An inductor component comprising a spiral wiring wound on a plane; a first magnetic layer and a second magnetic layer located at positions sandwiching the spiral wiring from both sides in a normal direction relative to the plane on which the spiral wiring is wound; a vertical wiring extending from the spiral wiring in the normal direction to pass through the first magnetic layer; and an external terminal disposed on a surface of the first magnetic layer to connect an end surface of the vertical wiring. The first magnetic layer has magnetic permeability lower than that of the second magnetic layer.

A glass-ceramic-ferrite composition containing a glass, a ferrite, and a ceramic filler, in which the glass contains, by weight, about 0.5% to about 5.0% R.sub.2O (R represents at least one selected from the group consisting of Li, Na, and K), about 5.0% or less Al.sub.2O.sub.3, about 10.0% to about 25.0% B.sub.2O.sub.3, and about 70.0% to 85.0% SiO.sub.2 with respect to the total weight of the glass, the percentage by weight of the ferrite is about 10% to 80% with respect to the total weight of the composition, the ceramic filler contains at least forsterite selected from forsterite and quartz, the percentage by weight of the forsterite is about 1% to about 10% with respect to the total weight of the composition, and the percentage by weight of the quartz is about 40% or less with respect to the total weight of the composition.

A chip inductor comprises a laminate including a plurality of sheets stacked therein; a coil disposed in the laminate and including an exposed portion, in which a portion of the coil is exposed outwardly of at least one surface of the laminate; and a non-magnetic insulating layer disposed on an external surface of the laminate to cover the exposed portion of the coil.

Embodiments include an inductor that comprises an inductor trace and a magnetic body surrounding the inductor trace. In an embodiment, the magnetic body comprises a first step surface and a second step surface. Additional embodiments include an inductor that includes a barrier layer. In an embodiment, an inductor trace is formed over a first surface of the barrier layer. Embodiments include a first magnetic body over the inductor trace and the first surface of the barrier layer, and a second magnetic body over a second surface of the barrier layer opposite the first surface. In an embodiment, a width of the second magnetic body is greater than a width of the first magnetic body.

A multilayer-type coil component including an element body including insulating layers laminated in a laminating direction; first and second coils inside the element body and insulated from each other; first and second outer electrodes on a surface of the element body and electrically connected to the first coil; third and fourth outer electrodes on the surface of the element body and electrically connected to the second coil. The laminating direction, and respective directions of coil axes of the first and second coils are parallel to a mount surface of the element body along a same direction. The first and second coils include first and second coil conductors, respectively, laminated in the laminating direction. Each of the first coil conductors has a length smaller than one turn of the first coil. Each of the second coil conductors has a length smaller than one turn of the second coil.

Disclosed herein is a coil component that includes an element body made of a first magnetic material, a coil conductor embedded in the element body, and first and second magnetic films made of a second magnetic material having higher permeability than that of the first magnetic material. The element body has an upper surface crossing a coil axis of the coil conductor and first and second side surfaces extending substantially parallel to the coil axis. The first magnetic film is formed on the upper surface and first side surface of the element body, and the second magnetic film is formed on the upper surface and second side surface of the element body.

A coil component includes a body including a first surface and a plurality of side surfaces respectively connected to the first surface, a substrate disposed in the body, a coil portion disposed in the body, a lead-out portion disposed in the body and connected to the coil portion, and a dummy portion spaced apart from the lead-out portion. The body includes four corners, at each of which two adjacent side surfaces of the first to fourth side surfaces are in contact with each other, and the dummy portion includes first to fourth dummy patterns respectively disposed outside the coil portion and extending toward the four corners of the body.

A common mode choke coil includes a multilayer body obtained by stacking insulating layers, first and second coils inside the multilayer body, and first to fourth outer electrodes on outer surfaces of the multilayer body. The first and second outer electrodes are respectively connected to first and second ends of the first coil. The third and fourth outer electrodes are respectively connected to first and second ends of the second coil. The first coil includes first to third spiral conductors connected to one another through via conductors. The second coil includes fourth to sixth spiral conductors connected to one another through via conductors. The first spiral conductor is adjacent to the second and fourth spiral conductors. The fourth spiral conductor is adjacent to the first and fifth spiral conductors. The distance between the first and fourth spiral conductors is smaller than the distances between other spiral conductors.

An embedded passive chip device includes a chip body and a functional layered structure. The chip body has a circuit-forming surface that is formed with a recess. The functional layered structure is formed on the chip body and includes a conductive layer that has at least a portion which covers at least partially the circuit-forming surface, and a magnetic layer that is disposed within the recess and that is inductively coupled to the conductive layer for generating inductance. A method of making the embedded passive chip device is also disclosed.

According to one aspect of the present disclosed subject matter, a receiver inductively powered by a transmitter for powering a load, the receiver comprising: a resonance circuit capable of tuning its resonance frequency for coupling with the transmitter and generate AC voltage; a power supply section configured to rectify the AC voltage and adjust a DC current and a DC voltage to the load; and a control and communication section designed to set parameters for the receiver and communicate operation points (OP) to the transmitter, wherein the parameters and the OP derived from determining a minimal power loss of the receiver.