The invention provides for magnetic resonance imaging system (600) comprising a superconducting magnet (100) with a first current lead (108) and a second current lead (110) for connecting to a current ramping system (624). The magnet further comprises a vacuum vessel (104) penetrated by the first current lead and the second current lead. The magnet further comprises a magnet circuit (106) within the vacuum vessel. The magnet circuit has a first magnet circuit connection (132) and a second magnet circuit connection (134). The magnet further comprises a first switch (120) between the first magnet connection and the first current lead and a second switch (122) between the second magnet connection and the second current lead. The magnet further comprises a first current shunt (128) connected across the first switch and a second current shunt (130) connected across the second switch. The magnet further comprises a first rigid coil loop (124) operable to actuate the first switch. The first rigid coil loop forms a portion of the first electrical connection. The magnet further comprises a second rigid coil loop (126) operable to actuate the second switch. The second rigid coil loop forms a portion of the second electrical connection.

A connection structure of a multi-layer wire includes at least a substrate, a high-temperature superconducting layer, a tape-type laminated body, a conductor layer, and a passage forming body. The high-temperature superconducting layer is formed on one surface of the substrate. The tape-type laminated body including at least the substrate and the high-temperature superconducting layer. The conductor layer covering an outer periphery of the tape-type laminated body. The passage forming body serving as a flowing path of a superconducting current generated in the high-temperature superconducting wire piece. The passage forming body is bonded by a bonding material is arranged on a side surface of the conductor layer, the side surface being located on an opposite side to the high-temperature superconducting layer with respect to the substrate.

A High Temperature Superconductor, HTS, magnet comprising a coil formed of nested concentric windings. Each winding comprises HTS material. The HTS magnet further comprises a conductor element comprising an electrical contact surface through which to supply electric current to a portion of at least one of the windings. The surface provides electrical contact between the conductor element and an axial edge of the coil substantially around the path of the at least one of the windings.

Described are concepts directed toward systems, structures and techniques to create low-resistance, high current capacity, demountable solder joint connections. Such systems, structures and techniques may be used to simultaneously create low-resistance, high current capacity, demountable solder joint connections at multiple locations between no insulation (NI) superconductors and in particular between NI high temperature superconductors (HTS) such as may be used in NI-HTS magnets.

Systems and methods for superconducting magnets are disclosed, such systems and methods comprising a primary coil and short-circuited secondary coil. The secondary coil can be made from a stack of superconducting tapes having longitudinal cuts forming closed superconductor loops without splices. The primary coil is used to pump the current into the secondary coil where it circulates continuously generating a permanent magnetic field.

In embodiments of the invention, a superconductor lead is configured to have less ohmic heating by its own current and less heat conduction from room temperature to cryogenic temperature, where a cryogenic apparatus is located. The superconducting lead with no ohmic resistance and low thermal conductivity disclosed herein maximizes current capacity by placing superconductors in parallel, each having equal current. Thus, the resistances are controlled to provide uniform current distribution through each superconductor of the high temperature superconducting (HTS) lead.

A method for forming superconducting connection structure between at least two superconducting wires is disclosed, where each wire includes at least one superconducting filament. An end piece of each superconducting wire may be positioned inside a cavity of a pressing tool. A contacting material including MgB2 and/or a precursor material for MgB2 may also be positioned inside the cavity. Pressure may be applied to the contacting material through the pressing tool, and the contacting material may be heated inside the cavity. Pressure and heat may be applied simultaneously, at least during part of the process. A superconducting connection structure including at least two superconducting wires, each wire including at least one superconducting filament, and a superconducting connection between the end pieces of the two wires is also disclosed. The connection may be formed of heated and compressed contacting material including MgB2.

In examples, provided are leadless power couplers that include (1) a thermal insulating system having an outer wall and an inner wall, (2) a first electrically conductive winding located outside the thermal insulating system, where the first electrically conductive winding is configured to create a varying magnetic field, (3) a plurality of second electrically conductive windings located inside the thermal insulating system and configured to couple to the varying magnetic field, the plurality of second electrically conductive windings being superconductors, (4) a plurality of cryogenic rectifiers, each cryogenic rectifier being coupled to a respective second electrically conductive winding in the plurality of second electrically conductive windings, and (5) a plurality of cryogenic cables coupled between respective outputs of the plurality of cryogenic rectifiers and respective loads.

A superconducting machine system includes a superconducting electrical machine and a cryogenic vessel encompassing the superconducting electrical machine. The superconducting machine system includes a ramp lead assembly disposed within a vacuum vessel wall and having a first end and a second end. The first end of the ramp lead assembly is coupled in a fixed manner to the vacuum vessel wall and the second end is coupled to a high temperature superconductor power lead coupled to the superconducting switch. The ramp lead assembly includes a non-conductive support and a metal rod. The ramp lead assembly includes a thermal storage device coupled to the metal rod. The thermal storage device is configured to store heat, to limit heat transfer along the metal rod, and to limit an increase in temperature along the ramp lead assembly during the energization of the superconducting electrical machine.

A method of manufacturing a lead assembly of a cryogenic system is provided. The method includes developing a three-dimensional (3D) model of a heat exchanger. The heat exchanger includes a plurality of channels extending longitudinally through the heat exchanger from the first end to the second end, the plurality of channels forming a plurality of thermal surfaces within the heat exchanger, the heat exchanger having a transverse cross section. The method further includes modifying the 3D model by at least one of reducing an area of the cross section and increasing the plurality of thermal surfaces. The method also includes additively manufacturing the heat exchanger using an electrically-conductive and thermally-conductive material according to the modified 3D model. Further, the method includes providing a high temperature superconductor (HTS) assembly that includes an HTS strip, and connecting the HTS assembly to the heat exchanger at the second end of the heat exchanger.