by the mounting surface of the base member and the circuit board.

A coil element includes a core member, a plate portion connected to one end of the columnar portion, a coil conductor wire, and a terminal electrode. The core member has a flat-shaped connection end portion provided in each of both end portions of the coil portion. The plate portion has a principal surface, a first surface connected to the principal surface, and a second surface connected to the principal surface and the first surface. The terminal electrode has an electrode layer and a joint layer. The electrode layer is formed on either the first surface or the second surface of the plate portion. The joint layer includes a cavity portion locally provided between the connection end portion and the electrode layer and joins the connection end portion and the electrode layer to each other.

One object is to provide an electronic component in which a standoff for filling solder is maintained. An electronic component according to an embodiment of the present invention is configured to be surface-mountable on a circuit board. The electronic component includes: an insulating base member; an internal conductor provided in the base member; a first external electrode provided on the mounting surface of the base member so as to be electrically connected to the internal conductor; and a second external electrode provided on the mounting surface of the base member so as to be electrically connected to the internal conductor. The first external electrode has a first protrusion, and the second external electrode has a second protrusion. The first protrusion and the second protrusion enables a standoff for filling solder to be maintained within a region defined by the mounting surface of the base member and the circuit board.