A complex electronic component includes a body including a first external electrode and a second external electrode, disposed on an external surface thereof and a laminate; a plurality of first electrodes and a plurality of second electrodes, disposed in the laminate and electrically connected to the first external electrode and the second external electrode, respectively; a third electrode and a fourth electrode, disposed on the laminate to be spaced apart from each other and electrically connected to the first external electrode and the second external electrode, respectively; and an ESD discharge layer disposed between the third electrode and the fourth electrode. In addition, a distance between the third electrode and the fourth electrode is within a range of 30 m to 60 m.

A coil electronic component includes a body having a first surface and a second surface opposing each other and a third and a fourth surface opposing each other, an insulating substrate disposed inside the body, first and second coil portions respectively disposed on opposing surfaces of the insulating substrate, a first lead-out portion connected the first coil portion and exposed from the first and third surfaces, a second lead-out portion connected to the second coil portion and exposed from the second and third surfaces, and first and second external electrodes respectively covering the first and second lead-out portions. The insulating substrate includes a support portion supporting the first and second coil portions, a first tip exposed from the first and third surfaces and supporting the first lead-out portion, and a second tip exposed from the second and third surfaces and supporting the second lead-out portion.

The present disclosure is intended to reduce connection resistance between a shield film and a ground electrode, and to improve characteristics of the shield film. A high frequency component 1a includes a ceramic substrate 2, a ground electrode 3a disposed inside the ceramic substrate 2, a shield film 4 covering an upper surface 2a and lateral surfaces 2c of the ceramic substrate 2, and connecting portions 6a connecting the ground electrode 3a and the shield film 4, wherein the ground electrode 3a is formed using a conductive paste that contains a metal ingredient, powder, and a material constituting the ceramic substrate 2, and a weight rate of a metal ingredient in the connecting portions 6a is higher than that of the metal ingredient in the ground electrode 3a.

Disclosed microelectronic assemblies employ an integrated interposer cage to reduce electromagnetic interference with (and from) high-frequency components. One illustrative embodiment includes: at least one IC die having drive cores for a plurality of oscillators, the IC die attached in a flip-chip configuration to a (interposer) substrate, the substrate having: multiple inductors electrically coupled to said drive cores and each enclosed within a corresponding conductive cage integrated into the substrate to reduce mutual coupling between the inductors and noise coupled through substrate. An illustrative interposer embodiment includes: upper contacts arranged to electrically connect with micro bumps on at least one IC die; metallization and dielectric layers that form multiple inductors each surrounded by bars of a conductive cage; lower contacts arranged to electrically connect with bumps on a package substrate; and a substrate with a plurality of TSVs (through-silicon vias) that electrically couple to the lower contacts. Each of the bars includes: at least one of said TSVs, at least one via through the metallization and dielectric layers, and at least one upper contact.

An inductor having an excellent Q values is provided with a configuration in which an inductor and a capacitor are integrally formed in a single element. Specifically, an LC device is provided that includes an element, an inductor, a capacitor, and a magnetic body portion. The element has a planar shape, and includes an insulating resin layer at at least part of the element. The inductor includes a loop-shaped conductor pattern and is formed inside the element. The capacitor is a mounting-type element, and is disposed in an opening of the loop-shaped conductor pattern and inside the element with at least a mounting surface of the capacitor being in contact with the resin layer. The magnetic body portion forms part of the element and is disposed between the conductor pattern and the capacitor over substantially an entire length of the loop-shaped conductor pattern.

An integrated circuit structure includes a substrate, an integrated inductor, multiple components, multiple metal interconnections, a first shielding structure, and a second shielding structure. The integrated inductor is substantially formed in a first layer of the integrated circuit structure. The metal interconnections are coupled to the integrated inductor and the components. The first shielding structure is formed between the first layer and the substrate and is substantially beneath the integrated inductor. The second shielding structure is formed between the first layer and the substrate, has substantially the same distribution as the metal interconnections, and is substantially beneath the metal interconnections. The first shielding structure and the second shielding structure are equipotential.

An inductor structure is provided. The inductor structure includes a substrate, a first dielectric layer formed on the substrate, a first metal layer formed in the first dielectric layer, a second dielectric layer formed on the first dielectric layer, a second metal layer formed in the second dielectric layer, at least one intermediate dielectric layer formed between the first and second dielectric layers, at least one intermediate metal layer formed in the intermediate dielectric layer, and a plurality of vias connected to the first metal layer and the intermediate metal layer. The vias are connected to the second metal layer and the intermediate metal layer. The first metal layer, the vias, the intermediate metal layer, and the second metal layer form an extension path which extends in a spiral mode.

One object is to provide a new type of coil element capable of reducing leakage magnetic flux. A coil element according to one embodiment of the present invention is provided with an insulator body made of a magnetic material and having a mounting surface and an upper surface opposed to said mounting surface, a coil conductor embedded in the insulator body, an external electrode electrically connected to the coil conductor, a shield layer provided on the upper surface of the insulator body and having a larger magnetic permeability than the insulator body, and a plating layer formed to cover the mounting surface of the external electrode and having a larger magnetic permeability than the insulator body. The plating layer is formed to be thicker than the shield layer.

Embodiments described herein provide circuitry employing an inductor having enhanced circuit area usage. The circuitry includes an inductor having a first loop and a second loop adjoining the first loop to form a figure-eight configuration. The circuitry further includes a circuit component disposed at least partially inside an area defined by at least one of the first loop and the second loop. The inductor has an intersection portion between the first loop and the second loop. An input node is located proximate to the intersection portion, the input node having a first extension disposed inside the first loop. An output node is located proximate to the intersection portion. The output node has a second extension disposed inside the second loop. At least a first capacitor is coupled to the input node and the second extension, and at least a second capacitor coupled to the output node and the first extension.

The present disclosure discloses an inductive device having electromagnetic radiation shielding mechanism. The inductive device includes an inductive unit and a shielding structure. The shielding structure forms at least one closed shape that encloses the inductive unit. The shielding structure has a width thereof and a distance separated from the inductive unit such that a decreasing amount of a quality factor of the inductive unit is not larger than a first predetermined value and a shielded amount of electromagnetic radiation is not lower than a second predetermined value.