Techniques are provided for an inductor at a first level interface between a first die and a second die. In an example, the inductor can include a winding and a core disposed inside the winding. The winding can include first conductive traces of a first die, second conductive traces of a second die, and a plurality of connectors configured to connect the first die with the second die. Each connector of the plurality of connecters can be located between a trace of the first conductive traces and a corresponding trace of the second conductive traces.

An inductor includes a body including a coil and a dummy electrode, spaced apart from the coil, and having a first side surface and a second side surface disposed to oppose each other in a first direction, a top surface and a bottom surface disposed to oppose each other in a second direction, and a first end surface and a second end surface disposed to oppose each other in a third direction, and external electrodes including a first external electrode, disposed on an external surface of the body, extending from the first end surface to a portion of the bottom surface and a second external electrode, disposed on an external surface of the body, extending from the second end surface to a portion of the bottom surface.

Reducing the space occupied by a voltage regulation integrated circuit (IC) that includes an inductor is achieved by implementing the inductor as a 3D inductor having windings formed of conductive elements integrated into a lower substrate, a circuit layer, and an upper substrate, and positioning other components within a core space of the 3D inductor in the circuit layer. The space occupied by the inductor is shared with the other circuit components and with the structural layers of the voltage regulation IC. A voltage regulation IC may be a switched-mode power supply (SMPS) that includes an inductor with a capacitor and/or a switching circuit. The inductor is implemented as upper horizontal traces in an upper substrate, lower horizontal traces in a lower substrate, and vertical interconnects in a circuit layer between the upper substrate and the lower substrate, and the conductive elements form the 3D inductor as a rectangular coil.

An inductive device includes an insulating layer, a lower magnetic layer, and an upper magnetic layer that are formed such that the insulating layer does not separate the lower magnetic layer and the upper magnetic layer at the outer edges or wings of the inductive device. The lower magnetic layer and the upper magnetic layer form a continuous magnetic layer around the insulating layer and the conductors of the inductive device. Magnetic leakage paths are provided by forming openings through the upper magnetic layer. The openings may be formed through the upper magnetic layer by semiconductor processes that have relatively higher precision and accuracy compared to semiconductor processes for forming the insulating layer such as spin coating. This reduces magnetic leakage path variation within the inductive device and from inductive device to inductive device.

Provided are a manufacturing method of an inductor, including forming a first magnetic layer and forming a discontinuous layer of one of a second magnetic layer and a conductive layer on the first magnetic layer, and forming the other in a discontinuous portion of the discontinuous layer, in which a thickness of the second magnetic layer is larger than a thickness of the conductive layer, and the manufacturing method further includes forming a third magnetic layer in a groove portion formed by a difference in thickness between the second magnetic layer and the conductive layer; and a manufacturing method of an electronic component including an inductor, the manufacturing method including producing an inductor by the manufacturing method.

Methods/structures of forming embedded inductor structures are described. Embodiments include forming a first interconnect structure on a dielectric material of a substrate, selectively forming a magnetic material on a surface of the first interconnect structure, forming an opening in the magnetic material, and forming a second interconnect structure in the opening. Build up layers are then formed on the magnetic material.

A coil electronic component includes a support substrate, a coil pattern disposed on at least one surface of the support substrate, and a lead-out pattern disposed on at least one surface of the support substrate and connected to the coil pattern. An encapsulant encapsulates at least portions of the support substrate, the coil pattern, and the lead-out pattern, and at least one protrusion protrudes from one side surface of the coil pattern. External electrodes are disposed externally on the encapsulant and connected to the lead-out pattern. The lead-out pattern is configured to extend in a thickness direction of the support substrate and to cover a side surface of the support substrate.

An electronic component includes a composite body composed of a composite material of a resin and a magnetic metal powder and a metal film disposed on an outer surface of the composite body. The magnetic metal powder contains Fe. The metal film mainly contains Ni and is in contact with the resin and the magnetic metal powder.

Provided is a multilayer coil component in which a position of a boundary between a first portion and a third portion in a second wiring portion located closer to a side surface is located closer to an end surface in a first direction than a position of a boundary between a first portion and a third portion in a second wiring portion located closer to a side surface, and a position of a boundary between a second portion and a third portion in a second wiring portion located closer to the side surface is located closer to an end surface in the first direction than a position of a boundary between a second portion and a third portion in a second wiring portion located closer to the side surface.

A laminated coil component in which the reliability can be improved by suppressing a decrease in the bonding strength between an extended conductor layer and an external electrode. The laminated coil component includes an element body; a coil placed inside the element body and including a plurality of coil conductor layers that are electrically connected; and an external electrode formed on an outer surface of the element body and electrically connected to the coil via an extended conductor layer electrically connected to the coil. The extended conductor layer has an average crystal grain size less than an average crystal grain size of each of the coil conductor layers.