An electronic component with a plurality of coil conductor layers laminated such that a coil conductor having a coil pattern on a surface of an insulation layer is formed on each of the plurality of coil conductor layers. The electronic component includes a laminated body in which a bottom face side extended electrode layer, a primary coil conductor layer including a primary coil conductor, a secondary coil conductor layer including a secondary coil conductor, a tertiary coil conductor layer including a tertiary coil conductor, a parallel primary coil conductor layer including a parallel primary coil conductor, and a top face side extended electrode layer are laminated in this order. The electronic component further includes first through sixth external electrodes on a surface of the laminated body, which are connected to the primary, secondary, tertiary and parallel primary coil conductors.

A method of fabricating an inductor includes (a) forming a ferromagnetic core on a semiconductor substrate, the ferromagnetic core lying in a core plane and (b) fabricating an inductor coil that winds around the ferromagnetic core, the inductor coil configured to generate an inductor magnetic field that passes through the ferromagnetic core in a first direction parallel to the core plane. While forming the ferromagnetic core, the method further includes (1) generating a bias magnetic field that passes through the ferromagnetic core in a second direction that is orthogonal to the first direction, and (2) inducing a magnetic anisotropy in the ferromagnetic core with the bias magnetic field.

An electronic structure may be fabricated comprising an electronic substrate having at least one photo-imageable dielectric layer and an inductor embedded in the electronic substrate, wherein the inductor comprises a magnetic material layer disposed within a via formed in the at least one photo-imageable dielectric layer and an electrically conductive via extending through the magnetic material layer. The electronic structure may further include an integrated circuit device attached to the electronic substrate and the electronic substrate may further be attached to a board, such as a motherboard.

An inductor includes a body in which a plurality of insulating layers on which a plurality of coil patterns are arranged are stacked, and first and second external electrodes disposed on an external surface of the body, wherein the plurality of coil patterns are connected through coil connecting portions and include coil patterns disposed on an outer side and coil patterns disposed on an inner side thereof, a coil pattern disposed on the inner side adjacent to the coil pattern disposed on the outer side includes two coil connecting portions spaced apart from each other and facing each other in a length direction of the body, and a dummy electrode pattern is further disposed in a void portion between two coil connecting portions.

A coil component is capable of reducing specific resistance of a coil and reliably mitigating stress. A coil component includes a base body and a coil disposed in the base body. The base body includes a plurality of magnetic layers laminated in a first direction. The coil includes a plurality of coil wires laminated in the first direction. The coil wires extend along a plane orthogonal to the first direction. Each of the coil wires includes a first coil conductor layer and a second coil conductor layer laminated in the first direction. Specific resistance of the first coil conductor layer is smaller than specific resistance of the second coil conductor layer. Also, in a section orthogonal to an extending direction of each of the coil wires, the second coil conductor layer is adjacent to one side of the first coil conductor layer in the first direction, and a cavity portion is disposed in at least a part between the first coil conductor layer and one of the magnetic layers adjacent to another side of the first coil conductor layer in the first direction.

A coil component includes a body having one surface, and one end surface and the other end surface connected to the one surface and opposing each other; a coil portion including lead-out patterns within the body; slit portions respectively disposed in an edge portion between the one end surface and the one surface of the body and an edge portion between the other end surface and the one surface of the body to expose the lead-out patterns; external electrodes disposed to be spaced apart from each other on the one surface and respectively extending to the slit portions to be connected to the lead-out patterns; and surface insulating layers, respectively disposed on the one end surface and the other end surface of the body. The surface insulating layers include a first insulating thin film including silicon dioxide (SiO.sub.2), and a second insulating thin film including aluminum oxide (Al.sub.2O.sub.3).

A coil component includes a body having a first surface, and a first end surface and a second end surface connected to the first surface and opposing each other in a length direction; a support substrate disposed inside the body; a coil portion comprising a first coil pattern and first and second lead-out patterns, each disposed on a first surface of the support substrate; first and second slit portions, respectively defined on edge portions of the first surface of the body to expose the first and second lead-out patterns; and first and second external electrodes disposed on the first and second slit portions to be connected to the first and second lead-out patterns. At least one of the first and second lead-out patterns has a thickness greater than a thickness of each of the first coil pattern and the first dummy lead-out pattern.

Embodiments disclosed herein include modular transformers that comprise a plurality of interconnected transformer modules. In an embodiment a transformer module comprises a first core, where the first core is conductive, and a second core adjacent to the first core, where the second core is conductive. In an embodiment, the transformer module further comprises a magnetic layer around the first core and the second core. In an embodiment, a first via through the magnetic layer is connected to the first core, and a second via through the magnetic layer is connected to the first core. In an embodiment, a third via through the magnetic layer is connected to the second core, and a fourth via through the magnetic layer is connected to the second core.

An electronic component includes an element body, an external electrode, and a resin film having electrical insulation properties. The element body includes a principal surface and a side surface adjacent to the principal surface. The external electrode includes a first electrode portion disposed on the principal surface and a second electrode portion disposed on the side surface. The resin film is disposed on the principal surface and is in contact with the principal surface. Each of the first electrode portion and the second electrode portion includes a conductive resin layer disposed on the element body. A conductive resin layer included in the first electrode portion is disposed on the resin film and is in contact with the resin film.

A coreless semiconductor package comprises a plurality of horizontal layers of dielectric material. A magnetic inductor is situated at least partly in a first group of the plurality of layers. A plated laser stop is formed to protect the magnetic inductor against subsequent acidic processes. An EMIB is situated above the magnetic inductor within a second group of the plurality of layers. Vias and interconnections are configured within the horizontal layers to connect a die of the EMIB to other circuitry. A first level interconnect is formed on the top side of the package to connect to the interconnections. BGA pockets and BGA pads are formed on the bottom side of the package. In a second embodiment a polymer film is used as additional protection against subsequent acidic processes. The magnetic inductor comprises a plurality of copper traces encapsulated in magnetic material.