A magnetic coupling coil component according to one embodiment of the present invention includes: an insulating layer; a first coil conductor embedded in the insulating layer, the first coil conductor having a first top coil surface and a first bottom coil surface; a second coil conductor embedded in the insulating layer, the second coil conductor having a second top coil surface and a second bottom coil surface; a first cover layer provided on a first surface of the insulating layer so as to be opposed to the first top coil surface; and a second cover layer provided on a second surface of the insulating layer opposite to the first surface so as to be opposed to the second bottom coil surface. At least one of the first cover layer and the second cover layer has a magnetic permeability higher than a magnetic permeability of the insulating layer.

Embodiments of the invention are directed to a method of fabricating a yoke arrangement of an inductor. A non-limiting example method includes forming a dielectric layer across from a major surface of a substrate. The method further includes configuring the dielectric layer such that it imparts a predetermined dielectric layer compressive stress on the substrate. A magnetic stack is formed on an opposite side of the dielectric layer from the substrate, wherein the magnetic stack includes one or more magnetic layers alternating with one or more insulating layers. The method further includes configuring the magnetic stack such that it imparts a predetermined magnetic stack tensile stress on the dielectric layer, wherein a net effect of the predetermined dielectric layer compressive stress and the predetermined magnetic stack tensile stress on the substrate is insufficient to cause a portion of the major surface of the substrate to be substantially non-planar.

An inductor component comprising a spiral wiring wound on a plane; first and second magnetic layers located at positions sandwiching the spiral wiring from both sides in a normal direction relative to the plane of the wound spiral wiring; a vertical wiring extending from the spiral wiring in the normal direction to penetrate at least the inside of the first magnetic layer; and an external terminal disposed on at least a surface of the first magnetic layer to cover an end surface of the vertical wiring. The first magnetic layer is larger than the second magnetic layer in terms of the area of the external terminal viewed in the normal direction, and when A is the thickness of the first magnetic layer and B is the thickness of the second magnetic layer, A/((A+B)/2) is from 0.6 to 1.6.

A package including a package substrate; an interposer electrically coupled to the package substrate and including a metal layer; a die including an integrated voltage regulator and electrically coupled to the interposer by solder features; and an inductor formed by a magnetic material disposed between two of the solder features electrically coupled to each other by a portion of the metal layer of the interposer, the inductor electrically coupled to the integrated voltage regulator.

A coil component according to one or more embodiments of the invention includes a base body containing a plurality of metal magnetic particles, a coil conductor, and an external electrode. In one or more embodiments, the coil conductor has a coil portion disposed inside the base body, and an end surface exposed from a first surface of the base body. The coil conductor is configured such that the ratio of the dimension of a section of the coil portion in a short axis direction to the dimension of the end surface in a short axis direction is 0.5 to 0.95, the section of the coil portion is orthogonal to the direction in which current flows through the coil portion. In one or more embodiments, the external electrode is provided on the first surface such that it is connected to the end surface of the lead-out portion.

Embodiments are directed to a method of forming a laminated magnetic inductor and resulting structures having multiple magnetic layer thicknesses. A first magnetic stack having one or more magnetic layers alternating with one or more insulating layers is formed in a first inner region of the laminated magnetic inductor. A second magnetic stack is formed opposite a major surface of the first magnetic stack in an outer region of the laminated magnetic inductor. A third magnetic stack is formed opposite a major surface of the second magnetic stack in a second inner region of the laminated magnetic inductor. The magnetic layers are formed such that a thickness of a magnetic layer in each of the first and third magnetic stacks is less than a thickness of a magnetic layer in the second magnetic stack.

The disclosed technology relates to a power supply circuit that utilizes an integrated power module that has a first and second power converter disposed on opposite sides of an inductor core. The power supply circuit includes an inductor core comprising a plurality of nano-magnetic layers embedded within a printed circuit board, a first winding disposed on a first outer surface of the inductor core, a second winding disposed on a second outer surface of the inductor core, a first active layer disposed on an outer surface of the first winding, a second active layer disposed on an outer surface of the second winding, a first capacitor tile disposed on an outer surface of the first active layer, and a second capacitor tile disposed on an outer surface of the second active layer.

A planar magnetic core includes multiple ferromagnetic layers including multiple hard ferromagnetic bias layers and multiple soft ferromagnetic layers. Each ferromagnetic layer comprises a soft ferromagnetic layer or a hard ferromagnetic bias layer. Each hard ferromagnetic bias layer is a neighboring ferromagnetic layer of at least one soft ferromagnetic layer. The planar magnetic core also includes a plurality of insulating layers, each insulating layer disposed between adjacent ferromagnetic layers. Each ferromagnetic layer has an easy axis of magnetization parallel to a principal plane of the planar magnetic core, where the easy axes of magnetization are aligned. Each hard ferromagnetic bias layer is magnetized to create an in-plane bias magnetic flux through the hard ferromagnetic bias layer in a first direction that is parallel to the easy axis of magnetization and forms a closed path through a neighboring soft ferromagnetic layer in a second direction parallel to the first direction.

Described are microelectronic devices including an embedded microelectronic package for use as an integrated voltage regulator with a microelectronic system. The microelectronic package can include a substrate and a magnetic foil. The substrate can define at least one layer having one or more of electrically conductive elements separated by a dielectric material. The magnetic foil can have ferromagnetic alloy ribbons and can be embedded within the substrate adjacent to the one or more of electrically conductive elements. The magnetic foil can be positioned to interface with and be spaced from the one or more of electrically conductive element.

An inductor includes a wire including a conducting line, and an insulating film disposed on an entire circumferential surface of the conducting line, and a magnetic layer embedding the wire. The magnetic layer contains a magnetic particle. The magnetic layer includes a first layer in contact with the circumferential surface of the wire, a second layer in contact with the surface of the first layer, . . . and the n-th layer (n is a positive number of 3 or more) in contact with the surface of the (n−1)th layer. In the two layers adjacent to each other in the magnetic layer, the relative magnetic permeability of the layer closer to the wire is lower than the relative magnetic permeability of the layer farther from the wire.