A coil is disposed in an element body such that a gap between the coil and a first principal surface is larger than a gap between the coil and a second principal surface, and has a coil axis along a direction intersecting with a direction in which the first principal surface and the second principal surface oppose each other. A terminal electrode is disposed on the element body such that at least a part of the first principal surface and a part of the second principal surface are exposed. The coil includes a plurality of coil conductors separated from each other in a direction along the coil axis and a through-hole conductor connecting the coil conductors adjacent to each other in the direction along the coil axis. The through-hole conductor does not overlap the plurality of terminal electrodes when viewed from the direction along the coil axis.

A coil component includes: an element body; a coil including a plurality of coil conductors disposed in the element body and electrically connected to each other; an external electrode disposed on the element body; and a connection conductor that connects the coil and the external electrode. The connection conductor has an end portion exposed from an outer surface of the element body and connected to the external electrode. The end portion has a shape extending outward over an entire circumference.

A coil component according to one or more embodiments includes a base body having first to sixth surfaces, and a coil conductor including a winding portion that extends around a coil axis intersecting the first and second surfaces. The winding portion includes first, second, third, and fourth portions facing the third, fourth, fifth, and sixth surfaces, respectively when viewed from a direction of the coil axis. The radii of curvature of the first and second portions are both smaller than the radii of curvature of the third and fourth portions. When viewed from the direction of the coil axis, the distance between the first portion and the third surface and the distance between the second portion and the fourth surface are both larger than the distance between the third portion and the fifth surface and the distance between the fourth portion and the sixth surface.

Embodiments may include inductors with embedded magnetic cores and methods of making such inductors. In an embodiment, an integrated circuit package may include an integrated circuit die with a multi-phase voltage regulator electrically coupled to the integrated circuit die. In such embodiments, the multi-phase voltage regulator may include a substrate core and a plurality of inductors. The inductors may include a conductive through-hole disposed through the substrate core and a plugging layer comprising a dielectric material surrounding the conductive through-hole. In an embodiment, a magnetic sheath is formed around the plugging layer. In an embodiment, the magnetic sheath is separated from the plated through hole by the plugging layer. Additionally, a first layer comprising a dielectric material may be disposed over a first surface of the magnetic sheath, and a second layer comprising a dielectric material may be disposed over a second surface of the magnetic sheath.

A stacked transformer or inductor apparatus including a first layer with a first layer wire element extending around a center axis and a second layer with a second layer wire element. The second layer element includes side by side first and second wire components in parallel spaced relation extending around the center axis and the first wire component is connected to the first layer wire element to form a primary turn winding. A third layer includes a third layer wire element extending around the center axis and connected to the second wire component of the second layer wire element to form a secondary turn winding partially overlapping with the primary turn winding.

A coil array component including an element assembly that includes a filler and a resin material, a first coil portion and a second coil portion that are embedded in the element assembly and that are composed of a first coil conductor and a second coil conductor, respectively, and four outer electrodes electrically connected to the first coil portion and the second coil portion. Also, the first coil conductor and the second coil conductor are covered with a glass layer.

A coil electronic component includes an insulating substrate, a coil portion disposed on at least one surface of the insulating substrate, a body in which the insulating substrate and the coil portion are embedded, a lead-out portion connected to the coil portion and exposed from a surface of the body, and a connection portion including a plurality of connecting conductors each having a bent portion to increase lengths of the plurality of connecting conductors embedded in the body, the plurality of connecting conductors being spaced apart from each other, the connection portion connecting an end of the coil portion to the lead-out portion to each other.

An inductor device includes a first trace, a second trace, and a double ring inductor. The first trace is disposed at a first area. The second trace is disposed at a second area. The double ring inductor is located at an outside of the first trace and the second trace. The double ring inductor is respectively coupled to the first trace and the second trace in an interlaced manner.

A base includes a main body and a multilayer metal film disposed on the main body. The multilayer metal film includes a first metal film disposed on the main body, the first metal film having conductivity, second metal film on the first metal film and above the main body, the second metal film having resistance to solder leaching, and a third metal film on the second metal film, the third metal film having wettability. The third metal film includes an inwardly extended portion extending between the second metal film and the main body.

A semiconductor device includes a compound substrate, at least one front side pattern, at least one backside pattern and at least one through-wafer via structure. The compound substrate includes a front side and a backside. The at least one front side pattern is arranged on the front side of the compound substrate. The at least one backside pattern is arranged on the backside of the compound substrate. The least one through-wafer via structure penetrates the compound substrate from the front side to the backside. The at least one front side pattern, the at least one backside pattern and the at least one through-wafer form a three-dimensional inductor structure.