An inductor array includes a base body having a first surface, first to fourth external electrodes touching the first surface, a first internal conductor provided in the base body and connected at the ends thereof to the first and second external electrodes, and a second internal conductor provided in the base body and connected at the ends thereof to the third and fourth external electrodes. The first and second internal conductors are spaced away from each other in a reference direction. The first internal conductor has a first aspect ratio of greater than one, where the first aspect ratio denotes a ratio of (i) a dimension of a section of the first internal conductor orthogonal to a current flowing direction in a direction perpendicular to the reference direction to (ii) a dimension of the section in the reference direction.

A recess in a die backside surface occupies a footprint that accommodates an inductor coil that is formed in metallization above an active surface of the die. Less semiconductive material is therefore close to the inductor coil. A ferromagnetic material is formed in the recess, or a ferromagnetic material is formed on a dielectric layer above the inductor coil. The recess may extend across a die that allows the die to be deflected at the recess.

A connector module includes a substrate including stacked magnetic layers, a first principal surface, and a second principal surface opposite to the first principal surface, a surface mount connector mounted on mounting electrodes on the first principal surface of the substrate, external mounting electrodes disposed on the second principal surface of the substrate, and inductors inside the substrate and each connected at a first end thereof to a corresponding one of the mounting electrodes and connected at a second end thereof to a corresponding one of the external mounting electrodes.

A magnetic substrate has such a shape that ridges extending between principal surfaces are cut away by cutout portions. A multilayer body has corners arranged so as to overlap the cutout portions. A coil includes lead portions which are connected with both ends of a coil portion and which are drawn out to the corners. A coil is combined with the coil to constitute a common mode choke coil and includes lead portions which are connected with both ends of a coil portion and which are drawn out to the corners. Connecting portions connect external electrodes to the lead portions and are provided at the cutout portion.

A chip electronic component may include: a magnetic body having a coil conductive pattern part embedded therein; and an oxide insulating film formed on a surface of the coil conductive pattern part. Even in the case that the insulating film is formed to be thinner than an insulating film, it may prevent the coil conductive pattern part from being exposed, whereby a magnetic material and the coil conductive pattern part may not contact each other. Therefore, a waveform defect may be prevented at a high frequency.

A device includes a semiconductor chip, a plurality of planar metallization layers arranged over a main surface of the semiconductor chip, and a passive component including windings, wherein each of the windings is formed in one of the plurality of planar metallization layers.

Methods/structures of forming embedded inductor structures are described. Embodiments include forming a first interconnect structure on a dielectric material of a substrate, selectively forming a magnetic material on a surface of the first interconnect structure, forming an opening in the magnetic material, and forming a second interconnect structure in the opening. Build up layers are then formed on the magnetic material.

An apparatus includes a first charging coil with one or more conductors arranged in a first winding pattern, a second charging coil with one or more conductors arranged in a second winding pattern, and a ferrite structure with a main section with a top side, a first side section and a second side section. A portion of the top side of the main section is adjacent to a portion of the bottom side of the first side section and the second side section. A portion of the first and second charging coils are positioned adjacent to the top side of the main section interior in between the first and second side sections. A portion of the first charging coil is adjacent to the bottom of the first side section. A portion of the second charging coil is adjacent to the bottom of the second side section.

Disclosed are a common mode filter and a manufacturing method thereof. The common mode filter in accordance with an aspect of the present invention includes: a substrate; a filter layer including a coil and a dielectric layer and disposed on the substrate and configured to remove a signal noise; and a magnetic layer being laminated on the filter layer, and a surface of the filter layer being joined with the magnetic layer can be formed to be flat by having the coil embedded in a surface of the filter layer being joined with the magnetic layer in such a way that one surface of the coil is exposed.

A magnetic device may include a magnetic structure, a device structure, and an associated circuit. The magnetic structure may include a patterned layer of material having a predetermined magnetic property. The patterned layer may be configured to, e.g., provide a magnetic field, sense a magnetic field, channel or concentrate magnetic flux, shield a component from a magnetic field, or provide magnetically actuated motion, etc. The device structure may be another structure of the device that is physically connected to or arranged relative to the magnetic structure to, e.g., structurally support, enable operation of, or otherwise incorporate the magnetic structure into the magnetic device, etc. The associated circuit may be electrically connected to the magnetic structure to receive, provide, condition or process of signals of the magnetic device.