A device includes (a) an integrated inductor having an inductor wire and (b) a metal interconnect arrangement, both formed in an integrated circuit layer stack of alternating metal layers and via layers. At least a portion of the inductor wire is defined by an inductor element stack including multiple metal layer inductor elements formed in multiple respective metal layers, and multiple via layer inductor elements formed in multiple respective via layers and conductively connected to the metal layer inductor elements. Each via layer inductor element has a length of at least 1 μm in each of two lateral directions orthogonal to each other and perpendicular to the vertical direction. The metal interconnect arrangement includes metal layer interconnect elements formed in the respective metal layers, and interconnect vias formed in the respective via layers.

A coil electronic component includes a body having a multilayer structure formed by stacking a plurality of sheets and external electrodes disposed on outer surfaces of the body. A coil pattern is printed on each of the plurality of sheets. The coil pattern includes a coil body and a corner pattern spaced apart from the coil pattern and coupled to the external electrodes. An inner edge of the second coil pattern facing the coil body is formed as a curved line or a linear line.

Disclosed are a power inductor and a method of manufacturing the same. The power inductor includes a body, a coil pattern provided in the body, an external electrode disposed on at least one surface of the body and extending to at least the other surface of the body, which is adjacent thereto, and a coupling layer provided between the body and an extended area of the external electrode.

A coil component includes a body including a plurality of effective layers stacked in one direction; a coil portion embedded in the body, the coil portion including a plurality of coil patterns respectively disposed in the plurality of effective layers, the coil portion further including a lead-out pattern; and a core penetrating through an interior of the coil portion, wherein the coil portion further includes a resistance reducing portion extending from an outer circumferential surface of each of the coil patterns to an outside of the core in a respective one of the effective layers in a radially outward direction of the coil portion.

The present invention includes a method of a low cost, reliable novel broadband inductor that can be used with a capacitor to form a broadband filter.

The element body includes a main surface, and a side surface located on imaginary planes orthogonal to the main surface. The external electrode includes first, second and third electrode portions. The first electrode portion is exposed at the main surface. The second electrode portion is continuous with the first electrode portion and exposed at the main surface. The second electrode portion is located to extend from the first electrode portion to the imaginary planes when viewed in a direction orthogonal to the main surface. The third electrode portion is continuous with the first electrode portion and is separated from the second electrode portion in the direction orthogonal to the main surface. The third electrode portion includes outer edges coinciding with the imaginary planes when viewed in the direction orthogonal to the main surface. The element body includes a part between the second electrode portion and the third electrode portion.

An integrated magnetic component is disclosed in this application, which includes an integrated magnetic core and a PCB winding, and there are even-number layers of PCB windings. The integrated magnetic core includes M magnetic pillars that are symmetrically distributed, and every two of the M magnetic pillars form one group. On each layer of PCB winding, a current path is divided into M paths around the M magnetic pillars; after every two of the M current paths are combined, a current obtained through combination flows around one magnetic pillar in each group of magnetic pillars by N turns, and flows around the other magnetic pillar in each group of magnetic pillars by N turns.

A semiconductor device includes a semiconductor substrate, an interconnection layer and an inductor pattern. The interconnection layer is disposed on the semiconductor substrate. The inductor pattern is electrically connected to the interconnection layer. The inductor pattern includes a first conductive line joined with a first terminal, a second conductive line joined with a second terminal, and a plurality of conductive coils. The conductive coils are joining the first conductive line to the second conductive line, and includes an outer coil joined with the first conductive line, an inner coil joined with the second conductive line and the outer coil. The second conductive line is spaced apart from a first side of the inner coil in a first direction by distance Y, the second terminal is spaced apart from a second side of the inner coil in a second direction by distance X1, wherein X1>1.25Y.

Disclosed is apparatus including a vertical spiral inductor. The vertical spiral inductor may include a plurality of dielectric layers formed on a substrate, a plurality of conductive layers, each of the plurality of conductive layers disposed on each of the plurality of dielectric layers, a plurality of insulating layers, each of the plurality of insulating layers disposed on each of the plurality of conductive layers, wherein each of the plurality of insulating layers separates each of the plurality of dielectric layers. A first spiral coil is arranged in a first plane perpendicular to the substrate, where the first spiral coil is formed of first portions of the plurality of conductive layers and a first set of vias of a plurality of vias, configured to connect the first portions of the plurality of conductive layers.

An 8-shaped inductive coil device that includes a first and a second spiral coils and a connection segment structure is provided. The first spiral coil includes first metal segments and crossing connection segments disposed at a first and a second metal layers respectively and includes first connection terminals. The second spiral coil includes second connection terminals. The connection segment structure electrically couples the first and the second connection terminals. The first and the second spiral coils are disposed along an imaginary line passing through a central region of each of ranges surrounded by the first and the second spiral coils. The connection segment structure and the crossing connection segments electrically couple the part of the first metal segments substantially vertical to the imaginary line, and the connection segment structure and the crossing connection segments are disposed substantially on the imaginary line.