A structure comprises a semiconductor integrated circuit, an inductor, and a magnetic flux closure layer. The inductor is integrated into a multilevel wiring network in the semiconductor integrated circuit. The inductor includes a planar laminated magnetic core and a conductive winding that turns around in a generally spiral manner on the outside of the planar laminated magnetic core. The planar laminated magnetic core includes an alternating sequence of a magnetic layer and a non-magnetic layer. The magnetic flux closure layer is disposed within about 100 μm of a face of the planar laminated magnetic core, the face of the planar magnetic core parallel to a principal plane of the planar laminated magnetic core. A second magnetic flux closure layer can be disposed within about 100 μm of an opposing face of the planar laminated magnetic core.

Various semiconductor chip devices and methods of making the same are disclosed. In one aspect, an apparatus is provided that includes a first redistribution layer (RDL) structure having a first plurality of conductor traces, a first molding layer on the first RDL structure, plural conductive pillars in the first molding layer, each of the conductive pillars including a first end and a second end, a second RDL structure on the first molding layer, the second RDL structure having a second plurality of conductor traces, and wherein some of the conductive pillars are electrically connected between some of the first plurality of conductor traces and some of the second plurality of conductor traces to provide a first inductor coil.

A coil component includes an insulating layer in which a magnetic core is embedded, coil electrodes wound around the magnetic core, external connection pad electrodes that are provided on the upper surface of the insulating layer and are connected to the coil electrodes. Each of the coil electrodes includes a plurality of inner metal pins standing in the insulating layer, a plurality of outer metal pins standing in the insulating layer, a plurality of upper wiring patterns formed on the upper surface of the insulating layer, and a plurality of lower wiring pattern formed on the undersurface of the insulating layer. Each of the pad electrodes is directly connected to the upper end surface of the inner metal pin or the outer metal pin, and has, in plan view, an area larger than that of the single upper wiring pattern or the single lower wiring pattern.

Devices and methods including a though-hole inductor for an electronic package are shown herein. Examples of the through-hole inductor include a substrate including at least one substrate layer. Each substrate layer including a dielectric layer having a first surface and a second surface. An aperture included in the dielectric layer is located from the first surface to the second surface. The aperture includes an aperture wall from the first surface to the second surface. A conductive layer is deposited on the first surface, second surface, and the aperture wall. At least one coil is cut from the conductive layer and located on the aperture wall.

A method includes depositing a magnetic layer over a dielectric layer, and etching a first portion of the magnetic layer, in which a second portion of the magnetic layer that is directly under the first portion of the magnetic layer remains over the dielectric layer after etching the first portion of the magnetic layer. The second portion of the magnetic layer is etched.

An inductor includes a planar laminated magnetic core and a conductive winding. The planar magnetic core includes an alternating sequence of a magnetic layer and a non-magnetic layer. The non-magnetic layer includes an insulating layer that is disposed between first and second interface layers. The conductive winding turns around in a generally spiral manner on the outside of the planar laminated magnetic core. The inductor can be integrated into a multilevel wiring network in a semiconductor integrated circuit to form a microelectronic device, such as a transformer, a power converter, or a microprocessor.

An object of the present disclosure is to provide a common mode noise filter that can be used in a high-frequency band. The common mode noise filter of the present disclosure includes first to fifth insulator layers and stacked body in which first to fifth insulator layers are stacked along a vertical direction. The common mode noise filter further includes first spiral conductor and second spiral conductor that are formed inside stacked body and face each other across first insulator layer. The common mode noise filter further includes first pad connected to an inner end of first spiral conductor and second pad connected to an inner end of second spiral conductor. Neither first pad nor second pad overlaps each of first spiral conductor and second spiral conductor in top view.

A coil component includes a body, and a coil portion embedded in the body and including a coil pattern having a plurality of coil turns and a support member supporting the coil pattern. A height of an internal coil turn of the plurality of coil turns is lower than a height of an external coil turn of the plurality of coil turns connected to the internal coil pattern and wound outwardly of the internal coil turn. A method of manufacturing the coil component includes forming a spiral-shaped plating seed pattern on a support member, forming a cutting portion cutting the spiral-shaped plating pattern, and forming a coil pattern extending across the cutting portion by performing plating on the spiral-shaped plating seed pattern.

An inductor comprises a planar laminated magnetic core and a conductive winding. The core includes an alternating sequence of (a) a magnetic layer having a thickness of about 100 angstroms to about 10,000 angstroms and (b) a non-magnetic layer having a thickness of about 10 angstroms to about 2,000 angstroms. Magnetic flux passes through a first magnetic layer parallel to a first easy axis of magnetization of the first magnetic layer and the magnetic flux passes through a second magnetic layer, disposed adjacent to the first magnetic layer, parallel to a second easy axis of magnetization of the second magnetic layer. The magnetic flux path extends through the first and second magnetic layers parallel to the first and second easy axes of magnetization, respectively. At least one orthogonal magnetic layer can be disposed laterally from the core such that the magnetic flux path extends through the orthogonal magnetic layer(s).

A magnetic coupling coil component includes: a main body including a first region, a second region disposed on a top side of the first region, and a third region disposed on a bottom side of the first region; a top-side coil conductor provided in the second region of the main body and wound around a coil axis extending in a top-bottom direction; and a bottom-side coil conductor provided in the third region of the main body and wound around the coil axis. The top-side coil conductor includes a plurality of top-side conductive patterns, and the plurality of top-side conductive patterns include a first top-side conductive pattern which is positioned closest to the first region among the plurality of top-side conductive patterns, and a number of turns of the first top-side conductive pattern is larger than an average of numbers of turns of the plurality of top-side conductive patterns.