An on-chip inductor structure includes first and second winding portions symmetrically arranged in an insulating layer by a symmetrical axis. Each of the first and second winding portions includes first and second semi-circular conductive lines concentrically arranged from the inside to the outside. First and second input/output conductive portions are disposed in the insulating layer along the extending direction of the symmetrical axis, to respectively and electrically couple the first ends of the outermost semi-circular conductive lines. A conductive branch structure is disposed in the insulating layer along the symmetrical axis and between the first and second input/output conductive portions, and electrically coupled to first ends of the innermost semi-circular conductive lines. The conductive branch structure has a grounded first end and a second end is electrically coupled to a circuit and is opposite the first end of the conductive branch structure.

A microcoil element, an array-type microcoil element and a device are provided. The microcoil element includes a wiring layer having continuous multiple metal line segments that form multiple loops around a starting point of the element. Every metal line segment includes a first electrode end and a second electrode end. The microcoil element includes an electrode layer having a first electrode zone and a second electrode zone that respectively collect the first electrode ends and the second electrode ends of the multiple metal line segments. When designing the microcoil element, parameters such as a total length of the multiple line segments, a line width, a line spacing of adjacent line segments, a length of each line segment, turns of the microcoil, and a loop distance according to impedance requirement. The single microcoil element or the array-type microcoil element can be used as a magnetic component of a device.

A coil component includes: a support substrate; first and second coil portions disposed on the support substrate to be spaced apart from each other; a body surrounding the support substrate and the first and second coil portions; and a plurality of external electrodes disposed on a surface of the body, wherein each of the first and second coil portions includes a coil pattern and a lead pattern connected to the coil pattern and exposed from the surface of the body, and a width of an exposed portion of the lead pattern exposed from the surface of the body is greater than a width of each of the coil pattern and the plurality of external electrodes.

A coil component includes: a support substrate; a coil portion including a coil pattern disposed on the support substrate, lead patterns disposed on both surfaces of the support substrate and connected to the coil pattern, and a connection via penetrating through the support substrate to connect the lead patterns disposed on the both surfaces of the support substrate to each other; and a body covering the support substrate and the coil portion, wherein any one of the lead patterns disposed on the both surfaces of the support substrate has a thickness smaller than that of the coil pattern.

A stacked spiral inductor, comprising: a substrate, and multiple stacked insulating layers and inductive metal layers formed on the substrate by means of a semiconductor process. Each inductive metal layer comprises a conductive coil in a shape of a spiral and a through hole area used for connecting two adjacent inductive metal layers. The conductive coils of the inductive metal layers have a common coil center. In two adjacent inductive metal layers, the conductive coil of the lower inductive metal layer is retracted toward the coil center with respect to the conductive coil of the upper inductive metal layer.

The disclosure provides a coplanar inductor, which includes a first spiral arm, a second spiral arm and a conductive patch. The first spiral arm has a first end and a second end, wherein the first spiral arm spirally extends from the first end of the first spiral arm toward the second end of the first spiral arm from inside to outside. The second spiral arm has a first end and a second end. The second spiral arm extends spirally from the first end of the second spiral arm toward the second end of the second spiral arm from inside to outside. The first end of the second spiral arm is coupled to the first end of the first spiral arm through the conductive patch, and the first spiral arm and the second spiral arm are coplanar.

A low-resistance thick-wire integrated inductor may be formed in an integrated circuit (IC) device. The integrated inductor may include an elongated inductor wire defined by a metal layer stack including an upper metal layer, middle metal layer, and lower metal layer. The lower metal layer may be formed in a top copper interconnect layer, the upper metal layer may be formed in an aluminum bond pad layer, and the middle metal layer may comprise a copper tub region formed between the aluminum upper layer and copper lower layer. The wide copper region defining the middle layer of the metal layer stack may be formed concurrently with copper vias of interconnect structures in the IC device, e.g., by filling respective openings using copper electrochemical plating or other bottom-up fill process. The elongated inductor wire may be shaped in a spiral or other symmetrical or non-symmetrical shape.

A transformer device includes a first coil, a second coil, and a third coil. The first coil includes first segments and at least one first connecting portion, in which the first segments are coupled to each other through the at least one first connecting portion. The second coil includes second segments and second connecting portions, in which the of second segments are coupled to each other through the second connecting portions. The third coil is configured to couple the first coil and the second coil. The third coil includes third segments and third connecting portions, a part of the plurality of third segments are coupled in parallel with each other through the third connecting portions, and at least one part of the first segments and at least one part of the second segments are arranged between the part of the third segments.

An inductor includes a body including a coil and a magnetic portion, and having two facing principal surfaces and side surfaces adjacent to the two principal surfaces. The coil includes a winding portion formed from a conductor and a pair of extended portions extended from the winding portion. The magnetic portion includes magnetic powder and contains the coil. The winding portion includes a first meandering portion and a second meandering portion each including straight portions continuously formed so as to extend substantially circularly from an outer side to an inner side of the body when the winding portion is seen through the principal surfaces of the body from the principal surfaces. The first and second meandering portions are continuously formed on the inner side of the body. The straight portions constituting the first meandering portion and the straight portions constituting the second meandering portion are disposed apart from each other.

A package device comprises a first transceiver comprising a first integrated circuit (IC) die and transmitter circuitry, and a second transceiver comprising a second IC die and receiver circuitry. The receiver circuitry is coupled to the transmitter circuitry via a channel. The package device further comprises an interconnection device connected to the first IC die and the second IC die. The interconnection device comprises a channel connecting the transmitter circuitry with the receiver circuitry, and a passive inductive element disposed external to the first IC die and the second IC die and along the channel.