Patent classifications
H01F17/0033
SINGLE LAYER AND MULTILAYER MAGNETIC INDUCTORS BETWEEN SUBSTRATE CORES
Embodiments disclosed herein include electronic packages. In an embodiment, an electronic package comprises a first layer that comprises glass. In an embodiment, a second layer comprising glass is over the first layer. In an embodiment, the electronic package further comprises an inductor between the first layer and the second layer.
Circuit board and method of manufacturing the same
A circuit board includes a substrate, a first magnetic structure, a first dielectric layer and an inductive coil. The substrate has a top surface and a bottom surface. The first magnetic structure is disposed on the top surface of the substrate. The first dielectric layer covers the substrate and the first magnetic structure. The inductive coil includes a first interconnect, a second interconnect and a plurality of conductive pillars. The first interconnect is disposed on the first dielectric layer. The second interconnect is disposed on the bottom surface of the substrate. The conductive pillars connect the first interconnect and the second interconnect. The first interconnect, the second interconnect and the conductive pillars form a helical structure surrounding the first magnetic structure.
3D SPIRAL INDUCTOR
A miniaturized 3D spiral inductor is disclosed. The 3D spiral inductor, comprising: a plurality of top metal wires configured in parallel on a top surface of a dielectric layer; a plurality of metal vias formed in a matrix of 2×N, and coelevationally embedded in the dielectric layer; each top metal wire electrically coupled top ends of a left metal via and a right metal via; and a plurality of bottom metal wires configured on a bottom ends of the plurality of metal vias; each bottom metal wire electrically coupled bottom ends of a left metal via and a right metal via; the plurality of metal elements connected sequentially to form a 3D spiral inductor.
COIL COMPONENT AND METHOD FOR MANUFACTURING THE SAME
A coil component that can be made thinner while ensuring sufficient magnetic characteristics includes a magnetic part, a conductor part, and multiple insulator parts. The magnetic part is constituted by magnetic alloy grains. The conductor part has multiple winding parts and is wound around one axis inside the magnetic part. The multiple insulator parts are each placed between the multiple winding parts, each having a winding shape that includes two joining surfaces that are respectively joined to two winding parts facing each other at least partially in the direction of the one axis, and are each constituted by electrically insulating grains.
Optimized Electromagnetic Inductor Component Design and Methods Including Improved Conductivity Composite Conductor Material
Electromagnetic inductor components include a magnetic core and a conductor assembled with the core and defining a winding completing a number of turns. The conductor is fabricated from a composite material including carbon nanotubes having an improved conductivity. The conductor has a cross section defined by an effective diameter. The conductor is fabricated to have performance parameters that are selected in view of a function of a ratio of conductivity and/or a function of a ratio of effective diameter of the composite conductor material relative to a reference conductor material as conventionally used in an inductor fabrication.
SEMICONDUCTOR DEVICE AND METHOD OF MAKING THE SAME
A semiconductor device includes an interposer disposed on a substrate. A first major surface of the interposer faces the substrate. A system on a chip is disposed on a second major surface of the interposer. The second major surface of the interposer opposes the first major surface of the interposer. A plurality of first passive devices is disposed in the first major surface of the interposer. A plurality of second passive devices is disposed on the second major surface of the interposer. The second passive devices are different devices than the first passive devices.
Electronic component
An electronic component includes a body formed of an insulator, a coil positioned in the body and including first and second coil conductors, an outer electrode including a first bottom-surface electrode and a first substantially columnar electrode (first electrode) and connected to the second conductor, and an outer electrode including a second bottom-surface electrode and a second substantially columnar electrode (second electrode) and connected to the first conductor. The second conductor is positioned between the first conductor and a bottom surface of the body. The second electrode is positioned to oppose the first electrode across the coil's central axis when viewed from the z-axis direction. An outermost peripheral portion of the first conductor is superposed with the first electrode when viewed from the z-axis direction. A smallest distance between the first conductor and a first side surface is smaller than that between the second conductor and a second side surface.
INDUCTOR COMPONENT AND METHOD FOR MANUFACTURING INDUCTOR COMPONENT
An inductor component includes a core base material, a magnetic body in the core, a first conductor pattern formed on primary surface of the core, a second conductor pattern formed on secondary surface of the core, and through-hole conductors formed in through holes through the core such that the conductors are connecting the first and second patterns. The first pattern, second pattern and conductors are positioned to form an inductor such that the magnetic body is positioned on inner side of the inductor, each conductor has a diameter k1, each pattern has conductor thickness in range of 50 μm to 200 μm and has line patterns each having width w1 and separated by line separation distance w2, and a ratio of cross-sectional area of each line pattern to cross-sectional area of each conductor along the diameter k1 in direction of the width w1 is in range of 0.8 to 2.0.
INDUCTOR COMPONENT AND METHOD OF MANUFACTURING INDUCTOR COMPONENT
An inductor component includes an element body, a coil in the element body, and a non-magnetic insulation layer covering at least part of the coil. The element body includes first and second magnetic layers laminated in order in a first direction. The coil includes a small-turn inductor wiring of 0.5 or less turns extending along a plane orthogonal to the first direction between the first and second magnetic layers. In a first cross-section orthogonal to an extending direction of the small-turn inductor wiring, the small-turn inductor wiring has a top surface facing in the first direction, a bottom surface facing in a second direction opposite from the first direction, a first side surface facing in a third direction orthogonal to the first direction, and a second side surface facing in a fourth direction opposite from the third direction.
Inductor component
An inductor component comprising a spiral wiring wound on a plane; a first magnetic layer and a second magnetic layer located at positions sandwiching the spiral wiring from both sides in a normal direction relative to the plane on which the spiral wiring is wound; a vertical wiring extending from the spiral wiring in the normal direction to pass through the first magnetic layer; and an external terminal disposed on a surface of the first magnetic layer to connect an end surface of the vertical wiring. The first magnetic layer has magnetic permeability lower than that of the second magnetic layer.