In a common mode noise filter, first coil (12) includes first coil conductor (16) and second coil conductor (17) with spiral shapes. Second coil (13) includes third coil conductor (18) and fourth coil conductor (19) with spiral shapes. First coil conductor (16), third coil conductor (18), second coil conductor (17), and fourth coil conductor (19) are placed in this order from above. First metal layer (14) configured to be connected to a ground is provided above first coil conductor (16).

A low-resistance thick-wire integrated inductor may be formed in an integrated circuit (IC) device. The integrated inductor may include an elongated inductor wire defined by a metal layer stack including an upper metal layer, middle metal layer, and lower metal layer. The lower metal layer may be formed in a top copper interconnect layer, the upper metal layer may be formed in an aluminum bond pad layer, and the middle metal layer may comprise a copper tub region formed between the aluminum upper layer and copper lower layer. The wide copper region defining the middle layer of the metal layer stack may be formed concurrently with copper vias of interconnect structures in the IC device, e.g., by filling respective openings using copper electrochemical plating or other bottom-up fill process. The elongated inductor wire may be shaped in a spiral or other symmetrical or non-symmetrical shape.

An electronic component includes an element body including two end surfaces opposite to each other and a bottom surface connected between the two end surfaces. A coil is provided in the element body and an external electrode is provided in the element body. In a first cross-section intersecting with the two end surfaces and the bottom surface of the element body, the external electrode has a first portion extending along a first surface that is one of the end surface and the bottom surface of the element body. The coil is disposed such that an outer circumferential edge of the coil faces the first surface of the element body. A shortest distance between the outer circumferential edge of the coil and the first surface of the element body is smaller than a minimum width of the first portion in a direction orthogonal to the first surface.

A multi-layer spiral inductor winding comprises a plurality of conductive layers, each conductive layer includes a plurality of conductive traces which can be a conductive spiral of at least a fraction of one turn; an additional conductive layer, wherein the additional conductive layer includes a conductive trace, wherein the conductive bridge connects a second terminal electrode of the inductor winding to a conductive trace of the plurality of conductive layers; and wherein a first terminal electrode of the inductor winding belongs to another conductive trace of the plurality of conductive layers; and each distinct conductive trace is electrically connected to each other in order to form a multi-layer spiral inductor winding. The winding may be prepared by adopting a semiconductor process or a PCB process. The winding has the benefits of a high inductance value, a reduced parasitic coupling capacitance, and a high Q-factor.

The present application provides a coil for facilitating an electromagnetic coupling and method for increasing the degree of an electromagnetic coupling. The coil for facilitating an electromagnetic coupling includes one or more loops formed from a material through which an electric current can flow. At least one of the one or more loops is adjustable, including at least one of a size and a shape of the at least one of the one or more loops of the coil being selectively adjustable.

A common-mode choke coil includes a multilayer body, a first coil, and a second coil. The multilayer body includes plural non-conductor layers. The first and second coils are incorporated in the multilayer body. The first coil has a path length L1, the second coil has a path length L2, and the sum of the path length L1 and the path length L2 is less than or equal to 3.30 mm. The first coil has a first coil conductor, and the second coil has a second coil conductor. The first coil conductor and the second coil conductor have a spacing D between each other of greater than or equal to 6 μm and less than or equal to 26 μm (i.e., from 6 μm to 26 μm) in the stacking direction of the non-conductor layers.

An electronic device package includes a package substrate, an interposer located above the package substrate and electrically connected to the package substrate, a processing device located above the interposer and electrically connected to the interposer, at least one high bandwidth memory device located above the interposer and electrically connected to the interposer and the processing device, a power management integrated circuit device located above the interposer and electrically connected to the interposer and the processing device, and a passive device located on or inside the interposer and electrically connected to the power management integrated circuit device.

A stacking inductor device includes a first inductor unit and a second inductor unit disposed above first inductor unit. First inductor unit includes a first and a second wire. First wire is disposed on a first side of first inductor unit. Second wire is disposed on a second side of first inductor unit. A first opening of second wire is disposed on a first side of stacking inductor device. Second inductor unit includes a third and a fourth wire. Third wire is disposed on a first side of second inductor unit, and first side of second inductor unit corresponds to first side of first inductor unit. A second opening of third wire is disposed on a second side of stacking inductor device. Fourth wire is disposed on a second side of second inductor unit, and second side of second inductor unit corresponds to second side of first inductor unit.

A composite inductor structure is provided, which comprises: a first spiral inductor and a second spiral inductor. The first spiral inductor has a plurality of loops and generates a first electromagnetic field, wherein an outermost loop of the first spiral inductor has a first end point, and an innermost loop of the first spiral inductor has a second end point. The second spiral inductor is arranged to be adjacent to the first spiral inductor, and has a plurality of loops and generates a second electromagnetic field, wherein an outermost loop of the second spiral inductor has a third end point, and an innermost loop of the second spiral inductor has a fourth end point, and the second spiral inductor is rotated by a specific degree with respect to an orientation of the first spiral inductor, and the first electromagnetic field and the second electromagnetic field are oppositely directed.

An inductor structure includes a first inductor and a second inductor. The second inductor includes a loop that surrounds the first inductor. The first inductor includes a first loop and a second loop, and a crossover section coupling the first loop to the second loop so as to cause current flowing through the first inductor to circulate around the first loop in a first rotational direction and around the second loop in a second rotational direction opposite to the first rotational direction; wherein the first and second inductors are arranged in an equilibrated configuration about a first axis that bisects the inductor structure such that the first loop is on one side of the first axis and the second loop is on a second side of the first axis, such that the magnetic interaction between the inductors due to current flow in the inductors is cancelled out.