Patent classifications
H01F17/0033
Method for fabricating a magnetic material stack
A method for fabricating a magnetic material stack on a substrate, comprises forming a first dielectric layer, forming a first magnetic material layer on the first dielectric layer, forming at least a second dielectric layer on the first magnetic material layer and forming at least a second magnetic material layer on the second dielectric layer. During one or more of the forming steps, a surface smoothing operation is performed to remove at least a portion of surface roughness on the layer being formed.
Inductor component and method for manufacturing inductor component
An inductor component 1 includes a resin layer 2, a protective film 4, two metal pins 5 provided to stand in the resin layer 2, and a metal plate 6 joined to both of the metal pins 5, and both of the metal pins 5 and the metal plate 6 configure an inductor electrode 7. Both of the metal pins 5 are provided to stand in the resin layer 2, upper end surfaces 5a thereof are exposed to an upper surface 2a of the resin layer 2, and lower end surfaces 5b thereof are exposed to a lower surface 2b. Recesses 8 are formed around the peripheral edges of the upper end surfaces 5a of both of the metal pins 5 by laser beam irradiation.
Transformer device
A transformer device includes first conductive segments, second segments, and third conductive segments. The second segments include second conductive segments and first bridging segments. The first bridging segments are connected to the first conductive segments to form a first inductor. The third conductive segments include second bridging segments, and the third conductive segments are connected to the second conductive segments to form a second inductor. The first inductor is located on the second inductor. The first bridging segments and the first conductive segments form first interlaced portions along a first direction. The second bridging segments and the second conductive segments form second interlaced portions along a second direction. The first direction is different from the second direction.
Wire-wound coil element
One object of the present invention is to provide a coil element having a reduced thickness but is less prone to be broken. The coil element according to an embodiment of the present invention has a rectangular parallelepiped shape and has a principal surface including long sides and short sides. The coil element includes a drum core, a winding wound around the drum core, a first external electrode electrically connected to one end of the winding, and a second external electrode electrically connected to the other end of the winding. The drum core in the embodiment includes a first flange, a second flange, and a winding core connecting between the first flange and the second flange. The winding core extends along the short sides of the principal surface.
NANOMAGNETIC INDUCTOR CORES, INDUCTORS AND DEVICES INCORPORATING SUCH CORES, AND ASSOCIATED MANUFACTURING METHODS
A nanomagnetic inductor core that includes: a porous, electrically-insulating template having high-permeability material in the pores thereof to constitute elongated nanowires, and wherein the elongated nanowires are segmented along their axial direction; and a segment of dielectric material interposed between adjacent segments of the high-permeability material along the axial direction of the nanowire; wherein each segment of the high-permeability material has a length, in the axial direction of the nanowire, no greater than a size of a single magnetic domain, and wherein a maximal cross-sectional dimension of the nanowire is no greater than the size of the single magnetic domain. Inductors and LC interposers using such nanomagnetic inductor cores, as well as associated fabrication methods.
INDUCTIVE DEVICES AND METHODS OF FABRICATING INDUCTIVE DEVICES
An inductive device may be provided, including a first winding layer, a second winding layer arranged over the first winding layer and connected to the first winding layer to form a plurality of turns around a first axis, and a magnetic core arranged vertically between the first winding layer and the second winding layer. The magnetic core may include a portion entirely over the first winding layer and entirely under the second winding layer, where this portion may include a magnetic segment and a non-magnetic segment arranged laterally adjacent to each other along the first axis.
MAGNETIC CORE WITH HARD FERROMAGNETIC BIASING LAYERS AND STRUCTURES CONTAINING SAME
A planar magnetic core includes multiple ferromagnetic layers including multiple hard ferromagnetic bias layers and multiple soft ferromagnetic layers. Each ferromagnetic layer comprises a soft ferromagnetic layer or a hard ferromagnetic bias layer. Each hard ferromagnetic bias layer is a neighboring ferromagnetic layer of at least one soft ferromagnetic layer. The planar magnetic core also includes a plurality of insulating layers, each insulating layer disposed between adjacent ferromagnetic layers. Each ferromagnetic layer has an easy axis of magnetization parallel to a principal plane of the planar magnetic core, where the easy axes of magnetization are aligned. Each hard ferromagnetic bias layer is magnetized to create an in-plane bias magnetic flux through the hard ferromagnetic bias layer in a first direction that is parallel to the easy axis of magnetization and forms a closed path through a neighboring soft ferromagnetic layer in a second direction parallel to the first direction.
SEMICONDUCTOR PACKAGE DEVICE WITH INTEGRATED INDUCTOR AND MANUFACTURING METHOD THEREOF
A method includes: forming an interconnect structure over a semiconductor substrate. The interconnect structure includes: a magnetic core and a conductive coil winding around the magnetic core and electrically insulated from the magnetic core. The conductive coil includes horizontally-extending conductive lines and vertically-extending conductive vias electrically connecting the horizontally-extending conductive lines, wherein the magnetic core and the conductive coil are arranged in an inductor zone of the interconnect structure; and a connecting metal line adjacent to and on an outside of the inductor zone, the connecting metal line being electrical isolated from the inductor zone. The vertically-extending conductive vias include first conductive vias, second conductive vias, and a third conductive via between the first conductive vias and the second conductive vias. The connecting metal line is between, and non-overlapped with, the first conductive via and the second conductive vias vertically from a cross-sectional view.
Planar solenoid inductors with antiferromagnetic pinned cores
A planar magnetic structure includes a closed loop structure having a plurality of core segments divided into at least two sets. A coil is formed about one or more core segments. A first antiferromagnetic layer is formed on a first set of core segments, and a second antiferromagnetic layer is formed on a second set of core segments. The first and second antiferromagnetic layers include different blocking temperatures and have an easy axis pinning a magnetic moment in two different directions, wherein when current flows through the coil, the magnetic moments rotate to form a closed magnetic loop in the closed loop structure.
Device with 3D inductor and magnetic core in substrate
Disclosed are devices and methods for fabricating devices. A device can include a passive portion having at least one metal insulator metal (MIM) capacitor and at least one 2-dimensional (2D) inductor. The device further includes a substrate and the passive portion is formed on the substrate. A magnetic core is embedded in the substrate. A 3-dimensional (3D) inductor is also included having windings formed at least in part in the substrate and at least a portion of the windings being formed around the magnetic core.