An inductor includes a coil that is provided in a component body. A first end of the coil is connected to a first outer electrode, and a second end of the coil is connected to a second outer electrode. The coil includes a plurality of coil conductor layers that are provided in a width direction. Each coil conductor layer is substantially spirally formed with the number of turns being greater than or equal to about one turn. The height of the component body is greater than the width of the component body.

A multi-voltage domain device includes a semiconductor layer including a first voltage domain, a second voltage domain, and an isolation region that electrically isolates the first voltage domain and the second voltage domain in a lateral direction. The isolation region includes at least one deep trench isolation barrier. A layer stack is arranged on the semiconductor layer and includes a stack insulator layer, a first coil arranged in the stack insulator layer, and a second coil arranged in the stack insulator layer and laterally separated from the first coil in the lateral direction. The first and second coils are magnetically coupled to each other in the lateral direction. The first coil includes terminals arranged vertically over the first region and are electrically coupled to the first voltage domain, and the second coil includes terminals arranged vertically over the second region and are electrically coupled to the second voltage domain.

An inductor structure and a manufacturing method for the same are provided. The inductor structure includes conductive layers and conductive elements. The conductive layers overlap in a vertical direction. Each of the conductive elements is coupled between two conductive layers of the conductive layers.

A multilayer coil component 1 includes an element body 2, a coil 5, a first terminal electrode 3, a second terminal electrode 4, a first connection conductor 6, and a second connection conductor 7. The coil 5 includes a first coil portion 8 that has one end of the coil 5 and is disposed on a side of a main surface 2c and a second coil portion 9 that has the other end of the coil 5 and is disposed on a side of the main surface 2d. A distance L2 between the first connection conductor 6 and the second coil portion 9 is larger than a distance L1 between the first connection conductor 6 and the first coil portion 8.

An inductor device is disclosed herein. An electrical device is disposed in a first area of the inductor device, and the inductor device includes a first trace and a second trace. The first trace is disposed in a second area. The second trace is disposed in the second area, and coupled to the first trace. The second area is disposed an outer side of the first area, and the first area and the second area are not overlapped with each other.

An inductor component includes an element assembly having a first surface and a second surface located opposite to the first surface, a first direction-distinguishing layer disposed on the first surface, and a second direction-distinguishing layer disposed on the second surface. The first direction-distinguishing layer has a first cavity passing through in the thickness direction. The second direction-distinguishing layer has a second cavity passing through in the thickness direction. The element assembly has a first exposed portion that is part of the element assembly and that is exposed in the first cavity and has a second exposed portion that is part of the element assembly and that is exposed in the second cavity. The first amount of protrusion of the first exposed portion protruding in the thickness direction is less than the second amount of protrusion of the second exposed portion protruding in the thickness direction.

A microelectronic device has bump bonds and an inductor on a die. The microelectronic device includes first lateral conductors extending along a terminal surface of the die, wherein at least some of the first lateral conductors contact at least some of terminals of the die. The microelectronic device also includes conductive columns on the first lateral conductors, extending perpendicularly from the terminal surface, and second lateral conductors on the conductive columns, opposite from the first lateral conductors, extending laterally in a plane parallel to the terminal surface. A first set of the first lateral conductors, the conductive columns, and the second lateral conductors provide the bump bonds of the microelectronic device. A second set of the first lateral conductors, the conductive columns, and the second lateral conductors are electrically coupled in series to form the inductor. Methods of forming the microelectronic device are also disclosed.

An inductor component includes a body including a first surface and a second surface opposing each other in a first direction, and a third surface and a fourth surface connected to the first surface and the second surface and opposing each other in a second direction, a first conductor disposed in the body and extending in the first direction, a second conductor disposed adjacent to the first conductor in the body and extending in the first direction, a first pad and a second pad disposed on the third surface of the body, a first conductive via extending in the second direction and connecting the first conductor and the first pad, and a second conductive via extending in the second direction and connecting the second conductor and the second pad. The second conductor is disposed to be shifted with respect to the first conductor in the first direction.

An electronic component includes a plurality of groups arrayed in a stacking direction, each including a first inductor conductor layer, a second inductor conductor layer, a connection conductor layer and a first insulator layer. In each group, the first insulator layer is provided between a first superposed portion of the first inductor conductor layer and a second superposed portion of the second inductor conductor layer. The connection conductor layer is provided at the same position as the first insulator layer in the stacking direction, and electrically connects the first non-superposed portion and the second non-superposed portion included in the same group to each other. Among two adjacent groups in the stacking direction, a second superposed portion included in a group on another side in the stacking direction and a first superposed portion included in a group on one side in the stacking direction are physically connected to each other.

An inductor device includes a first coil and a second coil. The first coil is wound into a plurality of first circles, and the second coil is wound into a plurality of second circles. At least two of the second circles are interlaced with at least two of the first circles on a first side. The at least two of the second circles are disposed adjacent to each other on the first side. At least one of the first circles is only interlaced with at least one of the second circles on a second side. At least another one of the first circles is only interlaced with at least another one of the second circles on the second side.