H01F2005/046

COMPLIANT PIN STRUCTURE FOR DISCRETE ELECTRICAL COMPONENTS

A discrete electrical component is disclosed, including a component member having at least one lead; and a base member on which the component member is supported. The electrical component further includes at least one compliant pin member, each compliant pin member having a first end portion configured for press-fit engagement in a printed circuit board and a second end portion electrically connected to the at least one lead of the component member. The at least one compliant pin at least partly extends through or into the base member.

ELECTRIC COMPONENT ASSEMBLY, AND BRAKE FLUID PRESSURE CONTROL DEVICE FOR VEHICLE
20190381984 · 2019-12-19 ·

An electric component assembly includes a housing with which an electric component is fitted together, and the electric component and the housing are fixed to one side of a base body. The electric component includes a connecting terminal configured to be press-fitted in a through-hole of the control board of the housing, and a direction in which the connecting terminal is inserted into the through-hole is same as a fitting direction relative to the housing. There are provided a rib protruding from one of the electric component and the housing, and a groove portion recessed from another one of the electric component and the housing and into which the rib is press-fitted. Movement of the electric component in a direction intersecting the fitting direction and rotation of the electric component around an axis parallel to the fitting direction are restrained by the rib press-fitted into the groove portion.

High Density Magnetic Structure

A magnetic assembly formed by a custom magnetic core and its bobbin with interconnection pins is presented. This magnetic assembly leads to a higher power density of magnetic assembly and a better utilization of the volume inside a power converter, allowing a higher power density of the power converter and a higher efficiency through the minimization of the parasitic inductances.

Method for manufacturing a coil element
11935686 · 2024-03-19 · ·

A coil element includes a core member, a plate portion connected to one end of the columnar portion, a coil conductor wire, and a terminal electrode. The core member has a flat-shaped connection end portion provided in each of both end portions of the coil portion. The plate portion has a principal surface, a first surface connected to the principal surface, and a second surface connected to the principal surface and the first surface. The terminal electrode has an electrode layer and a joint layer. The electrode layer is formed on either the first surface or the second surface of the plate portion. The joint layer includes a cavity portion locally provided between the connection end portion and the electrode layer and joins the connection end portion and the electrode layer to each other.

ELECTRONIC COMPONENT SURFACE-MOUNTABLE ON CIRCUIT BOARD
20190348204 · 2019-11-14 ·

One object is to provide an electronic component in which a standoff for filling solder is maintained. An electronic component according to an embodiment of the present invention is configured to be surface-mountable on a circuit board. The electronic component includes: an insulating base member; an internal conductor provided in the base member; a first external electrode provided on the mounting surface of the base member so as to be electrically connected to the internal conductor; and a second external electrode provided on the mounting surface of the base member so as to be electrically connected to the internal conductor. The first external electrode has a first protrusion, and the second external electrode has a second protrusion. The first protrusion and the second protrusion enables a standoff for filling solder to be maintained within a region defined by the mounting surface of the base member and the circuit board.

Upright composite common mode coil assembly
10460867 · 2019-10-29 · ·

An upright composite common mode coil assembly includes a coil carrier and a seat. The coil carries includes two bobbins with a plurality of coils wounded thereon. The seat includes a base, a bottom portion, a top portion and a separating portion. The base has a back plate on a surface thereof, hollow portions formed at an upper position and a lower position thereof, a wire slot and an indentation are provided at either side of the back plate. The bottom portion and the top portion extend vertically from two sides of the base. A recessed portion is formed at each of the corners of the bottom portion, and a pin is inserted into each of the recessed portions. The top portion has a flat top face. The separating portion extends from another surface of the base and tapered to form a curved surface, and form two receiving slots with the top portion and the bottom portion, respectively. Each of the bobbins of the coil carrier is received in one of the receiving slots of the seat, and wires of a group of the coils are guided into some of the recessed portions through the wire slots and the indentations, and wires of another group of the coils are guided into the other recessed portions through the notches, so that the wires of the coils do not protrude out of the seat and are neatly soldered on the pins.

Electronic component surface-mountable on circuit board

One object is to provide an electronic component in which a standoff for filling solder is maintained. An electronic component according to an embodiment of the present invention is configured to be surface-mountable on a circuit board. The electronic component includes: an insulating base member; an internal conductor provided in the base member; a first external electrode provided on the mounting surface of the base member so as to be electrically connected to the internal conductor; and a second external electrode provided on the mounting surface of the base member so as to be electrically connected to the internal conductor. The first external electrode has a first protrusion, and the second external electrode has a second protrusion. The first protrusion and the second protrusion enables a standoff for filling solder to be maintained within a region defined by the mounting surface of the base member and the circuit board.

CHOKE ARRANGEMENT AND RECEPTACLE FOR THE CHOKE ARRANGEMENT
20190267890 · 2019-08-29 ·

The invention, which relates to a choke arrangement (1) for application in an EMC filter, has as its objective specifying a choke arrangement (1) that is mechanically robust and that enables improved insulation of the windings (4, 5). The objective is attained by disposing about the toroidal core (10) a two-part enclosure (15) and by disposing an insulation web (19) in the two-part enclosure (15).

COIL ELEMENT
20190237244 · 2019-08-01 ·

A coil element includes a core member, a plate portion connected to one end of the columnar portion, a coil conductor wire, and a terminal electrode. The core member has a flat-shaped connection end portion provided in each of both end portions of the coil portion. The plate portion has a principal surface, a first surface connected to the principal surface, and a second surface connected to the principal surface and the first surface. The terminal electrode has an electrode layer and a joint layer. The electrode layer is formed on either the first surface or the second surface of the plate portion. The joint layer includes a cavity portion locally provided between the connection end portion and the electrode layer and joins the connection end portion and the electrode layer to each other.

ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING ELECTRONIC DEVICE
20190164686 · 2019-05-30 ·

A substrate includes primary side terminal holes into which the primary side terminals are inserted, secondary side terminal holes into which the secondary side terminals are inserted, and a slit disposed between the primary side terminal holes and the secondary side terminal holes. A transformer is mounted from the side of a mounting surface of the substrate. An insulating member is inserted into the slit from the side of a soldering surface of the substrate. The insulating member includes a protrusion portion that protrudes outside an area defined by virtual lines which are direct extension lines of the width of the slit to the side of the soldering surface. The protrusion portion is formed at a position more distant from the substrate than an end position of the shortest terminal of the primary side terminals and the secondary side terminals from the soldering surface of the substrate.