A transformer, a method for manufacturing the same and an electromagnetic device are disclosed. The transformer includes a base plate, a magnetic core, transmission wire layers and conductive parts. The base plate includes a central part defining multiple inner via holes each running through the base plate and a peripheral part defining multiple outer via holes each running through the base plate. An annular accommodating groove is defined between the central pan and the peripheral part. The magnetic core is received in the accommodating groove. The transmission wire layers may be disposed respectively on two opposite sides of the base plate. Each of the transmission wire layers includes multiple wire patterns. Multiple conductive parts are respectively disposed in the inner via holes and the outer via holes.

An entangled inductor structure generates opposite polarity internal magnetic fields therein to substantially reduce, or cancel, external magnetic fields propagating outside of the entangled inductor structure. These reduced external magnetic fields propagating outside of the entangled inductor structure effectively reduce a keep out zone (KOZ) between the entangled inductor structure and other electrical, mechanical, and/or electro-mechanical components. This allows the entangled inductor structure to be situated closer to these other electrical, mechanical, and/or electro-mechanical components within the IC as compared to conventional inductors which generate larger external magnetic fields.

A surface mount device inductor has a package casing sized to attenuate electromagnetic coupling between the inductor coils of the surface mount device inductors. The package casing makes the surface mount device inductors self-shielding. The surface mount device inductors can be incorporated into a radiofrequency module, and can be incorporated into a front end system of a wireless mobile device.

Embodiments of the disclosure relate to apparatuses for enhanced thermal management of an inductor assembly using functionally-graded thermal vias for heat flow control in the windings of the inductor. In one embodiment, a PCB for an inductor assembly includes a top surface and a bottom surface. Two or more electrically-conductive layers are embedded within the PCB and stacked vertically between the top surface and the bottom surface. The two or more electrically-conductive layers are electrically connected to form an inductor winding. A plurality of thermal vias thermally connects each of the two or more electrically-conductive layers to a cold plate thermally connected to the bottom surface. A number of thermal vias thermally connecting each electrically-conductive layer to the cold plate is directly proportional to a predetermined rate of heat dissipation from the electrically-conductive layer.

A highly reliable coil component having reduced electric resistance and improved bonding strength in a connection portion between a coil conductor and an external electrode. A coil component includes an element body including a coil conductor including a wound conductive wire coated with an insulating film, a magnetic portion containing metal magnetic particles and resin, and an external electrode on a surface of the element body and electrically connected to exposed surfaces, which are exposed on the surface of the element body, of extended portions of the coil conductor. The external electrode includes at least one or more layers. When an average crystal grain size of crystal grains constituting the coil conductor is defined as a and an average crystal grain size of crystal grains constituting a base electrode layer of the external electrode directly connected to the coil conductor is defined as b, a>b is satisfied.

An inductor array includes a magnetic base body having first and second surfaces opposed to each other and a third surface connecting between the first and second surfaces, and also includes first and second end internal conductors having the same shape. The first end internal conductor includes first-end first conductor portions and fewer first-end second conductor portions, alternating with and being connected to each other. The second end internal conductor includes second-end first conductor portions and fewer second-end second conductor portions, alternating with and being connected to each other. The first-end first conductor portions are positioned away from the first surface by a first end distance in a reference axis direction and face the first surface. The second-end second conductor portions are positioned away from the second surface by a second end distance less than the first end distance in the reference axis direction and face the second surface.

A coil component includes: a body; a coil portion including a coil pattern disposed in the body and first and second lead portions exposed to a first surface of the body to be spaced apart from each other; and first and second external electrodes disposed on the first surface of the body and spaced apart from each other and connected to the first and second lead portions, respectively, wherein in a cross-section perpendicular to the first surface of the body, a curved portion having a radius of curvature of 1 μm or more is formed in a region in which each of the first and second lead portions and an outermost turn of the coil pattern are connected to each other.

A coil component includes: a body; a coil unit including lead-out ends and coils, and embedded in the body; and a core penetrating through the coil unit in a first direction, wherein a cross-section of each of the coils perpendicular to a direction in which the coil is wound has a plurality of round portions disposed on a side facing the core.

In a described example, an integrated circuit includes: a semiconductor substrate having a first surface and an opposite second surface; at least one dielectric layer overlying the first surface of the semiconductor substrate; at least one inductor coil in the at least one dielectric layer with a plurality of coil windings separated by coil spaces, the at least one inductor coil lying in a plane oriented in a first direction parallel to the first surface of the semiconductor substrate, the at least one inductor coil electrically isolated from the semiconductor substrate by a portion of the at least one dielectric layer; and trenches extending into the semiconductor substrate in a second direction at an angle with respect to the first direction, the trenches underlying the inductor coil and filled with dielectric replacement material.

A coil electronic component includes a body, in which a coil portion is embedded, including a plurality of magnetic particles, and an external electrode connected to the coil portion. Among the plurality of magnetic particles, at least a portion of magnetic particles include a first layer, disposed on a surface of a magnetic particle among the magnetic particles, and a second layer disposed on a surface of the first layer. The first layer is an inorganic coating layer containing a phosphorus (P) component, and the second layer is an atomic layer deposition layer.