Disclosed herein is a coil component that includes a coil pattern embedded in a resin body. The resin body includes a winding core area surrounded by the coil pattern and having a first surface and a substantially flat second surface different in the circumferential direction position from the first surface, and a first surrounding area covering the first surface of the winding core area. The coil pattern includes first sections extending along the first surface of the winding core area and second sections extending along the second surface of the winding core area. One ends of the first sections are connected respectively to their corresponding one ends of the second sections. The other ends of the first sections are connected respectively to their corresponding other ends of the second sections.

Disclosed herein is a coil component that includes a coil pattern embedded in an element body and helically wound in a plurality of turns. The element body includes a support body having a cavity formed therein and a first insulating layer stacked on the support body so as to cover the cavity, thereby forming a hollow space inside the element body. The coil pattern includes a plurality of first sections formed along an inner wall of the cavity and a plurality of second sections formed on the first insulating layer. One ends of the plurality of first sections are connected respectively to their corresponding one ends of the plurality of second sections. The other ends of the plurality of first sections are connected respectively to their corresponding other ends of the plurality of second sections.

An inductor includes: a body in which a plurality of insulating layers having a plurality of coil patterns each disposed on each of the plurality of insulating layers are stacked; and first and second external electrodes disposed on an exterior surface of the body, wherein the body further includes a through-hole, and at least one portion of an inner surface of the plurality of coil patterns is exposed through the through-hole.

A coil device includes a first conductor in a first layer and including a spiral shape and a second conductor in the first layer connected in parallel with the first conductor and extending adjacent to and parallel or substantially parallel to the first conductor. A cross-sectional area of the first conductor and a cross-sectional area of the second conductor are different.

An inductor device includes a first inductor, a switch, and a second inductor. The first inductor includes a first, a second, a third, and a fourth trace. The first trace is disposed at a first area of the inductor device. The second trace is disposed inside the first trace. The third trace is disposed at a second area of the inductor device. The fourth trace is disposed inside the third trace. When the switch is turned off, the first, the second, the third, and the fourth trace form first path. When the switch is turned on, the first, the third, and the fourth trace form second path. The second inductor includes a fifth and a sixth trace. The fifth trace is disposed at the first area of the inductor device. The six trace is disposed at the second area of the inductor device, and coupled to the fifth trace.

An inductor includes a body in which a plurality of insulating layers on which a plurality of coil patterns are arranged are stacked, and first and second external electrodes disposed inside the body, wherein the plurality of coil patterns are connected by coil connecting portions and form a coil in which opposing ends thereof are connected to the first and second external electrodes, and the first and second external electrodes are directly connected to the opposing ends of the plurality of coil patterns inside the body.

A multi-voltage domain device includes a semiconductor layer including a first voltage domain, a second voltage domain, and an isolation region that electrically isolates the first voltage domain and the second voltage domain in a lateral direction. The isolation region includes at least one deep trench isolation barrier. A layer stack is arranged on the semiconductor layer and includes a stack insulator layer, a first coil arranged in the stack insulator layer, and a second coil arranged in the stack insulator layer and laterally separated from the first coil in the lateral direction. The first and second coils are magnetically coupled to each other in the lateral direction. The first coil includes terminals arranged vertically over the first region and are electrically coupled to the first voltage domain, and the second coil includes terminals arranged vertically over the second region and are electrically coupled to the second voltage domain.

An electronic component includes: a multilayer body; an inductor constituted of a plurality of inductor conductor layers and a via hole conductor, the inductor having a helical shape; a first outer electrode provided on a first end surface formed by contiguous outer edges of the insulation layers; and a second outer electrode provided on a second end surface. The plurality of inductor conductor layers have a first inductor conductor layer connected to the first outer electrode, and a second inductor conductor layer adjacent to the first inductor conductor layer on another side in the lamination direction. The via hole conductor connecting the first inductor conductor layer and the second inductor conductor layer is provided closer to the first outer electrode than the second outer electrode, and when viewed in plan view from a normal direction of the first end surface, does not overlap with the first outer electrode.

The present disclosure relates to an electromagnetic induction film and a manufacturing method thereof, an electromagnetic induction panel and a manufacturing method thereof, and a touch display device. The method for manufacturing the electromagnetic induction film may include: arranging a plurality of first conductors in parallel along and spaced apart along a first direction on a substrate; arranging an insulating layer on the plurality of first conductors; arranging a plurality of second conductors in parallel and spaced apart along the first direction on the insulating layer; and electrically connecting head end areas of the first conductors to head end areas of the second conductors and electrically connecting tail end areas of the first conductors to tail end areas of the second conductors to form an electromagnetic induction coil spirally surrounding the insulating layer.

A semiconductor device structure is provided. The semiconductor device structure includes a first conductive line over a substrate. The semiconductor device structure includes a first protection cap over the end portion. The first protection cap and the first conductive line are made of different conductive materials, and the first protection cap exposes a peripheral region of a top surface of the end portion. The semiconductor device structure includes a first photosensitive dielectric layer over the substrate, the first conductive line, and the first protection cap. The semiconductor device structure includes a conductive via structure passing through the first photosensitive dielectric layer and connected to the first protection cap.