In a common mode choke coil having a magnetic core, a decrease in peak value of a common mode impedance in a vicinity of its resonance frequency is suppressed. A common mode choke coil includes a non-magnetic layer, a first magnetic layer formed on a top surface of the non-magnetic layer, a second magnetic layer formed on a bottom surface of the non-magnetic layer, a magnetic core provided between the first magnetic layer and the second magnetic layer so that its axis extends in a top-bottom direction, a first coil conductor embedded in the non-magnetic layer and wound around the magnetic core, a second coil conductor embedded in the non-magnetic layer and wound around the magnetic core, and a first magnetic gap provided between a top surface of the magnetic core and a bottom surface of the first magnetic layer. The magnetic core is made of a ferrite material.

An electronic component includes a body having an internal electrode disposed therein, and an external electrode disposed on the body and connected to the internal electrode, wherein in a cross section of the body cut in length and thickness directions, the external electrode includes a first electrode layer disposed below the body and a second electrode layer covering at least the first electrode layer and a side portion of the body, and the internal electrode is connected to the second electrode layer through the side portion of the body.

Aspects of the present disclosure provide an integrated circuit package having an inductive element with a magnetic core. An example integrated circuit package generally includes a semiconductor die, a redistribution layer, and a magnetic core. The semiconductor die includes a metal layer having first conductive traces and conductive pillars coupled to and extending from the metal layer. The redistribution layer is disposed below the semiconductor die and includes second conductive traces. A portion of the first conductive traces, a portion of the conductive pillars, and a portion of the second conductive traces are arranged to form an inductive element disposed below a portion of the semiconductor die. The magnetic core is disposed in the inductive element.

A package includes first and second redistribution structures, a die, a permalloy structure, a molding material and a plurality of through vias. The first redistribution structure includes a first metal pattern. The die is disposed over the first redistribution structure. The molding material is disposed over the first redistribution structure and surrounds the die and the permalloy structure. The second redistribution structure is disposed over the die, the permalloy structure and the molding material, and includes a second metal pattern. The through vias penetrate the molding material and connects the first metal pattern to the second metal pattern. The permalloy structure includes a first member and a second member isolated from the first member, the first member and the second member are surrounded by the plurality of through vias and sandwiched between the first metal pattern and the second metal pattern. A method for forming a package is also provided.

Aspects of the present disclosure provide an integrated circuit package having an inductive element with a magnetic core. An example integrated circuit package generally includes a semiconductor die, a redistribution layer, and a magnetic core. The semiconductor die includes a metal layer having first conductive traces and conductive pillars coupled to and extending from the metal layer. The redistribution layer is disposed below the semiconductor die and includes second conductive traces. A portion of the first conductive traces, a portion of the conductive pillars, and a portion of the second conductive traces are arranged to form an inductive element disposed below a portion of the semiconductor die. The magnetic core is disposed in the inductive element.

A laminated electronic component having a coil formed in the laminated body of pluralities of laminated magnetic material layers and conductor patterns by electrically connecting the conductor patterns adjacent to each other via the magnetic material layers. The magnetic material layers contain a metal magnetic material. The coil has a first end portion close to a bottom surface of the laminated body and a second end portion distant from the bottom surface of the laminated body. The first end portion is electrically connected to a first external terminal disposed on the bottom surface of the laminated body. The second end portion is electrically connected to a second external terminal disposed on the bottom surface of the laminated body via an electrode disposed on a side surface of the laminated body. The electrode is covered with an insulator film.

A coil component includes: a body portion; a coil portion; and an electrode portion, wherein the coil portion includes: a support member; a first coil layer disposed on a first surface of the support member, having first conductive patterns having a planar coil shape, and having a constant line width up to an innermost end portion; a second coil layer disposed on a second surface of the support member, having second conductive patterns having a planar coil shape, and having a constant line width up to an innermost end portion; a via hole penetrating through the support member and partially overlapping innermost end portions of the first and second conductive patterns; and a via conductor filling a portion of the via hole and connected to the innermost end portions of the first and second conductive patterns.

A semiconductor device includes a semiconductor substrate, an insulating layer, a transformer formed in the insulating layer, and a wiring. The transformer includes a primary winding conductor, and a secondary winding conductor. The primary winding conductor is provided in a quadrangle spiral shape having a first center axis extending in a direction parallel to the surface of the semiconductor substrate inside the insulating layer, and configured by one conductor film selected from a group consisting of a vacuum deposition film, a chemical vapor deposition film and a sputtered film. The secondary winding conductor is provided in a quadrangle spiral shape having a second center axis inside the insulating layer while being spaced from the primary winding conductor in plan view of the semiconductor substrate, magnetically coupled with the primary winding conductor and configured by a conductor film.

A manufacturing method of a package includes at least the following steps. A carrier is provided. An inductor is formed over the carrier. The inductor includes a first portion, a second portion, and a third portion. The first portion is parallel to the third portion, and the second portion connects the first portion and the third portion. A die is placed over the carrier. The die is surrounded by the inductor. An encapsulant is formed between the first portion and the third portion of the inductor. The encapsulant laterally encapsulates the die and the second portion of the inductor.

Reducing the space occupied by a voltage regulation integrated circuit (IC) that includes an inductor is achieved by implementing the inductor as a 3D inductor having windings formed of conductive elements integrated into a lower substrate, a circuit layer, and an upper substrate, and positioning other components within a core space of the 3D inductor in the circuit layer. The space occupied by the inductor is shared with the other circuit components and with the structural layers of the voltage regulation IC. A voltage regulation IC may be a switched-mode power supply (SMPS) that includes an inductor with a capacitor and/or a switching circuit. The inductor is implemented as upper horizontal traces in an upper substrate, lower horizontal traces in a lower substrate, and vertical interconnects in a circuit layer between the upper substrate and the lower substrate, and the conductive elements form the 3D inductor as a rectangular coil.