A winding-type coil component includes a first wire and a second wire having a twisted wire portion where the first wire and the second wire are twisted together. Switching positions of the first wire and the second wire in the twisted wire portion are shifted in a circumferential direction of a winding core portion every turn.

A coil component includes: a magnetic body part and a cover part covering one side of a magnetic layer part; and a coil part embedded in the magnetic body part. The magnetic body part is comprised of the following two types of layers: (A) an oblate soft magnetic grain-containing layer, and (B) a spherical grain-containing layer, wherein layer (A) extends over the entire range of the magnetic body part except for a portion including the coil part in a direction perpendicular to an axis direction of the coil part, layer (B) adjoins layer (A) in the axis direction. The cover part is constituted by multiple layers including one or more of layer(s) (A) and one or more of layer(s) (B) and extending over the entire range of the magnetic body part in the direction perpendicular to the axis direction.

Devices and methods including a though-hole inductor for an electronic package are shown herein. Examples of the through-hole inductor include a substrate including at least one substrate layer. Each substrate layer including a dielectric layer having a first surface and a second surface. An aperture included in the dielectric layer is located from the first surface to the second surface. The aperture includes an aperture wall from the first surface to the second surface. A conductive layer is deposited on the first surface, second surface, and the aperture wall. At least one coil is cut from the conductive layer and located on the aperture wall.

A laminated electronic component having a coil formed in a laminated body of pluralities of laminated magnetic material layers and conductor patterns by electrically connecting the conductor patterns adjacent to each other via the magnetic material layers. The magnetic material layers contain a metal magnetic material. The coil has a first end portion close to a bottom surface of the laminated body and a second end portion distant from the bottom surface of the laminated body. The first end portion is electrically connected to a first external terminal disposed on the bottom surface of the laminated body. The second end portion is electrically connected to a second external terminal disposed on the bottom surface of the laminated body via a conductor extending in a lamination direction of the laminated body. An insulator part is disposed between the conductor and the coil.

A multilayer coil component includes an element body, a coil including a plurality of internal conductors, and a plurality of stress-relaxation spaces. The plurality of internal conductors are separated from each other in a first direction in the element body. Each stress-relaxation space is in contact with a surface of the corresponding internal conductor and powders exist in each stress-relaxation space. The element body includes element body regions located between the internal conductors adjacent to each other in the first direction. Each stress-relaxation space includes a first boundary surface with each internal conductor and a second boundary surface with each element body region. The first boundary surface and the second boundary surface oppose each other in the first direction. A distance between the first boundary surface and the second boundary surface is smaller than a thickness of each element body region in the first direction.

A thin-film inductor includes an electrically conductive structure, an inductance-enhancing structure and two terminal electrodes. The electrically conductive structure has a coil pattern, and includes an insulating base plate having via extending therethrough, upper and lower coils formed on two opposite surfaces of the insulating base plate, and a conducting member disposed in and fills the via to electrically connect the upper and lower coils. The inductance-enhancing structure covers the electrically conductive structure and fills a space defined by the electrically conductive structure to expose an electrode contact region of the lower coil. The terminal electrodes are disposed on the electrode contact region.

A coil component includes a body and a coil portion embedded in the body and having a plurality of turns wound about an axis. Each of the plurality of turns includes a plurality of corner portions adjacent to corners of the body, and at least one connection portion connecting adjacent corner portions among the plurality of corner portions, and a difference in heights, measured in the direction of the axis, between an innermost turn and a turn adjacent to the innermost turn, among the plurality of turns, is greater in the corner portion than in the connection portion.

Various semiconductor chip devices and methods of making the same are disclosed. In one aspect, an apparatus is provided that includes a first redistribution layer (RDL) structure having a first plurality of conductor traces, a first molding layer on the first RDL structure, plural conductive pillars in the first molding layer, each of the conductive pillars including a first end and a second end, a second RDL structure on the first molding layer, the second RDL structure having a second plurality of conductor traces, and wherein some of the conductive pillars are electrically connected between some of the first plurality of conductor traces and some of the second plurality of conductor traces to provide a first inductor coil.

Embodiments include inductors and methods to form the inductors. An inductor includes a substrate layer that surrounds a magnetic layer, where the magnetic layer is embedded between the substrate layer. The inductor also includes a dielectric layer that surrounds the substrate and magnetic layers, where the dielectric layer fully embeds the substrate and magnetic layers. The inductor further includes a first conductive layer over the dielectric layer, a second conductive layer below the dielectric layer, and a plurality of plated-through-hole (PTH) vias in the dielectric and substrate layers. The PTH vias vertically extend from the first conductive layer to the second conductive layer, and the magnetic layer in between the PTH vias. The magnetic layer may have a thickness that is substantially equal to a thickness of the substrate layer, where the thickness of the magnetic layer is less than a thickness defined between the first and second conductive layers.

An inductor structure includes a carrier, a coil structure, an isolation structure and a ferromagnetism structure. The carrier has an upper surface. The coil structure is disposed adjacent to the upper surface of the carrier. The isolation structure covers the upper surface and the coil structure. The ferromagnetism structure is disposed on the isolation structure.